公开(公告)号：US20110205305A1

公开(公告)日：2011-08-25

申请号：US13102091

申请日：2011-05-06

申请人： Frank Edward Anderson ,  David Laurier Bernard ,  Paul William Dryer ,  Burton Lee Joyner, II ,  Andrew Lee McNees ,  Timothy Lowell Strunk ,  Carl Edmond Sullivan

发明人： Frank Edward Anderson ,  David Laurier Bernard ,  Paul William Dryer ,  Burton Lee Joyner, II ,  Andrew Lee McNees ,  Timothy Lowell Strunk ,  Carl Edmond Sullivan

IPC分类号： B41J2/05

CPC分类号： B41J2/1603 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/164 ,  H01L21/6715 ,  Y10T29/49401

摘要： A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die.

摘要翻译： 加热器芯片具有基板和至少一个由硅制成的管芯，以及非粘合地连接的管芯。 厚度足以抵抗弯曲的基材具有从后表面到前表面的墨水供应通孔。 模具具有从背面到表面的墨水流通孔，以及包括与前述表面相邻的加热元件的电路，其中散布着墨水通孔。 至少一个管芯叠加在衬底上，使得衬底的供墨通孔与管芯的墨流过孔对准，并且衬底前表面和管芯后表面的部分相邻并相对设置地排列。 在衬底和面向芯片的表面部分之间形成的结合是密封的，并且与Si-O键的强度相等。 通过模具的金属将基板前部的导体连接到模具前部的加热元件。

公开(公告)号：US20110122194A1

公开(公告)日：2011-05-26

申请号：US12624078

申请日：2009-11-23

申请人： Frank Edward Anderson ,  James Harold Powers

发明人： Frank Edward Anderson ,  James Harold Powers

IPC分类号： B41J2/14 ,  B21D53/76

CPC分类号： B41J2/14145 ,  Y10T29/49401

摘要： An ink manifold for supplying liquid ink to a heater chip of an inkjet printhead. Ink ports on one side of the manifold feed liquid ink to the ink channels on the other side of the manifold, and thus to the backside ink trenches of the heater chip. The placement and number of ink ports formed in the ink manifold are optimized so that when the heater chip and the ink manifold are scaled down in size, the ink carrying capacity of the printhead components is not compromised. Similarly, when the ink manifold is scaled down, the optimization process allows the seal width between the ink port features of the manifold to be maintained above a specified minimum.

摘要翻译： 一种用于将液体墨水供应到喷墨打印头的加热器芯片的墨水歧管。 歧管一侧的墨水口将液体墨液供给到歧管另一侧的墨水通道，从而进入加热器芯片的背面墨水槽。 形成在墨水歧管中的墨水口的布置和数量被优化，使得当加热器芯片和墨水歧管的尺寸缩小时，打印头部件的墨水承载能力不受影响。 类似地，当墨水歧管按比例缩小时，优化过程允许歧管的墨水口特征之间的密封宽度保持在规定的最小值以上。

公开(公告)号：US20090256891A1

公开(公告)日：2009-10-15

申请号：US12101215

申请日：2008-04-11

申请人： Frank Edward Anderson ,  David Laurier Bernard ,  Paul William Dryer ,  Burton Lee Joyner, II ,  Andrew Lee McNees ,  Timothy Lowell Strunk ,  Carl Edmond Sullivan

发明人： Frank Edward Anderson ,  David Laurier Bernard ,  Paul William Dryer ,  Burton Lee Joyner, II ,  Andrew Lee McNees ,  Timothy Lowell Strunk ,  Carl Edmond Sullivan

IPC分类号： B41J2/05 ,  H01L21/00

CPC分类号： B41J2/1603 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/164 ,  H01L21/6715 ,  Y10T29/49401

摘要： A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. By separate processing of carrier and device wafers, size and features of substrate and die can be tailored to provide a desired heater chip construction.

