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49 条记录 (耗时 0.03 秒)

    System and method for one-time programmed memory through direct-tunneling oxide breakdown
    23.
    发明授权
    System and method for one-time programmed memory through direct-tunneling oxide breakdown 失效
    通过直接隧道氧化物分解的一次编程存储器的系统和方法

    公开(公告)号：US06960819B2

    公开(公告)日：2005-11-01

    申请号：US09739752

    申请日：2000-12-20

    申请人： Vincent Chen ,  Henry Chen ,  Liming Tsau ,  Jay Shiau ,  Surya Battacharya ,  Akira Ito

    发明人： Vincent Chen ,  Henry Chen ,  Liming Tsau ,  Jay Shiau ,  Surya Battacharya ,  Akira Ito

    IPC分类号： G11C17/00 ,  G11C17/18 ,  H01L27/112 ,  H01L29/00

    CPC分类号： G11C17/18 ,  H01L27/112 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A one-time programming memory element, capable of being manufactured in a 0.13 μm or below CMOS technology, having a capacitor, or transistor configured as a capacitor, with an oxide layer capable of passing direct gate tunneling current, and a switch having a voltage tolerance higher than that of the capacitor/transistor, wherein the capacitor/transistor is one-time programmable as an anti-fuse by application of a voltage across the oxide layer via the switch to cause direct gate tunneling current to thereby rupture the oxide layer to form a conductive path having resistance of approximately hundreds of ohms or less.

    摘要翻译： 一种能够以0.13μm或更低的CMOS技术制造的一次性编程存储器元件，具有可以通过直接栅极隧穿电流的氧化物层的电容器或被配置为电容器的晶体管，以及具有电压 容差高于电容/晶体管，其中电容器/晶体管通过经由开关施加跨越氧化物层的电压而被一次性地编程为反熔丝，以引起直接栅极隧穿电流从而将氧化物层破裂成 形成具有大约几百欧姆或更小的电阻的导电路径。

    Method for CMP removal rate compensation
    24.
    发明申请
    Method for CMP removal rate compensation 有权
    CMP去除率补偿方法

    公开(公告)号：US20050124165A1

    公开(公告)日：2005-06-09

    申请号：US10731261

    申请日：2003-12-05

    申请人： Yen Chuang ,  Vincent Chen

    发明人： Yen Chuang ,  Vincent Chen

    IPC分类号： B24B37/04 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/768 ,  H01L21/302 ,  H01L21/461

    CPC分类号： B24B37/042 ,  H01L21/31053 ,  H01L21/3212 ,  H01L21/7684

    摘要： A method for polishing a material layer on a semiconductor wafer to a desired target layer thickness. The method includes calculating a compensated removal rate based on the thickness of material to be removed from a material layer on the wafer according to a standard value; the current material removal rate of the CMP apparatus; and the offset thickness, which equals the difference between the thickness of the material layer which would be attained using the current material removal rate and the target thickness for the material layer. The calculated compensated removal rate is then programmed into the controller for the CMP apparatus, which polishes the material layer at the calculated compensated removal rate to achieve the desired target layer thickness for the layer.

    摘要翻译： 一种用于将半导体晶片上的材料层研磨到所需目标层厚度的方法。 该方法包括根据标准值计算基于待从晶片上的材料层去除的材料的厚度的补偿去除速率; CMP装置的当前材料去除速率; 和偏移厚度，其等于使用当前材料去除速率获得的材料层的厚度与材料层的目标厚度之间的差。 然后将计算的补偿去除率编程到用于CMP设备的控制器中，CMP设备以计算的补偿去除速率抛光材料层，以实现该层的期望目标层厚度。

    Filter connector
    26.
    发明授权
    Filter connector 失效
    过滤器连接器

    公开(公告)号：US5145412A

    公开(公告)日：1992-09-08

    申请号：US779538

    申请日：1991-10-18

    申请人： Haw-Chan Tan ,  Nobbert Yu ,  Yuan-Chieh Lin ,  Vincent Chen

    发明人： Haw-Chan Tan ,  Nobbert Yu ,  Yuan-Chieh Lin ,  Vincent Chen

    IPC分类号： H01R13/7195 ,  H01R24/42 ,  H01R24/52

    CPC分类号： H01R13/7195 ,  H01R24/42 ,  H01R24/52 ,  H01R2103/00 ,  Y10S439/939

    摘要： A housing has a hollow portion to receive a ferrule, and a support member is positioned between the housing and the ferrule. A plurality of electrical elements are selectively positioned within the housing in electrically conductive contact with the support member. A detachable shell is closely positioned on the housing in circumscribing relation with the support member and in electrically conductive relation with the electrical elements to completely shield and enclose the electrical elements. Removing the electrical elements, the rest parts of the assembly is deemed as a semi-finished product and can be stored as inventory for a later time use according to the customer's requirements.

