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    SPARING CONFIGURATIONS AND PROTOCOLS FOR PARALLEL FIBER OPTICS
    3.
    发明申请
    SPARING CONFIGURATIONS AND PROTOCOLS FOR PARALLEL FIBER OPTICS 有权
    用于并行光纤的SPARING配置和协议

    公开(公告)号：US20160285557A1

    公开(公告)日：2016-09-29

    申请号：US15074798

    申请日：2016-03-18

    Applicant: FINISAR CORPORATION

    Inventor： Frank J. Flens

    IPC: H04B10/40 ,  H04B10/25 ,  H04B10/27 ,  H04B10/50 ,  H04B10/66

    CPC classification number: H04B10/032 ,  H04B10/40 ,  H04J14/0297

    Abstract: A transceiver can include a transmitter and a receiver. The transmitter can include: a primary laser emitter; a primary monitor photodiode optically coupled with the laser emitter; a spare laser emitter; and a transmitter integrated circuit having a primary channel operably coupled with the primary laser emitter; a spare channel operably coupled with the spare laser emitter; a switch on the primary channel; and a secondary channel operably coupled with the switch and the spare channel The receiver can include: a primary detector photodiode; a spare detector photodiode; and a receiver integrated circuit a primary receiver channel operably coupled with the at least one primary detector photodiode; a spare receiver channel operably coupled with the spare detector photodiode; a receiver switch on the spare receiver channel; and a secondary receiver channel operably coupled with the receiver switch and the primary receiver channel.

    Abstract translation: 收发机可以包括发射机和接收机。 发射机可以包括：主激光发射器; 与激光发射器光学耦合的主监视器光电二极管; 备用激光发射器; 以及发射器集成电路，其具有与所述主激光发射器可操作地耦合的主通道; 与备用激光发射器可操作地耦合的备用通道; 主通道上的开关; 以及与开关和备用通道可操作地耦合的次级通道。接收器可以包括：主检测器光电二极管; 备用检测光电二极管; 以及接收器集成电路，与所述至少一个主检测器光电二极管可操作地耦合的主接收器通道; 与备用检测器光电二极管可操作地耦合的备用接收器通道; 备用接收机通道上的接收器开关; 以及与接收器开关和主接收器通道可操作地耦合的次级接收器通道。

    BIASING ASSEMBLY FOR A LATCHING MECHANISM
    5.
    发明申请
    BIASING ASSEMBLY FOR A LATCHING MECHANISM 有权
    用于锁定机构的偏心装置

    公开(公告)号：US20140044398A1

    公开(公告)日：2014-02-13

    申请号：US13963900

    申请日：2013-08-09

    Applicant: FINISAR CORPORATION

    Inventor： Tat Ming Tao ,  Chris K. Togami ,  Frank J. Flens

    IPC: G02B6/42

    CPC classification number: G02B6/4261 ,  G02B6/4204 ,  G02B6/4249 ,  G02B6/4278 ,  G02B6/428 ,  G02B6/4284 ,  H01R13/62933 ,  Y10T29/49863

    Abstract: An example embodiment includes a communication module. The communication module includes a shell, a printed circuit board assembly (“PCBA”) at least partially positioned within the shell, an optical transmitter electrically coupled to the PCBA, an optical receiver electrically coupled to the PCBA, and a biasing assembly. The biasing assembly includes a latch cover configured to be attached to the shell, a slider, and a spring. The slider is configured to operate a latching mechanism that releasably connects the module to a host device through a mechanical connection. The slider includes a main body including a first end, an arm extending from the first end, and a stopper feature extending from the arm. The spring is positioned between the latch cover and the stopper feature to bias the latching mechanism.

    Abstract translation: 示例性实施例包括通信模块。 通信模块包括壳体，至少部分地定位在壳体内的印刷电路板组件（“PCBA”），电耦合到PCBA的光学发射器，电耦合到PCBA的光学接收器以及偏置组件。 偏压组件包括构造成连接到壳体上的闩锁盖，滑块和弹簧。 该滑块构造成操作一个通过机械连接将模块可释放地连接到主机设备的闭锁机构。 滑块包括主体，其包括第一端，从第一端延伸的臂以及从臂延伸的止动件。 弹簧定位在闩锁盖和止动器特征之间以偏压闩锁机构。

    Sparing configurations and protocols for parallel fiber optics
    6.
    发明授权
    Sparing configurations and protocols for parallel fiber optics 有权

    公开(公告)号：US10784956B2

    公开(公告)日：2020-09-22

    申请号：US16450030

    申请日：2019-06-24

    Applicant: FINISAR CORPORATION

    Inventor： Frank J. Flens

    IPC: H04B10/032 ,  H04J14/02 ,  H04B10/40 ,  G02B6/42 ,  H04B10/50

    Abstract: A transmitter can include: at least one primary laser emitter configured to emit primary laser light; at least one primary monitor photodiode optically coupled with the at least one primary laser emitter; and at least one spare laser emitter configured to emit spare laser light. Each spare laser emitter can be adjacent with a corresponding primary laser emitter such that a first primary laser emitter and a first spare laser emitter pair are directed through an optical system and out a common optical fiber.