摘要翻译： 加热器芯片具有基板和至少一个由硅制成的管芯，以及非粘合地连接的管芯。 厚度足以抵抗弯曲的基材具有从后表面到前表面的墨水供应通孔。 模具具有从背面到表面的墨水流通孔，以及包括与前述表面相邻的加热元件的电路，其中散布着墨水通孔。 至少一个管芯叠加在衬底上，使得衬底的供墨通孔与管芯的墨流过孔对准，并且衬底前表面和管芯后表面的部分相邻并相对设置地排列。 在衬底和面向芯片的表面部分之间形成的结合是密封的，并且与Si-O键的强度相等。 通过对载体和器件晶片的单独处理，可以调整衬底和管芯的尺寸和特征以提供期望的加热器芯片结构。

公开(公告)号：US07011395B2

公开(公告)日：2006-03-14

申请号：US10656860

申请日：2003-09-05

申请人： Frank Edward Anderson ,  Darell Dean Cronch

发明人： Frank Edward Anderson ,  Darell Dean Cronch

IPC分类号： B41J2/05 ,  B41J29/38

CPC分类号： B41J2/04541 ,  B41J2/04548 ,  B41J2/0458

摘要： The manner in which power is supplied to the firing elements of an ink jet printhead is improved by moving a power supply capacitor from the printer to the print head cartridge to improve the regulation of the supply of power to the firing elements of the print head cartridge. The capacitor can be attached to the tab circuit with solder or other wire bonding techniques. Placing the capacitor on the print head cartridge reduces the impedance between the capacitor and the print head, allows the capacitor to be matched to the print head cartridge firing requirements, allows remote voltage sensing at the print head, provides better voltage regulation at the print head and reduces the likelihood the printhead electronics will be damaged due to voltage spiking.

摘要翻译： 通过将电源电容器从打印机移动到打印头盒来提高向喷墨打印头的点火元件供电的方式，以改善对打印头盒的点火元件供电的调节 。 电容器可以使用焊料或其他引线键合技术连接到接片电路。 将电容器放置在打印头墨盒上可以降低电容器和打印头之间的阻抗，允许电容器与打印头墨盒的点火要求相匹配，允许在打印头进行远程电压检测，在打印头提供更好的电压调节 并降低打印头电子器件由于电压尖峰而被损坏的可能性。

公开(公告)号：US06805431B2

公开(公告)日：2004-10-19

申请号：US10334109

申请日：2002-12-30

申请人： Frank Edward Anderson ,  Byron V Bell ,  Yimin Guan ,  George Keith Parish ,  Robert Cornell

发明人： Frank Edward Anderson ,  Byron V Bell ,  Yimin Guan ,  George Keith Parish ,  Robert Cornell

IPC分类号： B41J205

CPC分类号： B41J2/14129 ,  B41J2202/03

摘要： An inkjet printhead heater chip has a silicon substrate with a heater stack formed of a plurality of thin film layers thereon for ejecting an ink drop during use. The thin film layers include: a thermal barrier layer on the silicon substrate; a resistor layer on the thermal barrier layer; a doped diamond-like carbon layer on the resistor layer; and a cavitation layer on the doped diamond-like carbon layer. The doped diamond-like carbon layer preferably includes silicon but may also include nitrogen, titanium, tantalum, combinations thereof or other. When it includes silicon, a preferred silicon concentration ranges from 20 to 25 atomic percent. A preferred cavitation layer includes an undoped diamond-like carbon, tantalum or titanium layer. The doped diamond-like carbon layer ranges in thickness from 500 to 3000 angstroms. The cavitation layer ranges from 500 to 6000 angstroms. Inkjet printheads and printers are also disclosed.

摘要翻译： 喷墨打印头加热器芯片具有硅衬底，其具有由其上的多个薄膜层形成的加热器堆叠，用于在使用期间喷射墨滴。 薄膜层包括：硅衬底上的热障层; 阻热层上的电阻层; 电阻层上的掺杂类金刚石碳层; 以及掺杂的类金刚石碳层上的空穴层。 掺杂的类金刚石碳层优选包括硅，但也可以包括氮，钛，钽，其组合或其它。 当其包含硅时，优选的硅浓度范围为20-25原子％。 优选的空化层包括未掺杂的类金刚石碳，钽或钛层。 掺杂的类金刚石碳层的厚度范围为500至3000埃。 空化层的范围为500至6000埃。 还公开了喷墨打印头和打印机。

公开(公告)号：US06742866B2

公开(公告)日：2004-06-01

申请号：US10217018

申请日：2002-08-12

申请人： Frank Edward Anderson ,  John Philip Bolash ,  Randall David Mayo ,  George Keith Parish

发明人： Frank Edward Anderson ,  John Philip Bolash ,  Randall David Mayo ,  George Keith Parish

