-
公开(公告)号:US20100109122A1
公开(公告)日:2010-05-06
申请号:US12265595
申请日:2008-11-05
申请人: Hai Ding , Fuchao Wang , Zhiyong Xie
发明人: Hai Ding , Fuchao Wang , Zhiyong Xie
IPC分类号: H01L23/525 , H01L21/768
CPC分类号: H01L23/5256 , H01L21/76892 , H01L23/5258 , H01L27/10894 , H01L2924/0002 , Y02E60/12 , H01L2924/00
摘要: Methods of fabricating a multi-layer semiconductor structure are provided. In one embodiment, a method includes depositing a first dielectric layer over a semiconductor structure, depositing a first metal layer over the first dielectric layer, patterning the first metal layer to form a plurality of first metal lines, and depositing a second dielectric layer over the first metal lines and the first dielectric layer. The method also includes removing a portion of the second dielectric layer over selected first metal lines to expose a respective top surface of each of the selected first metal lines. The method further includes reducing a thickness of the selected first metal lines to be less than a thickness of the unselected first metal lines. A multi-layer semiconductor structure is also provided.
摘要翻译: 提供制造多层半导体结构的方法。 在一个实施例中,一种方法包括在半导体结构上沉积第一介电层,在第一介电层上沉积第一金属层,图案化第一金属层以形成多个第一金属线,以及在第 第一金属线和第一介电层。 该方法还包括在所选择的第一金属线上去除第二电介质层的一部分以暴露每个所选择的第一金属线的相应顶表面。 该方法还包括将所选择的第一金属线的厚度减小到小于未选择的第一金属线的厚度。 还提供了多层半导体结构。
-
公开(公告)号:US20100073122A1
公开(公告)日:2010-03-25
申请号:US12562026
申请日:2009-09-17
IPC分类号: H01C7/00
CPC分类号: H01C17/265 , H01L23/345 , H01L23/5228 , H01L27/016 , H01L27/0688 , H01L28/20 , H01L2924/0002 , H01L2924/3011 , Y10T29/49087 , H01L2924/00
摘要: A trimmable resistor for use in an integrated circuit is trimmed using a heater. The heater is selectively coupled to a voltage source. The application of voltage to the heater causes the heater temperature to increase and produce heat. The heat permeates through a thermal separator to the trimmable resistor. The resistance of the trimmable resistor is permanently increased or decreased when the temperature of the resistor is increased to a value within a particular range of temperatures.
摘要翻译: 用于集成电路的微调电阻器使用加热器进行修整。 加热器选择性地耦合到电压源。 对加热器施加电压导致加热器温度升高并产生热量。 热量通过热分离器渗透到可调节电阻器。 当电阻器的温度增加到特定温度范围内的值时,可调整电阻器的电阻永久地增加或减小。
-
公开(公告)号:US08493171B2
公开(公告)日:2013-07-23
申请号:US13541468
申请日:2012-07-03
CPC分类号: H01C17/265 , H01L23/345 , H01L23/5228 , H01L27/016 , H01L27/0688 , H01L28/20 , H01L2924/0002 , H01L2924/3011 , Y10T29/49087 , H01L2924/00
摘要: A trimmable resistor for use in an integrated circuit is trimmed using a heater. The heater is selectively coupled to a voltage source. The application of voltage to the heater causes the heater temperature to increase and produce heat. The heat permeates through a thermal separator to the trimmable resistor. The resistance of the trimmable resistor is permanently increased or decreased when the temperature of the resistor is increased to a value within a particular range of temperatures.
摘要翻译: 用于集成电路的微调电阻器使用加热器进行修整。 加热器选择性地耦合到电压源。 对加热器施加电压导致加热器温度升高并产生热量。 热量通过热分离器渗透到可调节电阻器。 当电阻器的温度增加到特定温度范围内的值时,可调整电阻器的电阻永久地增加或减小。
-
24.
公开(公告)号:US20120085748A1
公开(公告)日:2012-04-12
申请号:US12902005
申请日:2010-10-11
申请人: Olivier Le Neel , Fuchao Wang , Ravi Shankar
发明人: Olivier Le Neel , Fuchao Wang , Ravi Shankar
IPC分类号: H05B1/00
CPC分类号: H05B3/0014 , H01L23/34 , H01L23/345 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/15311 , H05B1/0227 , H05B3/02 , H05B3/06 , H05B3/12 , H05B3/34 , H01L2924/00014 , H01L2924/00
摘要: An integrated circuit is provided having an active circuit. A heating element is adjacent to the active circuit and configured to heat the active circuit. A temperature sensor is also adjacent to the active circuit and configured to measure a temperature of the active circuit. A temperature controller is coupled to the active circuit and configured to receive a temperature signal from the temperature sensor. The temperature controller operates the heating element to heat the active circuit to maintain the temperature of the active circuit in a selected temperature range.
摘要翻译: 提供具有有源电路的集成电路。 加热元件邻近有源电路并且被配置为加热有源电路。 温度传感器也与有源电路相邻并且被配置为测量有源电路的温度。 温度控制器耦合到有源电路并被配置为从温度传感器接收温度信号。 温度控制器操作加热元件以加热有源电路以将有源电路的温度保持在所选择的温度范围内。
-
公开(公告)号:US08927909B2
公开(公告)日:2015-01-06
申请号:US12902005
申请日:2010-10-11
申请人: Olivier Le Neel , Fuchao Wang , Ravi Shankar
发明人: Olivier Le Neel , Fuchao Wang , Ravi Shankar
CPC分类号: H05B3/0014 , H01L23/34 , H01L23/345 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/15311 , H05B1/0227 , H05B3/02 , H05B3/06 , H05B3/12 , H05B3/34 , H01L2924/00014 , H01L2924/00
摘要: An integrated circuit is provided having an active circuit. A heating element is adjacent to the active circuit and configured to heat the active circuit. A temperature sensor is also adjacent to the active circuit and configured to measure a temperature of the active circuit. A temperature controller is coupled to the active circuit and configured to receive a temperature signal from the temperature sensor. The temperature controller operates the heating element to heat the active circuit to maintain the temperature of the active circuit in a selected temperature range.
-
公开(公告)号:US08242876B2
公开(公告)日:2012-08-14
申请号:US12562026
申请日:2009-09-17
CPC分类号: H01C17/265 , H01L23/345 , H01L23/5228 , H01L27/016 , H01L27/0688 , H01L28/20 , H01L2924/0002 , H01L2924/3011 , Y10T29/49087 , H01L2924/00
摘要: A trimmable resistor for use in an integrated circuit is trimmed using a heater. The heater is selectively coupled to a voltage source. The application of voltage to the heater causes the heater temperature to increase and produce heat. The heat permeates through a thermal separator to the trimmable resistor. The resistance of the trimmable resistor is permanently increased or decreased when the temperature of the resistor is increased to a value within a particular range of temperatures.
摘要翻译: 用于集成电路的微调电阻器使用加热器进行修整。 加热器选择性地耦合到电压源。 对加热器施加电压导致加热器温度升高并产生热量。 热量通过热分离器渗透到可调节电阻器。 当电阻器的温度增加到特定温度范围内的值时,可调整电阻器的电阻永久地增加或减小。
-
-
-
-
-