Heat exchanger including furcating unit cells

    公开(公告)号:US11892245B2

    公开(公告)日:2024-02-06

    申请号:US16988314

    申请日:2020-08-07

    CPC classification number: F28D7/1623 F28F1/022

    Abstract: A heat exchanger is provided that can include furcating unit cells coupled with each other. Each of the unit cells can be elongated along an axis and include a sidewall that defines annular ring openings on opposite ends of the unit cell along the axis. The sidewall also can define undulating annular rings between the annular ring openings and axially separated from each other along the axis. The sidewall can further define angled openings into the unit cell both above and below each of the undulating annular rings. At least a first opening of the annular ring openings and the angled openings can be configured to be an inlet to receive a first fluid into the unit cell and at least a second opening of the annular ring openings and the angled openings configured to be an outlet through which the first fluid exits the unit cell.

    Circular crossflow heat exchanger
    23.
    发明授权

    公开(公告)号:US11561048B2

    公开(公告)日:2023-01-24

    申请号:US16804538

    申请日:2020-02-28

    Abstract: A heat exchange module, a heat exchanger and a method for additively manufacturing the heat exchanger are provided. The heat exchanger includes a plurality of stacked heat exchange modules defining a flow passageway. Each heat exchange module defining a substantially curved closed geometry defining a central axis that extends along the axial direction. Each heat exchange module includes a first heat exchanging fluid inlet, a first heat exchanging fluid outlet and a plurality of heat exchange tubes fluidly coupling the first heat exchanging fluid inlet and the first heat exchanging fluid outlet. The plurality of heat exchange tubes defining a plurality of first heat exchanging fluid flow passages of equal length and a plurality of second heat exchanging fluid flow passages of equal hydraulic diameter.

    Additively manufactured cooling assemblies for thermal and/or mechanical systems, and methods for manufacturing the assemblies

    公开(公告)号:US11112839B2

    公开(公告)日:2021-09-07

    申请号:US16271220

    申请日:2019-02-08

    Abstract: A multi-domain cooling assembly configured to be coupled with one or more heat sources includes a body having an outer surface and at least one cooling chamber disposed inside the body. The at least one cooling chamber extends in at least two orthogonal dimensions and includes a working fluid to extract thermal energy from the one or more heat sources. The assembly includes a cooling channel disposed within the body and fluidly coupled with a passageway that carries cooling fluid into and out of the cooling channel. At least a portion of the cooling fluid is a liquid phase, a gas phase, or a liquid-gas mix phase. The cooling channel is fluidly separate from the at least one cooling chamber. The cooling channel is thermally coupled with the at least one cooling chamber. The at least one cooling chamber transfers thermal energy from the working fluid to the cooling fluid.

    INVERTED HEAT EXCHANGER DEVICE
    27.
    发明申请

    公开(公告)号:US20210156624A1

    公开(公告)日:2021-05-27

    申请号:US16692728

    申请日:2019-11-22

    Abstract: An inverted heat exchanger device includes an exterior conduit elongated and extending around a center axis between a first end and second end. The exterior conduit including a body having an exterior surface, an interior surface, a center core elongated along the center axis, and plural walls extending between the center core and the interior surface. A first conduit is disposed inside the exterior conduit that includes an inlet, plural core passages, an outlet, and internal manifolds. A first fluid is configured to flow along the first conduit. A second conduit is also disposed inside the exterior conduit. The second conduit includes an inlet, plural core passages, an outlet, and internal manifolds. A second fluid is configured to flow along the second conduit. The plural walls are configured to define the first conduit and the second conduit within the body of the exterior conduit.

    Tip rail with cooling structure using three dimensional unit cells

    公开(公告)号:US10982553B2

    公开(公告)日:2021-04-20

    申请号:US16207995

    申请日:2018-12-03

    Abstract: A tip for a turbine component, turbine rotor blade or tip of a blade, is disclosed. The tip includes a tip plate configured to be coupled at a tip end of an airfoil chamber; and a tip rail extending radially from the tip plate, the tip rail disposed near or at a periphery of the tip plate. The trip rail includes a cooling structure constituting at least a portion of the tip rail. The cooling structure is in fluid communication with the airfoil chamber, and includes a plurality of repeating, three dimensional unit cells. Each unit cell defines a flow passage that is in fluid communication with the flow passage of at least one other unit cell. The flow passages of the 3D unit cells create a tortuous cooling passage in at least a portion of the tip rail.

    SYSTEMS AND METHODS FOR USING ADDITIVE MANUFACTURING FOR THERMAL MANAGEMENT

    公开(公告)号:US20200281095A1

    公开(公告)日:2020-09-03

    申请号:US16845381

    申请日:2020-04-10

    Abstract: According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.

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