    Optically enabled multi-chip modules including optical engine macros
    7.
    发明授权
    Optically enabled multi-chip modules including optical engine macros 有权

    公开(公告)号：US10594402B2

    公开(公告)日：2020-03-17

    申请号：US15369770

    申请日：2016-12-05

    Applicant: FINISAR CORPORATION

    Inventor： Frank J. Flens ,  Daniel Mahgerefteh ,  The' Linh Nguyen ,  Jimmy Alan Tatum

    IPC: H04B10/40 ,  H04B10/80 ,  H04B10/50

    Abstract: An optically enabled multi-chip module has an optical engine transceiver and a host system chip. The optical engine transceiver has an optical engine front-end and an optical engine macro. The optical engine front-end has multiple laser diodes, laser driver circuitry electrically interfaced with each of the laser diodes, multiple photodiodes, amplifier circuitry electrically interfaced with each of the photodiodes, and at least one optical element optically positioned between the laser diodes and at least one optical fiber and between the photodiodes and the at least one optical fiber. The at least one optical element optically interfaces the laser diodes and photodiodes with the optical fiber. The optical engine macro is both electrically interfaced with and physically segregated from the optical engine front-end. The optical engine macro provides a subset of optical transceiver functionality to the optical engine front-end. The host system chip is electrically interfaced with the optical engine transceiver.

    OPTICALLY ENABLED MULTI-CHIP MODULES
    8.
    发明申请
    OPTICALLY ENABLED MULTI-CHIP MODULES 审中-公开

    公开(公告)号：US20170237496A1

    公开(公告)日：2017-08-17

    申请号：US15369770

    申请日：2016-12-05

    Applicant: FINISAR CORPORATION

    Inventor： Frank J. Flens ,  Daniel Mahgerefteh ,  The' Linh Nguyen ,  Jimmy Alan Tatum

    IPC: H04B10/40 ,  H04B10/50 ,  H04B10/80

    CPC classification number: H04B10/40 ,  H04B10/502 ,  H04B10/801

    Abstract: An optically enabled multi-chip module has an optical engine transceiver and a host system chip. The optical engine transceiver has an optical engine front-end and an optical engine macro. The optical engine front-end has multiple laser diodes, laser driver circuitry electrically interfaced with each of the laser diodes, multiple photodiodes, amplifier circuitry electrically interfaced with each of the photodiodes, and at least one optical element optically positioned between the laser diodes and at least one optical fiber and between the photodiodes and the at least one optical fiber. The at least one optical element optically interfaces the laser diodes and photodiodes with the optical fiber. The optical engine macro is both electrically interfaced with and physically segregated from the optical engine front-end. The optical engine macro provides a subset of optical transceiver functionality to the optical engine front-end. The host system chip is electrically interfaced with the optical engine transceiver.

    THERMAL MANAGEMENT STRUCTURES FOR OPTOELECTRONIC MODULES
    9.
    发明申请
    THERMAL MANAGEMENT STRUCTURES FOR OPTOELECTRONIC MODULES 有权
    光电模块的热管理结构

    公开(公告)号：US20150282303A1

    公开(公告)日：2015-10-01

    申请号：US14266783

    申请日：2014-04-30

    Applicant: FINISAR CORPORATION

    Inventor： Cindy H. Hsieh ,  Frank J. Flens ,  Ziv Lipkin

    IPC: H05K1/02 ,  H05K7/20 ,  G02B7/02

    CPC classification number: H05K1/0274 ,  G02B6/4202 ,  G02B6/4272 ,  G02B6/428 ,  G02B7/023 ,  G02B7/028 ,  H05K1/0203 ,  H05K7/2039 ,  H05K2201/10121

    Abstract: An example embodiment includes optoelectronic module. The optoelectronic module may include a lens assembly, a module board, heat-generating components, and a thermally conductive plate. The lens assembly may be secured to the module board. The module board may include a printed circuit board (PCB). The heat-generating components may be mounted to the PCB. The thermally conductive plate may be secured to a surface of the module board. The thermally conductive plate may define an opening that receives at least a portion of the lens assembly. The thermally conductive plate may be configured to absorb at least a portion of thermal energy generated during operation of the heat-generating components and to transfer the thermal energy away from the heat-generating components.

    Abstract translation: 示例性实施例包括光电子模块。 光电子模块可以包括透镜组件，模块板，发热部件和导热板。 透镜组件可以固定到模块板。 模块板可以包括印刷电路板（PCB）。 发热部件可以安装到PCB。 导热板可以固定到模块板的表面。 导热板可以限定一个开口，该开口接纳透镜组件的至少一部分。 导热板可以被配置为吸收在发热部件的操作期间产生的热能的至少一部分并且将热能从发热部件传送出去。

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