Abstract:
An embodiment of the invention relates to a circuit for distributing an initial signal, comprising an input node receiving the initial signal, a plurality of terminal nodes each providing at least one resulting signal to a circuit component, and different connection branches between the input node and the plurality of terminal nodes, to which a plurality of intermediate nodes is connected, wherein connection branch is duplicated, so that each node among the input node and the intermediate nodes comprises two inputs and two outputs allowing double propagation of the initial signal towards the terminal nodes through duplicated connection branches, each terminal node terminal node receiving two input signals, images of the initial signal and providing the resulting initial signal: an image of the input signals if said input signals are identical, or inactive, if the input signals are different from each other.
Abstract:
An embodiment of the invention relate to a memory device including a memory plane composed of memory cells located at the intersection of lines and columns, and a dummy path designed to output a signal to activate read amplifiers arranged at the bottom of the columns in the memory plane, said dummy path including dummy memory cells connected between two dummy bit lines means of selecting at least one dummy cell designed to discharge at least one of the dummy bit lines, and control means connected to the two dummy bit lines to generate said activation signal, characterized in that said device includes means of programming the number of selected cells to discharge at least said dummy bit line, to adjust the time at which said activation signal is output.
Abstract:
Bit lines (BL0, BL0R, BL1, BL1R, . . . ) of a ROM memory array with differential detection reading are arranged within two overlaid metallization levels so as to increase the read reliability of binary values stored in the array. The ROM array is divided into matrix segments (100, 101, . . . ) aligned parallel to the bit lines. The bit lines are shifted horizontally and/or vertically within transition regions (T) located between the segments of matrix, by effecting circular permutations between the positions of the bit lines that are divided up into groups of four.
Abstract:
A Content Addressable Memory (CAM) circuit includes memory cells preferably formed as two memory cells each having internal nodes. A compare circuit is operative with the memory cells. A common terminal (VPL) exists for the memory cells. Capacitors are added between the internal nodes of each of the memory cells and common terminal for memory cell stability.
Abstract:
An integrated dynamic random access memory element includes two cells for the storage of two respective bits. A source region and a drain region are included. Each cell comprises a field-effect transistor having a gate and an intermediate portion which extend between the source and drain regions. A channel is provided in the intermediate portion of the transistor for each cell. A polarization electrode is placed between the respective intermediate portions of the two transistors. This polarization electrode is capacitively coupled to the intermediate portion of each transistor and is used to store the first and second bits.
Abstract:
An array of ROM cells, each formed of a transistor having a first drain or source region connected to a bit line connecting several transistors in a first direction, the gates of the different transistors being connected to word lines in a second direction perpendicular to the first one, the array comprising a repetition of an elementary pattern extending over three lines in each direction and comprising nine transistors arranged so that each of the lines of the elementary pattern comprises two cells, two neighboring transistors of each pattern in the first direction sharing a same second region connected to a ground line and being connected to different bit lines from a word line to the other.
Abstract:
An SRAM memory cell includes first and second inverters (14, 16) interconnected between first and second data nodes. Each inverter is formed from complementary MOS transistors (18, 20, 18′, 20′) connected in series between a DC voltage supply source and a grounding circuit (22). A circuit (28, 30) programs the MOS transistors by causing an irreversible degradation of a gate oxide layer of at least some of the transistors (18, 18′).
Abstract:
Bit lines (BL0, BL0R, BL1, BL1R, . . . ) of a ROM memory array with differential detection reading are arranged within two overlaid metallization levels so as to increase the read reliability of binary values stored in the array. The ROM array is divided into matrix segments (100, 101, . . . ) aligned parallel to the bit lines. The bit lines are shifted horizontally and/or vertically within transition regions (T) located between the segments of matrix, by effecting circular permutations between the positions of the bit lines that are divided up into groups of four.
Abstract:
A RAM memory integrated circuit, in particular a SRAM memory integrated circuit, includes a matrix of memory cells that are arranged between two bit lines via two access transistors. The bit lines are intended in one case to be discharged and in the other case to be maintained at a high precharge potential during a read operation. The bit line of each column of the matrix that is intended to be maintained at the high precharge potential is produced in the form of at least two partial bit lines. The memory cells of each column are implanted in the form of groups of cells which are alternately connected to one or the other of the partial bit lines, respectively.
Abstract:
An SRAM having two capacitors connected in series between respective bit storage nodes of each memory cell. The two inverters of the memory cell are powered by a positive voltage and a low voltage. The two capacitors are connected to each other at a common node. A leakage current generator is coupled to the common node. The leakage current generator supplies to the common node a leakage current to maintain a voltage which is approximately halfway between the voltages of the high and low SRAM supplies.