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公开(公告)号:US20210189531A1
公开(公告)日:2021-06-24
申请号:US17128588
申请日:2020-12-21
Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Inventor: Qi LU , Jianfeng WANG
Abstract: A press-hardened steel component after hot forming including an alloy composition including carbon at a concentration of greater than or about 0.01 wt. % to less than or about 0.2 wt. %, chromium at a concentration of greater than or about 0.5 wt. % to less than or about 6 wt. %, manganese at a concentration of greater than or about 0.5 wt. % to less than or about 4.5 wt. %, silicon at a concentration of greater than or about 0.5 wt. % to less than or about 2.5 wt. %, and a balance of the alloy composition being iron, wherein the press-hardened steel component includes greater than or 90 volume % martensite and bainite, has an ultimate tensile strength of greater than or about 800 megapascals to less than or about 1,200 megapascals and a VDA 238-100 bending angle of greater than or about 60° to less than or about 80°.
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公开(公告)号:US20210187906A1
公开(公告)日:2021-06-24
申请号:US17128631
申请日:2020-12-21
Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Inventor: Qi LU , Jianfeng WANG
Abstract: A press-hardened steel assembly after hot stamping/hot forming including a core layer having a tensile strength of ≥about 1,800 megapascals to ≤about 2,200 megapascals and ≥about 90 volume % martensite, the core layer having a first thickness ≥about 40% to ≤about 96% of the thickness of the press-hardened steel assembly; and a first surface layer along a first surface of the core, the first surface layer having a tensile strength of ≥about 800 megapascals to ≤about 1,200 megapascals and ≥about 90 volume % martensite and bainite. The press-hardened steel assembly has a tensile strength of ≥about 1,600 megapascals to ≤about 2,000 megapascals and a VDA 238-100 bending angle of ≥about 50° to ≤about 80°.
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公开(公告)号:US20210002746A1
公开(公告)日:2021-01-07
申请号:US16460369
申请日:2019-07-02
Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Inventor: Qi LU , Jianfeng WANG
Abstract: A press-hardened steel is provided. The press-hardened steel has an alloy matrix including from about 0.01 wt. % to about 0.35 wt. % carbon, from about 1 wt. % to about 9 wt. % chromium, from about 0.5 wt. % to about 2 wt. % silicon, and a balance of iron. The alloy matrix is greater than or equal to about 95 vol. % martensite. A first layer is disposed directly on the alloy matrix. The first layer is continuous, has a thickness of greater than or equal to about 0.01 μm to less than or equal to about 10 μm, and includes an oxide enriched with chromium and silicon. A second layer is disposed directly on the first layer, and includes an oxide enriched with Fe. Methods of preparing the press-hardened steel are also provided.
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公开(公告)号:US20170129208A1
公开(公告)日:2017-05-11
申请号:US15302113
申请日:2014-04-09
Applicant: GM Global Technology Operations LLC
Inventor: Xin YANG , Jianfeng WANG
CPC classification number: B32B7/12 , B23K1/0008 , B23K1/19 , B23K35/0244 , B23K2103/172 , B23K2103/18 , B23K2103/42 , B32B15/08 , B32B37/1284 , B32B2037/1269 , B32B2250/02 , B32B2255/06 , B32B2255/205 , B32B2255/26 , C08K3/08 , C08K7/18 , C09J5/06 , C09J11/04 , C09J2400/16 , H01L21/2007
Abstract: A bonding system (100), comprising a first substrate (110), a second substrate (120), an adhesive (200), comprising a plurality of cavities (240), in contact with a first contact surface (115) and with a second contact surface (125), and a plurality of solder balls (300), in contact with the first contact surface (115), positioned in the adhesive (200) between the first substrate (110) and the second substrate (120). Also, a bonding method to produce a solder-reinforced adhesive bond joining a first substrate (110) and second substrate (120), comprising applying an adhesive (200) comprising a plurality of cavities (240) on a first contact surface (115) of the first substrate (110), positioning each of a plurality of solder balls (300) at least partially into the adhesive (200), such that each of the plurality of solder balls (300) in contact with the first contact surface (115), connecting a second contact surface (125) of the second substrate (120) to a portion of the adhesive (200) opposite the first contact surface (115), and applying heat to the first contact surface (115) such that at least one solder ball (300) reaches a solder-ball bonding temperature.
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