公开(公告)号：US20240294813A1

公开(公告)日：2024-09-05

申请号：US18623511

申请日：2024-04-01

申请人： Government of the United States, as represented by the Secretary of the Air Force

发明人： Loon-Seng Tan ,  Zhenning Yu ,  Bingqian Zheng ,  Hilmar Koerner ,  Christopher A. Crouse

IPC分类号： C09J179/08 ,  C09J5/00

CPC分类号： C09J179/085 ,  C09J5/00 ,  C09J2400/10 ,  C09J2400/14 ,  C09J2400/16 ,  C09J2400/20 ,  C09J2479/08

摘要： A family of low-molecular-weight, main-chain thermotropic liquid-crystalline polyimides (TLC-PI) that are crosslinkable is disclosed. These all-aromatic TLC-PI are derived from (i) wholly aromatic and flexible diamine monomers, in which the linkage between the two aniline-ends contains a relatively high heat-tolerant but flexible chain constituted by two or more units of 1,4-phenoxy or 1,3-phenoxy or in combinations of both. Processes of making and using such all-aromatic TLC-PI is also provided.

公开(公告)号：US20230167344A1

公开(公告)日：2023-06-01

申请号：US17922651

申请日：2021-03-30

申请人： SHIN-ETSU CHEMICAL CO., LTD.

发明人： Shinji KIMURA ,  Toshiyuki OZAI

IPC分类号： C09J183/04 ,  C09J11/04 ,  C09J11/06 ,  C08L83/16

CPC分类号： C09J183/04 ,  C09J11/04 ,  C09J11/06 ,  C08L83/16 ,  C09J2400/16 ,  C09J2483/00

摘要： A photocurable silicone composition, containing: (A) an organopolysiloxane having at least one specific structure having a (meth)acryl group in the molecule; (B) an organohydrogenpolysiloxane having at least two hydrogen atoms bonded to a silicon atom in one molecule; (C) a photo-radical polymerization initiator; and (D) a platinum-group metal catalyst to be activated by light having a wavelength of 200 to 500 nm. The photocurable silicone composition has good storability, and good surface curability and deep-part curability in the air; an adhesive consisting of this photocurable silicone composition; and a cured material of this photocurable silicone composition.

公开(公告)号：US20190185721A1

公开(公告)日：2019-06-20

申请号：US16328028

申请日：2017-08-21

申请人： AMOGREENTECH CO., LTD.

发明人： In Yong SEO ,  Ui Young JEONG

IPC分类号： C09J7/38 ,  C09J9/02 ,  C09J7/21 ,  C09J201/02 ,  C09J7/29

CPC分类号： C09J7/38 ,  C09J7/21 ,  C09J7/29 ,  C09J9/02 ,  C09J201/02 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2400/16 ,  C09J2400/26 ,  D04H3/005

摘要： Provided are a pressure-sensitive adhesive tape, a method of manufacturing the same, and an electronic device having the same. The pressure-sensitive adhesive tape includes: a fiber accumulation type substrate in which a plurality of fibers are accumulated to form a plurality of pores therebetween; a metal coating layer coated on the outer circumferential surfaces of the plurality of fibers of the fiber accumulation type substrate; and an electrically conductive adhesive layer formed on one side or both sides of the fiber accumulation type substrate on which the metal coating layer is formed, wherein the electrically conductive adhesive layer is formed of an electrically conductive adhesive material filled in the plurality of pores and is electrically connected by an applied pressure.

公开(公告)号：US20190040286A1

公开(公告)日：2019-02-07

申请号：US15831548

申请日：2017-12-05

申请人： HO SEUP MOON ,  Truss Co., Ltd.

发明人： HO SEUP MOON

IPC分类号： C09J9/02 ,  C09J201/00 ,  C08K3/08

CPC分类号： C09J9/02 ,  C08J2300/26 ,  C08K3/08 ,  C08K2003/0812 ,  C08K2003/085 ,  C08K2003/0862 ,  C08K2003/0887 ,  C08K2201/003 ,  C09J7/28 ,  C09J7/38 ,  C09J11/04 ,  C09J201/00 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2400/16 ,  C09J2400/163 ,  C09J2467/006

摘要： Provided are a conductive adhesive tape including a compressible conductive powder, which is manufactured by applying a conductive adhesive prepared by mixing a conductive powder having a conductive metal-coated outer surface and an adhesive resin at a certain ratio on one surface or both surfaces of a conductive substrate and is easily and evenly attached to an attachment surface by preventing a protrusion phenomenon through deformable characteristics with respect to pressing, and a manufacturing method thereof.

