利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

64 条记录 (耗时 0.028 秒)

    Micro-Fluid Ejection Heads with Chips in Pockets
    2.
    发明申请
    Micro-Fluid Ejection Heads with Chips in Pockets 有权
    微型流体喷射头与芯片中的芯片

    公开(公告)号：US20100199497A1

    公开(公告)日：2010-08-12

    申请号：US12765259

    申请日：2010-04-22

    申请人： Frank Edward Anderson ,  Jeanne Marie Saldanha Singh ,  Carl Edmond Sullivan ,  Sean Terrence weaver

    发明人： Frank Edward Anderson ,  Jeanne Marie Saldanha Singh ,  Carl Edmond Sullivan ,  Sean Terrence weaver

    IPC分类号： B23P17/00

    CPC分类号： B41J2/14 ,  B41J2/16 ,  B41J2/1623 ,  B41J2002/14362 ,  B41J2002/14491 ,  Y10T29/49401

    摘要： Micro-fluid ejection heads and methods for fabricating micro-fluid ejection heads are provided, including those that use a non-conventional substrate and methods for making large array micro-fluid ejection heads. One such ejection head includes a substrate having a device surface with a plurality of fluid ejection actuator devices and a pocket disposed adjacent thereto. A chip associated with the plurality of fluid ejection actuator devices is attached in the chip pocket adjacent to the device surface of the substrate. A conductive material is deposited adjacent to the device surface of the substrate and in electrical communication with the chip.

    摘要翻译： 提供了微流体喷射头和用于制造微流体喷射头的方法，包括使用非常规基底的那些和用于制造大型阵列微流体喷射头的方法。 一个这样的喷射头包括具有多个流体喷射致动器装置的装置表面的衬底和与其相邻设置的口袋。 与多个流体喷射致动器装置相关联的芯片附接在与衬底的器件表面相邻的芯片凹槽中。 导电材料沉积在衬底的器件表面附近并与芯片电连通。

    Micro-fluid ejection heads with chips in pockets
    3.
    发明授权
    Micro-fluid ejection heads with chips in pockets 有权
    微型液体喷射头，带有口袋中的芯片

    公开(公告)号：US08061811B2

    公开(公告)日：2011-11-22

    申请号：US11536470

    申请日：2006-09-28

    申请人： Frank Edward Anderson ,  Jeanne Marie Saldanha Singh ,  Carl Edmond Sullivan ,  Sean Terrence Weaver

    发明人： Frank Edward Anderson ,  Jeanne Marie Saldanha Singh ,  Carl Edmond Sullivan ,  Sean Terrence Weaver

    IPC分类号： B41J2/04

    CPC分类号： B41J2/14 ,  B41J2/16 ,  B41J2/1623 ,  B41J2002/14362 ,  B41J2002/14491 ,  Y10T29/49401

    摘要： Micro-fluid ejection heads and methods for fabricating micro-fluid ejection heads are provided, including those that use a non-conventional substrate and methods for making large array micro-fluid ejection heads. One such ejection head includes a substrate having a device surface with a plurality of fluid ejection actuator devices and a pocket disposed adjacent thereto. A chip associated with the plurality of fluid ejection actuator devices is attached in the chip pocket adjacent to the device surface of the substrate. A conductive material is deposited adjacent to the device surface of the substrate and in electrical communication with the chip.

    摘要翻译： 提供了微流体喷射头和用于制造微流体喷射头的方法，包括使用非常规基底的那些和用于制造大型阵列微流体喷射头的方法。 一个这样的喷射头包括具有多个流体喷射致动器装置的装置表面的衬底和与其相邻设置的口袋。 与多个流体喷射致动器装置相关联的芯片附接在与衬底的器件表面相邻的芯片凹槽中。 导电材料沉积在衬底的器件表面附近并与芯片电连通。

    Micro-Fluid Ejection Heads with Chips in Pockets
    4.
    发明申请
    Micro-Fluid Ejection Heads with Chips in Pockets 有权
    微型流体喷射头与芯片中的芯片

    公开(公告)号：US20080079776A1

    公开(公告)日：2008-04-03

    申请号：US11536470

    申请日：2006-09-28

    申请人： Frank Edward Anderson ,  Jeanne Marie Saldanha Singh ,  Carl Edmond Sullivan ,  Sean Terrence Weaver

    发明人： Frank Edward Anderson ,  Jeanne Marie Saldanha Singh ,  Carl Edmond Sullivan ,  Sean Terrence Weaver

    IPC分类号： B41J2/04

    CPC分类号： B41J2/14 ,  B41J2/16 ,  B41J2/1623 ,  B41J2002/14362 ,  B41J2002/14491 ,  Y10T29/49401

    摘要： Micro-fluid ejection heads and methods for fabricating micro-fluid ejection heads are provided, including those that use a non-conventional substrate and methods for making large array micro-fluid ejection heads. One such ejection head includes a substrate having a device surface with a plurality of fluid ejection actuator devices and a pocket disposed adjacent thereto. A chip associated with the plurality of fluid ejection actuator devices is attached in the chip pocket adjacent to the device surface of the substrate. A conductive material is deposited adjacent to the device surface of the substrate and in electrical communication with the chip.

