公开(公告)号：US20140322893A1

公开(公告)日：2014-10-30

申请号：US14324626

申请日：2014-07-07

Applicant: FUJIFILM CORPORATION

Inventor： Shiro TAN ,  Kazuhiro FUJIMAKI ,  Yu IWAI ,  Ichiro KOYAMA ,  Atsushi NAKAMURA

IPC: H01L23/00 ,  H01L21/683

CPC classification number: H01L23/562 ,  C09J7/22 ,  C09J7/35 ,  C09J2203/326 ,  C09J2205/302 ,  H01L21/67115 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for manufacturing a semiconductor device with a treated member, includes: subjecting an adhesive support having a substrate and an adhesive layer capable of increasing or decreasing in adhesiveness upon irradiation with an actinic ray, radiation or heat to irradiation of the adhesive layer with an actinic ray, radiation or heat, adhering a first surface of a to-be-treated member to the adhesive layer of the adhesive support, applying a mechanical or chemical treatment to a second surface different from the first surface of the to-be-treated member to obtain a treated member, and detaching a first surface of the treated member from the adhesive layer of the adhesive support, wherein the irradiation of the adhesive layer with an actinic ray, radiation or heat is conducted so that adhesiveness decreases toward an outer surface from an inner surface on the substrate side of the adhesive layer.

Abstract translation: 一种用于制造具有处理部件的半导体器件的方法，包括：对具有基底的粘合剂支撑体和能够增加或降低粘合性的粘合剂层进行照射时的光化射线，辐射或加热以对所述粘合剂层进行照射 光化射线，辐射或热，将待处理部件的第一表面粘附到粘合剂支撑体的粘合剂层上，对不同于被处理物体的第一表面的第二表面进行机械或化学处理 构件，以获得处理构件，并且从粘合剂支撑体的粘合剂层分离处理构件的第一表面，其中进行具有光化射线，辐射或热的粘合剂层的照射，使得粘附性朝向外表面减小 从粘合剂层的基板侧的内表面。

公开(公告)号：US20140227637A1

公开(公告)日：2014-08-14

申请号：US14257314

申请日：2014-04-21

Applicant: FUJIFILM Corporation

Inventor： Keita KATO ,  Michihiro SHIRAKAWA ,  Tadahiro ODANI ,  Atsushi NAKAMURA ,  Hidenori TAKAHASHI ,  Kaoru IWATO

IPC: G03F7/09 ,  G03F7/20

CPC classification number: G03F7/094 ,  G03F7/0392 ,  G03F7/0397 ,  G03F7/091 ,  G03F7/095 ,  G03F7/20 ,  G03F7/2041 ,  G03F7/325

Abstract: A pattern forming method contains: (i) a step of forming a bottom anti-reflective coating on a substrate by using a first resin composition (I), (ii) a step of forming a resist film on the bottom anti-reflective coating by using a second resin composition (II), (iii) a step of exposing a multi-layered film having the bottom anti-reflective coating and the resist film, and (iv) a step of developing the bottom anti-reflective coating and the resist film in the exposed multi-layered film by using an organic solvent-containing developer to form a negative pattern.

Abstract translation: 图案形成方法包括：（i）通过使用第一树脂组合物（I）在基材上形成底部抗反射涂层的步骤，（ii）在底部抗反射涂层上形成抗蚀剂膜的步骤， 使用第二树脂组合物（II），（iii）暴露具有底部抗反射涂层和抗蚀剂膜的多层膜的步骤，以及（iv）显影底部抗反射涂层和抗蚀剂的步骤 通过使用含有机溶剂的显影剂来形成负图案的曝光的多层膜中的膜。