IPC分类号： B41J215

CPC分类号： B41J2/04505 ,  B41J2/04543 ,  B41J2/04573 ,  B41J2/0458 ,  B41J2/14072 ,  B41J2/15

摘要： An ink jet printing apparatus forms a printed image on a print medium based on image data. The apparatus includes an ink jet print head having ink ejection nozzles in a nozzle array. Ink is ejected from the nozzles and onto the print medium as the print head scans across the print medium in a scan direction, thereby forming the image on the print medium. The nozzle array on the print head includes a first substantially columnar array of nozzles aligned with a print medium advance direction which is perpendicular to the scan direction. The first array has a first upper subarray pair that includes a first upper left and a first upper right subarray of nozzles. The first upper left and a first upper right subarrays each include a substantially linear arrangement of n number of nozzles having equal nozzle-to-nozzle spacings. The nozzle-to-nozzle spacing in the first upper right subarray is equivalent to the nozzle-to-nozzle spacing in the first upper left subarray. The first upper right subarray is offset from the first upper left subarray in the scan direction by a first horizontal spacing, and is offset in the print medium advance direction by one-half of the nozzle-to-nozzle spacing. The nozzle array also includes a second substantially columnar array of nozzles aligned with the print medium advance direction. The second array is offset from the first array in the scan direction by a second horizontal spacing, and is offset in the print medium advance direction by one-fourth of the nozzle-to-nozzle spacing. The second columnar array has a second upper subarray pair that includes a second upper left and a second upper right subarray. The second upper left and second upper right subarrays each include a substantially linear arrangement of n number of nozzles having equal nozzle-to-nozzle spacings. The second upper right subarray is offset from the second upper left subarray in the scan direction by the first horizontal spacing and in the print medium advance direction by one-half of the nozzle-to-nozzle spacing.

公开(公告)号：US06712439B1

公开(公告)日：2004-03-30

申请号：US10321038

申请日：2002-12-17

申请人： Frank Edward Anderson ,  George Keith Parish

发明人： Frank Edward Anderson ,  George Keith Parish

IPC分类号： B41J2938

CPC分类号： B41J2/04541 ,  B41J2/04543 ,  B41J2/04545 ,  B41J2/04546 ,  B41J2/0455 ,  B41J2/0458 ,  B41J2/1753

摘要： An integrated circuit in an ink jet printhead selectively activates one or more printing elements on the printhead based on a multi-dimensional addressing scheme. The integrated circuit includes a plurality of pass switching, power switching, and one or more ground switching devices for selectively connecting one or more power switching devices to ground to activate one or more of the printing elements to print an image on a print medium. The integrated circuit includes a number of first, second, third, and fourth control lines for selectively controlling the activation of one or more of the printing elements.

摘要翻译： 基于多维寻址方案，喷墨打印头中的集成电路选择性地激活打印头上的一个或多个打印元件。 集成电路包括多个通路开关，电源开关和一个或多个接地开关装置，用于选择性地将一个或多个电力开关装置连接到地以激活一个或多个打印元件以在打印介质上打印图像。 该集成电路包括用于选择性地控制一个或多个打印元件的激活的多个第一，第二，第三和第四控制线。

公开(公告)号：US06676246B1

公开(公告)日：2004-01-13

申请号：US10300536

申请日：2002-11-20

申请人： Frank Edward Anderson ,  Robert Wilson Cornell

发明人： Frank Edward Anderson ,  Robert Wilson Cornell

IPC分类号： B41J205

CPC分类号： B41J2/14129 ,  B41J2202/03 ,  B41J2202/11

摘要： A heater chip structure having heating elements operable at an energy per unit volume of from about 2.9 GJ/m3 to about 4.0 GJ/m3, a pulse time of less than about 0.73 microseconds, and one or more protective layers having a total thickness of less than about 7200 angstroms.

