MANUFACTURING METHOD AND APPLICATION OF OPTICAL INTERCONNECTION MODULE

    公开(公告)号:US20220317395A1

    公开(公告)日:2022-10-06

    申请号:US17575981

    申请日:2022-01-14

    Abstract: A manufacturing method and application of an optical interconnection module are disclosed. According to example embodiments, by providing the method of manufacturing the optical interconnection module in which an optical fiber optical coupler is disposed at its lower portion by using the FOWLP process, it is possible to provide advantages such as lightness, thinness and compactness of the optical interconnection module, guarantee of signal integrity, and high yield in mass production. Further, it is possible to provide a structure providing an electrical ground to an electronic chip by mounting the electronic chip on ETB and capable of being used as a heat dissipation path.

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