公开(公告)号：US20240360341A1

公开(公告)日：2024-10-31

申请号：US18639378

申请日：2024-04-18

申请人： tesa SE

发明人： Thorsten Krawinkel ,  Shuang Wang

IPC分类号： C09J7/28 ,  C09J11/04 ,  C09J11/06 ,  C09J133/10

CPC分类号： C09J7/28 ,  C09J11/04 ,  C09J11/06 ,  C09J133/10 ,  C09J2301/124 ,  C09J2301/16 ,  C09J2301/208 ,  C09J2301/302 ,  C09J2301/314 ,  C09J2301/408 ,  C09J2301/412 ,  C09J2301/502 ,  C09J2400/16 ,  C09J2433/00

摘要： An adhesive tape, and adhesive tape assembly, that includes: a first layer of adhesive (D), the layer (D) comprising at least one electrolyte; a second layer of adhesive (C), the layer (C) being electrically conductive; and an electrically conductive carrier layer (T), the carrier layer (T) disposed between the first layer (D) and the second layer (C). Further, the layers (D), (T), and (C) are disposed one above another such that none of the layers (D), (T), and (C) laterally protrudes beyond any of the other layers (D), (T), and (C). The adhesive tape assembly can further include a first substrate (A) that is electrically conductive, a second substrate (B) disposed on a face of the second layer (C) that is opposite the carrier layer (T), and wherein the second layer (C) laterally protrudes beyond the substrate (B) such that the layer (C) has an exposed face.

公开(公告)号：US20240116104A1

公开(公告)日：2024-04-11

申请号：US18275891

申请日：2021-09-06

申请人： Mitsui Mining & Smelting Co., Ltd.

发明人： Satoshi KONNO ,  Shinichi YAMAUCHI ,  Kei ANAI

IPC分类号： B22F1/052 ,  B22F1/054 ,  B22F1/10 ,  B22F3/10 ,  B22F7/06 ,  B22F7/08 ,  B32B7/12 ,  B32B9/00 ,  B32B9/04 ,  B32B15/20 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  H01B1/22 ,  H01L23/00

CPC分类号： B22F1/052 ,  B22F1/056 ,  B22F1/10 ,  B22F3/1007 ,  B22F7/064 ,  B22F7/08 ,  B32B7/12 ,  B32B9/007 ,  B32B9/04 ,  B32B15/20 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  H01B1/22 ,  H01L24/29 ,  B22F2201/02 ,  B22F2301/10 ,  B22F2304/05 ,  B22F2304/10 ,  B22F2998/10 ,  B22F2999/00 ,  B32B2250/02 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2264/1055 ,  B32B2264/302 ,  B32B2307/202 ,  B32B2457/00 ,  C09J2400/16 ,  H01L23/49513

摘要： A conductive composition for bonding includes a mix of copper powder carboxylic acid. The carboxylic acid has a branched carbon chain. The copper powder comprises first and second copper particles. The first copper particles have a volume-based cumulative particle size D50 of 0.11 μm or more and less than 1 μm at a cumulative volume of 50 vol % in a region of particle sizes of less than 1 μm in a particle size distribution of the copper powder. The second copper particles have a volume-based cumulative particle size D50 of 1 μm or more and 10 μm or less at a cumulative volume of 50 vol % in a region of particle sizes of 1 μm or more in the particle size distribution of the copper powder. The carboxylic acid is contained in an amount of 6 parts or more and 24 parts or less per 100 parts by mass.

公开(公告)号：US11746260B2

公开(公告)日：2023-09-05

申请号：US16758997

申请日：2018-11-02

申请人： Zephyros, Inc.

发明人： Jeff Apfel

IPC分类号： C09J7/35 ,  C08F220/18 ,  C08F236/22 ,  C08K3/08 ,  C08K3/22 ,  C08K5/01 ,  C08K5/14 ,  C09J123/08 ,  C09J131/04 ,  C09J133/08

CPC分类号： C09J7/35 ,  C08F220/1804 ,  C08F236/22 ,  C08K3/08 ,  C08K3/22 ,  C08K5/01 ,  C08K5/14 ,  C09J123/08 ,  C09J131/04 ,  C09J133/08 ,  C08K2003/0856 ,  C08K2003/2296 ,  C08K2201/003 ,  C09J2301/414 ,  C09J2400/16

摘要： An adhesive/sealant material for induction heating including copolymer of ethylene and butyl acrylate and a metallic filler. The metallic filler may be present in an amount of at least about 30% by weight of the adhesive/sealant material.