    摘要翻译： 提供了微流体喷射头和用于制造微流体喷射头的方法，包括使用非常规基底的那些和用于制造大型阵列微流体喷射头的方法。 一个这样的喷射头包括具有多个流体喷射致动器装置的装置表面的衬底和与其相邻设置的口袋。 与多个流体喷射致动器装置相关联的芯片附接在与衬底的器件表面相邻的芯片凹槽中。 导电材料沉积在衬底的器件表面附近并与芯片电连通。

    Tab circuit design for simplified use with hot bar soldering technique
    5.
    发明授权
    Tab circuit design for simplified use with hot bar soldering technique 有权
    Tab电路设计，简化使用热棒焊接技术

    公开(公告)号：US06357864B1

    公开(公告)日：2002-03-19

    申请号：US09464969

    申请日：1999-12-16

    申请人： Carl Edmond Sullivan ,  Frank Edward Anderson ,  Paul Timothy Spivey ,  Kris Ann Reeves ,  Gary Raymond Williams ,  Jeanne Marie Saldanha Singh

    发明人： Carl Edmond Sullivan ,  Frank Edward Anderson ,  Paul Timothy Spivey ,  Kris Ann Reeves ,  Gary Raymond Williams ,  Jeanne Marie Saldanha Singh

    IPC分类号： B41J205

    CPC分类号： B41J2/14072 ,  B41J2/14024 ,  H05K3/3494 ,  H05K3/363 ,  H05K3/4084 ,  H05K2201/0394 ,  H05K2201/10681 ,  H05K2201/10977 ,  H05K2203/0195 ,  H05K2203/1311

    摘要： The invention provides a printhead cartridge body contained within an inkjet printer which contains a tape automated bonding (TAB) circuit, having a unique architecture, electrically connected to a printhead heater chip and a printed circuit board (PCB). Moreover, the TAB circuit architecture is readily sealable by a variety of methods. The TAB circuit includes elongate apertures which have a length axis aligned perpendicular to electrical traces which run through the apertures. Each trace has a first end running through the apertures and being connected to a PCB by means of a hot bar soldering technique and the second end of the traces being connected to a printhead heater chip. An encapsulant layer substantially encloses the rectangular apertures and electrical connections preventing ink mist from contacting the connections. The TAB circuit design provides improvement in the manufacturing process and enables rework of connections without destroying the TAB circuit.

    摘要翻译： 本发明提供了一种包含在喷墨打印机内的打印头墨盒体，其包含带状自动粘合（TAB）电路，其具有电连接到打印头加热器芯片和印刷电路板（PCB）的独特结构。 此外，TAB电路架构可以通过各种方法容易地密封。 TAB电路包括细长孔，其具有垂直于穿过孔的电迹线对准的长度轴。 每个迹线具有穿过孔的第一端，并且通过热棒焊接技术连接到PCB，并且迹线的第二端连接到打印头加热器芯片。 密封剂层基本上包围矩形孔和防止墨雾接触连接的电连接。 TAB电路设计提供了制造过程的改进，并能够重新连接连接而不破坏TAB电路。

    Ink jetting structure having protected connections
    6.
    发明授权
    Ink jetting structure having protected connections 有权
    具有受保护连接的喷墨结构

    公开(公告)号：US07784909B2

    公开(公告)日：2010-08-31

    申请号：US12021375

    申请日：2008-01-29

    申请人： Frank Edward Anderson ,  Michael John Dixon ,  Bryan Dale McKinley ,  Jeanne Marie Saldanha Singh

    发明人： Frank Edward Anderson ,  Michael John Dixon ,  Bryan Dale McKinley ,  Jeanne Marie Saldanha Singh

    IPC分类号： B41J2/14

    CPC分类号： B41J2/17553 ,  B41J2/17526

    摘要： An ink jetting structure includes a substrate that has a first surface and a second surface. A heater chip is mounted to the second surface of the substrate, and includes a first set of electrical contacts. A printhead circuit member has a third surface, a fourth surface, and an opening configured to receive the heater chip with the first set of electrical contacts of the heater chip being exposed through the opening. The third surface is mounted to the second surface of the substrate. The fourth surface has a second set of electrical contacts attached by wire bonds to the first set of electrical contacts. The third surface has a third set of electrical contacts electrically coupled to the second set of electrical contacts, and electrically connected to a flexible cable for coupling to corresponding contacts on a printer.

    摘要翻译： 喷墨结构包括具有第一表面和第二表面的基底。 加热器芯片安装到基板的第二表面，并且包括第一组电触头。 打印头电路构件具有第三表面，第四表面和开口，其构造成接收加热器芯片，加热器芯片的第一组电触点通过开口露出。 第三表面安装到基板的第二表面。 第四表面具有通过引线键合连接到第一组电触点的第二组电触头。 第三表面具有电耦合到第二组电触头的第三组电触点，并且电连接到柔性电缆，用于耦合到打印机上的相应触点。