Thin film transistor substrate and manufacturing method thereof
    24.
    发明授权
    Thin film transistor substrate and manufacturing method thereof 有权
    薄膜晶体管基板及其制造方法

    公开(公告)号:US08450129B2

    公开(公告)日:2013-05-28

    申请号:US13231225

    申请日:2011-09-13

    IPC分类号: H01L33/16

    摘要: A thin film transistor (TFT) substrate is provided in which a sufficiently large contact area between conductive materials is provided in a contact portion and a method of fabricating the TFT substrate. The TFT substrate includes a gate interconnection line formed on an insulating substrate, a gate insulating layer covering the gate interconnection line, a semiconductor layer arranged on the gate insulating layer, a data interconnection line including a data line, a source electrode and a drain electrode formed on the semiconductor layer, a first passivation layer formed on the data interconnection line and exposing the drain electrode, a second passivation layer formed on the first passivation film and a pixel electrode electrically connected to the drain electrode. An outer sidewall of the second passivation layer is positioned inside an outer sidewall of the first passivation layer.

    摘要翻译: 提供一种薄膜晶体管(TFT)基板,其中在接触部分中提供导电材料之间的足够大的接触面积以及制造TFT基板的方法。 TFT基板包括形成在绝缘基板上的栅极互连线,覆盖栅极互连线的栅极绝缘层,布置在栅极绝缘层上的半导体层,包括数据线,源极和漏极的数据互连线 形成在所述半导体层上,形成在所述数据互连线上并暴露所述漏电极的第一钝化层,形成在所述第一钝化膜上的第二钝化层和与所述漏电极电连接的像素电极。 第二钝化层的外侧壁位于第一钝化层的外侧壁的内侧。