公开(公告)号：US20180352660A1

公开(公告)日：2018-12-06

申请号：US15778369

申请日：2016-12-06

申请人： DIC Corporation

发明人： Koji HAYASHI ,  Sumio SHIMOOKA ,  Shota TANII ,  Akinori MORINO

IPC分类号： H05K3/38 ,  H05K1/02 ,  H05K3/46 ,  C09J7/21 ,  C09J7/20 ,  C09J7/28 ,  C09J7/35 ,  C09J11/04 ,  C09J7/25 ,  C09J5/06

CPC分类号： H05K3/386 ,  C08K2201/001 ,  C09J5/06 ,  C09J7/205 ,  C09J7/21 ,  C09J7/255 ,  C09J7/28 ,  C09J7/35 ,  C09J9/02 ,  C09J11/04 ,  C09J201/00 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/106 ,  C09J2400/16 ,  C09J2400/163 ,  C09J2463/00 ,  C09J2467/005 ,  C09J2467/006 ,  H05K1/028 ,  H05K1/0281 ,  H05K3/0058 ,  H05K3/4644 ,  H05K2203/1105

摘要： An object of the present invention relates to a thermosetting adhesive sheet that, without the use of a metal reinforcement sheet, which is regarded as a major factor responsible for an increase in thickness of electronic devices and other devices, reinforces a flexible printed circuit to such a level that detachment of mounted components, for example, is prevented, prevents warping, and has good electrical conductivity. The present invention relates to a thermosetting adhesive sheet configured to be used to reinforce a flexible printed circuit. The thermosetting adhesive sheet includes a woven fabric, a nonwoven fabric, or a metal base of 50 μm or less thickness and a thermosetting adhesive layer adjacent to at least one surface of the woven fabric, the nonwoven fabric, or the metal base of 50 μm or less thickness.

公开(公告)号：US10066132B2

公开(公告)日：2018-09-04

申请号：US15142030

申请日：2016-04-29

申请人： Avery Dennison Corporation

发明人： Peter J. Heederik ,  Santosh L. Hire ,  Darren B. Milligan

IPC分类号： C09J133/02 ,  G09F3/02 ,  G09F3/10 ,  C09J11/04 ,  B32B7/06 ,  B32B7/12 ,  B32B15/04 ,  B32B15/08 ,  B32B15/12 ,  B32B27/08 ,  B32B27/10 ,  B32B27/32 ,  B32B29/00 ,  C09J7/20 ,  C09J7/38 ,  C09J7/22 ,  C09J7/24 ,  C09J7/28 ,  C09J7/29 ,  C09J7/21

CPC分类号： C09J133/02 ,  B32B7/06 ,  B32B7/12 ,  B32B15/04 ,  B32B15/08 ,  B32B15/12 ,  B32B27/08 ,  B32B27/10 ,  B32B27/32 ,  B32B29/002 ,  B32B2255/10 ,  B32B2255/12 ,  B32B2255/26 ,  B32B2307/41 ,  B32B2307/412 ,  B32B2307/7265 ,  B32B2307/748 ,  B32B2519/00 ,  C09J7/20 ,  C09J7/21 ,  C09J7/22 ,  C09J7/243 ,  C09J7/28 ,  C09J7/29 ,  C09J7/38 ,  C09J11/04 ,  C09J2203/334 ,  C09J2400/143 ,  C09J2400/16 ,  C09J2423/006 ,  C09J2433/00 ,  G09F3/02 ,  G09F3/10 ,  G09F2003/0241 ,  G09F2003/0257

摘要： Various opacifying adhesive compositions are described. The adhesives exhibit relatively high levels of opacity in wet conditions while maintaining acceptable adhesive properties. Also described are label assemblies and labeled containers using such adhesives. Related methods of use and preparation are also described.

公开(公告)号：US20180213898A1

公开(公告)日：2018-08-02

申请号：US15884025

申请日：2018-01-30

申请人： Chi Huynh

发明人： Chi Huynh

IPC分类号： A44C17/02 ,  C09J1/00 ,  C09J5/06

CPC分类号： A44C17/02 ,  A44C17/007 ,  A44C17/04 ,  A44C27/002 ,  C09J1/00 ,  C09J5/06 ,  C09J2400/14 ,  C09J2400/16

摘要： A method of manufacturing an article of jewelry with a druzy or geode effect, the method including: forming an adhesion mixture by mixing metal particles with a silica, shell, and/or clay with polymer, optionally in a liquid to form an adhesion paste; applying the adhesion mixture to an article of jewelry; applying a plurality of gemstones to the applied adhesion mixture to form a gemstone layer; melting the adhesion mixture without significantly melting the article of jewelry; and cooling the adhesion mixture to bond the gemstone layer to the article of jewelry.