    摘要翻译： 壳体具有用于容纳套圈的中空部分，并且支撑构件定位在壳体和套圈之间。 多个电气元件选择性地定位在壳体内与支撑构件导电接触。 可拆卸的壳体以与支撑构件的外接关系紧密地定位在壳体上并且与电气元件的导电关系紧密地定位在壳体上，以完全屏蔽和包围电气元件。 拆卸电气元件后，组件的其余部分被视为半成品，可根据客户的要求储存，以备将来使用。

    METHOD FOR MANUFACTURING LOUDSPEAKER HAVING WIRE DAMPER WITH LOCALLY ADJUSTABLE ELASTICITY
    27.
    发明公开
    METHOD FOR MANUFACTURING LOUDSPEAKER HAVING WIRE DAMPER WITH LOCALLY ADJUSTABLE ELASTICITY 审中-公开

    公开(公告)号：US20230164505A1

    公开(公告)日：2023-05-25

    申请号：US18095152

    申请日：2023-01-10

    申请人： Vincent Chen

    发明人： Vincent Chen

    IPC分类号： H04R31/00 ,  H04R9/04 ,  H04R9/06 ,  H04R1/06

    CPC分类号： H04R31/006 ,  H04R9/043 ,  H04R9/06 ,  H04R1/06 ,  H04R9/025

    摘要： A method for manufacturing a loudspeaker having a wire damper with locally adjustable elasticity, including preparation, impregnating, drying, wire disposing, forming, cutting and assembling steps. Wherein, a wire damper including a main body and a wire is thermoformed on a base material. The main body includes a wave structure and a wire disposing area. The wave structure includes wave crest and trough, and inner and outer sidewalls. The wire disposing area forms a hollow portion in which the wire extends. The warp yarns at outside and inside of the wire disposing area form an elastic adjustment area. The hollow portion has smaller depths at the inner and outer sidewalls than at the wave crests and troughs. Thereby, the wire will not be damaged by hot pressing, and the hardness, elasticity and toughness of the combination of the wire disposing area and the wire are equal to that of other areas.

    Base Material for Preparing Finger Protection Structure and Finger Protection Structure for a Protection Hand Glove
    28.
    发明申请
    Base Material for Preparing Finger Protection Structure and Finger Protection Structure for a Protection Hand Glove 有权

    公开(公告)号：US20210038967A1

    公开(公告)日：2021-02-11

    申请号：US16949369

    申请日：2020-10-27

    申请人： Vincent Chen

    发明人： Vincent Chen ,  Andy Lung

    IPC分类号： A63B71/14

    摘要： Disclosed is a base material for preparing a finger protection structure, including a main body and abutment blocks. Four corners of each abutment block form four corner cut portions, two corner cut portions of two adjacent abutment blocks together form two first gaps, and areas of the main body exposed to the first gaps are defined as elastic deformation areas. A finger protection structure is cut out of the main body along two elastic deformation areas and one second gap. The finger protection structure includes a base plate and the abutment blocks. Areas of the base plate exposed to the first gaps are defined as elastic deformation areas. When a stressed surface is impacted by a frontal impact force, the abutment blocks abut against each other and the base plate straightens. When the stressed surface is impacted by a lateral rotation force, the elastic deformation areas are elastically deformed.

    Protective Glove for Athletes
    29.
    发明申请
    Protective Glove for Athletes 审中-公开

    公开(公告)号：US20200214374A1

    公开(公告)日：2020-07-09

    申请号：US16821137

    申请日：2020-03-17

    申请人： Vincent Chen

    发明人： Vincent Chen ,  Andy Lung

    IPC分类号： A41D19/015

    摘要： A protective glove for athletes includes a glove body and a protective layer structure. The glove body includes a palm portion and a plurality of finger portions. Each of the finger portions has an elasticity constrained portion provided at a front end thereof The glove body has an inner side defined as a palm side and an outer side opposite to the inner side defined as a back side. The protective layer structure has one side surface disposed on the inner side of the glove body and the other side surface provided with an anti-slip buffer layer. The protective layer structure is adhesively disposed on the palm portion and the plurality of finger portions, and the protective layer structure is sewed and fixed along an edge portion of the protective layer structure with a sewing thread, such that the palm side is defined as a buffer protective surface.

    Device and method for indirect electronic condition control in biomolecule detection platforms
    30.
    发明授权
    Device and method for indirect electronic condition control in biomolecule detection platforms 有权
    生物分子检测平台间接电子状态控制的装置和方法

    公开(公告)号：US09063138B2

    公开(公告)日：2015-06-23

    申请号：US13348727

    申请日：2012-01-12

    申请人： Michael Chen ,  Vincent Chen ,  Sam Kavusi ,  Christoph Lang

    发明人： Michael Chen ,  Vincent Chen ,  Sam Kavusi ,  Christoph Lang

    IPC分类号： G01N33/53 ,  G01N33/543 ,  C08F20/56

    CPC分类号： G01N33/54393 ,  C08F20/56 ,  G01N33/5306 ,  Y10T436/11 ,  Y10T436/115831

    摘要： A system and method of indirectly modifying an environmental condition at a test site in one embodiment includes providing a test site on a substrate, providing a hydrogel composition loaded with a chemical factor at the test site, providing an actuator configured to activate the hydrogel composition to release a chemical factor at the test site, controlling the actuator to activate the hydrogel composition to release a chemical factor at the test site, and modifying the local chemical environment at the test site with the chemical factor.

    摘要翻译： 在一个实施方案中间接改变测试部位的环境条件的系统和方法包括在基底上提供测试部位，在测试部位提供装载有化学因子的水凝胶组合物，提供构造成将水凝胶组合物活化的致动器 在试验现场释放化学因子，控制致动器激活水凝胶组合物以释放在试验部位的化学因子，并用化学因子改变试验部位的局部化学环境。