Abstract:
Provided is an apparatus for manufacturing a flexible integrated substrate. The apparatus for manufacturing the flexible integrated substrate includes a substrate transfer unit configured to transfer a substrate which a functional film is disposed on one surface thereof, a unwinding unit configured to unwind a flexible support film wound in a roll shape, a winding unit configured to wind the support film provided from the unwinding unit in the roll shape, and a pressing unit configured to press the support film being transferred from the unwinding unit to the winding unit to the substrate being transferred to attach the functional film to the support film.
Abstract:
Provided are a random wrinkle structure-formable compound, a composition including the same, a film including a random wrinkle structure, a method of forming the film, and an organic light emitting device including the film. A compound according to the present invention is coated and then, a film having a surface structure of random wrinkles may be simply formed through simple ultraviolet (UV) curing or thermosetting. When the film thus formed is used in an organic light emitting device, light generated from the organic light emitting device is scattered on surfaces of the random wrinkles to prevent light guide or total reflection, and thus, light is extracted to the outside. That is, a random structure disposed at the outside of the device performs a light extraction function and consequently, light efficiency of the organic light emitting device may be increased.
Abstract:
Provided is an organic light emitting diode including a substrate, a light scattering structure including nano-structures on the substrate, a thin film on the nano-structures, and an air gap between the nano-structures, a planarizing layer covering the thin film and thicker than the thin film, a first electrode on the planarizing layer, an organic emission layer on the first electrode, and a second electrode on the organic emission layer.
Abstract:
Provided is an organic light-emitting diode (OLED) including: a substrate; a wide viewing-angle homogenization layer on the substrate; a first electrode layer on the wide viewing-angle homogenization layer; a hole transport layer on the first electrode layer; an organic emission layer disposed on the hole transport layer to emit a light; an electron transport layer on the organic emission layer; and a second electrode layer on the electron transport layer.
Abstract:
Provided is a method of fabricating a light functional substrate. The method includes applying particles onto a surface of water contained in a container to form a monolayer constituted by the particles, immersing a substrate into the container, drawing the substrate out of the container to form patterns constituted by the particles on the substrate in a first direction, and forming a planarization film covering the patterns on the substrate.
Abstract:
Provided are an organic light emitting diode and a method of fabricating the same. The organic light emitting diode may include a light-scattering layer, a first electrode, an organic light-emitting layer, and a second electrode, which are sequentially stacked on a substrate, wherein the light-scattering layer may include uneven shaped nanostructures having irregular width and spacing. The method of fabricating the organic light emitting diode may include sequentially stacking a light-scattering medium layer and a metal alloy layer on a substrate, heat treating the metal alloy layer to form etching mask patterns, etching the light-scattering medium layer by using the etching mask patterns to form a light-scattering layer, removing the etching mask patterns, and forming a planarizing layer on the light-scattering layer.
Abstract:
A method of manufacturing an organic-light-emitting-diode (OLED) flat-panel light-source apparatus. The method includes depositing a metal layer on a substrate and patterning the metal layer to form a plurality of subsidiary electrodes, forming an insulating layer on the substrate including the plurality of subsidiary electrodes and forming a first subsidiary electrode layer by etching the insulating layer until some of the plurality of subsidiary electrodes are exposed, and sequentially forming an anode, an organic emission layer (EML), and a cathode on the substrate on which the first subsidiary electrode layer is formed.