摘要翻译： 一种加热器芯片结构，其具有可以以约2.9GJ / m 3至约4.0GJ / m 3的每单位体积的能量操作的加热元件，小于约0.73微秒的脉冲时间和一个或多个保护层 总厚度小于约7200埃。

公开(公告)号：US6137502A

公开(公告)日：2000-10-24

申请号：US384803

申请日：1999-08-27

申请人： Frank Edward Anderson ,  John Philip Bolash ,  Robert Wilson Cornell ,  George Keith Parish

发明人： Frank Edward Anderson ,  John Philip Bolash ,  Robert Wilson Cornell ,  George Keith Parish

IPC分类号： B41J2/05 ,  B41J2/14 ,  B41J2/205 ,  B41J2/21

CPC分类号： B41J2/04533 ,  B41J2/04541 ,  B41J2/0458 ,  B41J2/04593 ,  B41J2/14056 ,  B41J2/14072 ,  B41J2/2125 ,  B41J2002/14387

摘要： An ink jet print head has first nozzles of a first diameter for ejecting droplets of ink having a first mass, and second nozzles of a second diameter for ejecting droplets of ink having a second mass. The first diameter is larger than the second diameter, and the first mass is larger than the second mass. First and second heater-switch pairs are connected in parallel on a substrate of the print head. The first heater-switch pairs include first heaters adjacent corresponding first nozzles, and the second heater-switch pairs include second heaters adjacent corresponding second nozzles. The first and second heaters are composed of electrically resistive material occupying first and second heater areas on the substrate. The first heater-switch pairs also include first switching devices connected in series with the first heaters, with each first switching device developing a first switching device voltage drop as a first electrical current flows through. The second heater-switch pairs include second switching devices connected in series with the second heaters, with each second switching device developing a second switching device voltage drop as a second electrical current flows through. The first heater area is larger than the second heater area, thus matching heater area to nozzle diameter to provide for more efficient transfer of thermal energy to the ink. The voltage drop across each first switching device is substantially equivalent to the voltage drop across each second switching device, thus reducing undesirable nozzle-to-nozzle variations in the amount of energy delivered to the ink.

摘要翻译： 喷墨打印头具有用于喷射具有第一质量的油墨的第一直径的第一喷嘴和用于喷射具有第二质量的油墨的第二直径的第二喷嘴。 第一直径大于第二直径，第一质量大于第二质量。 第一和第二加热器开关对并联在打印头的基板上。 第一加热器开关对包括与相应的第一喷嘴相邻的第一加热器，第二加热器开关对包括与相应的第二喷嘴相邻的第二加热器。 第一和第二加热器由占据基板上的第一和第二加热器区域的电阻材料构成。 第一加热器开关对还包括与第一加热器串联连接的第一开关装置，当第一电流流过时，每个第一开关装置开发第一开关装置电压降。 第二加热器开关对包括与第二加热器串联连接的第二开关装置，随着第二电流流经，每个第二开关装置产生第二开关装置电压降。 第一加热器区域大于第二加热器区域，从而将加热器面积与喷嘴直径相匹配以提供更有效地将热能转移到墨水。 每个第一开关器件上的电压降基本上等于每个第二开关器件上的电压降，从而减少输送到墨水的能量的不期望的喷嘴对喷嘴的变化。

公开(公告)号：US08061811B2

公开(公告)日：2011-11-22

申请号：US11536470

申请日：2006-09-28

申请人： Frank Edward Anderson ,  Jeanne Marie Saldanha Singh ,  Carl Edmond Sullivan ,  Sean Terrence Weaver

发明人： Frank Edward Anderson ,  Jeanne Marie Saldanha Singh ,  Carl Edmond Sullivan ,  Sean Terrence Weaver

IPC分类号： B41J2/04

CPC分类号： B41J2/14 ,  B41J2/16 ,  B41J2/1623 ,  B41J2002/14362 ,  B41J2002/14491 ,  Y10T29/49401

摘要： Micro-fluid ejection heads and methods for fabricating micro-fluid ejection heads are provided, including those that use a non-conventional substrate and methods for making large array micro-fluid ejection heads. One such ejection head includes a substrate having a device surface with a plurality of fluid ejection actuator devices and a pocket disposed adjacent thereto. A chip associated with the plurality of fluid ejection actuator devices is attached in the chip pocket adjacent to the device surface of the substrate. A conductive material is deposited adjacent to the device surface of the substrate and in electrical communication with the chip.

摘要翻译： 提供了微流体喷射头和用于制造微流体喷射头的方法，包括使用非常规基底的那些和用于制造大型阵列微流体喷射头的方法。 一个这样的喷射头包括具有多个流体喷射致动器装置的装置表面的衬底和与其相邻设置的口袋。 与多个流体喷射致动器装置相关联的芯片附接在与衬底的器件表面相邻的芯片凹槽中。 导电材料沉积在衬底的器件表面附近并与芯片电连通。