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    Biasing assembly for a latching mechanism
    21.
    发明授权
    Biasing assembly for a latching mechanism 有权
    用于锁定机构的偏置组件

    公开(公告)号：US09354407B2

    公开(公告)日：2016-05-31

    申请号：US13963900

    申请日：2013-08-09

    Applicant: FINISAR CORPORATION

    Inventor： Tat Ming Teo ,  Chris K. Togami ,  Frank J. Flens

    IPC: G02B6/42

    CPC classification number: G02B6/4261 ,  G02B6/4204 ,  G02B6/4249 ,  G02B6/4278 ,  G02B6/428 ,  G02B6/4284 ,  H01R13/62933 ,  Y10T29/49863

    Abstract: An example embodiment includes a communication module. The communication module includes a shell, a printed circuit board assembly (“PCBA”) at least partially positioned within the shell, an optical transmitter electrically coupled to the PCBA, an optical receiver electrically coupled to the PCBA, and a biasing assembly. The biasing assembly includes a latch cover configured to be attached to the shell, a slider, and a spring. The slider is configured to operate a latching mechanism that releasably connects the module to a host device through a mechanical connection. The slider includes a main body including a first end, an arm extending from the first end, and a stopper feature extending from the arm. The spring is positioned between the latch cover and the stopper feature to bias the latching mechanism.

    Abstract translation: 示例性实施例包括通信模块。 通信模块包括壳体，至少部分地定位在壳体内的印刷电路板组件（“PCBA”），电耦合到PCBA的光学发射器，电耦合到PCBA的光学接收器以及偏置组件。 偏压组件包括构造成连接到壳体上的闩锁盖，滑块和弹簧。 该滑块构造成操作一个通过机械连接将模块可释放地连接到主机设备的闭锁机构。 滑块包括主体，其包括第一端，从第一端延伸的臂以及从臂延伸的止动件。 弹簧定位在闩锁盖和止动器特征之间以偏压闩锁机构。

    Optical component arrays in optical connectors
    22.
    发明授权
    Optical component arrays in optical connectors 有权
    光学连接器中的光学元件阵列

    公开(公告)号：US09140866B2

    公开(公告)日：2015-09-22

    申请号：US14095820

    申请日：2013-12-03

    Applicant: FINISAR CORPORATION

    Inventor： David Lee ,  Daniel Kossowski ,  Frank J. Flens ,  William H. Wang ,  Michael Joseph McReynolds, Jr.

    IPC: G02B6/42 ,  G02B6/12 ,  G02B6/43 ,  H01R13/6471

    CPC classification number: H01R13/6585 ,  G02B6/12004 ,  G02B6/4206 ,  G02B6/4214 ,  G02B6/4269 ,  G02B6/4284 ,  G02B6/43 ,  H01R13/6471

    Abstract: An example embodiment includes an optical connector. The optical connector includes a printed circuit board (PCB), multiple optical components, multiple optical fibers, and a lens assembly. The optical components are mounted to the PCB. Additionally, each of the optical components includes an aperture. The lens assembly is positioned on the PCB. The lens assembly defines a cavity in which the optical components are positioned. Additionally, the lens assembly defines optical fiber seats that are configured to receive the optical fibers. The lens assembly includes an angled surface that is configured to reflect optical signals between the optical components and the optical fibers.

    Abstract translation: 示例实施例包括光连接器。 光连接器包括印刷电路板（PCB），多个光学部件，多个光纤和透镜组件。 光学元件安装在PCB上。 另外，每个光学部件包括孔。 镜头组件位于PCB上。 透镜组件限定了光学部件定位在其中的空腔。 另外，透镜组件限定配置成接收光纤的光纤座。 透镜组件包括成角度的表面，其被配置为反射光学部件和光纤之间的光信号。

    Thermal management structures for optoelectronic modules
    25.
    发明授权
    Thermal management structures for optoelectronic modules 有权

    公开(公告)号：US10582611B2

    公开(公告)日：2020-03-03

    申请号：US15729603

    申请日：2017-10-10

    Applicant: FINISAR CORPORATION

    Inventor： Cindy H. Hsieh ,  Frank J. Flens ,  Ziv Lipkin

    IPC: H05K1/02 ,  G02B6/42 ,  G02B7/02 ,  H05K7/20

    Abstract: An example embodiment includes optoelectronic module. The optoelectronic module may include a lens assembly, a module board, heat-generating components, and a thermally conductive plate. The lens assembly may be secured to the module board. The module board may include a printed circuit board (PCB). The heat-generating components may be mounted to the PCB. The thermally conductive plate may be secured to a surface of the module board. The thermally conductive plate may define an opening that receives at least a portion of the lens assembly. The thermally conductive plate may be configured to absorb at least a portion of thermal energy generated during operation of the heat-generating components and to transfer the thermal energy away from the heat-generating components.

    Component alignment
    26.
    发明授权
    Component alignment 有权

    公开(公告)号：US10551578B2

    公开(公告)日：2020-02-04

    申请号：US15860617

    申请日：2018-01-02

    Applicant: FINISAR CORPORATION

    Inventor： Darin James Douma ,  Frank J. Flens

    IPC: G02B6/36 ,  G02B6/42

    Abstract: A system may include a substrate and a lens component. The substrate may include pads and solder protuberances. Each solder protuberance may be located on a pad. The lens component may define grooves sized to receive at least a portion of the solder protuberances. The lens component may be positioned relative to the substrate such that at least a portion of each solder protuberance is positioned within the grooves.

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