公开(公告)号：US20170164117A1

公开(公告)日：2017-06-08

申请号：US15311152

申请日：2014-08-26

Applicant: GOERTEK INC.

Inventor： Quanbo ZOU ,  Zhe WANG

IPC: H04R19/00 ,  B81B3/00 ,  H04R31/00 ,  B81C1/00

CPC classification number: H04R19/005 ,  B81B3/001 ,  B81B7/00 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/04 ,  B81B2207/012 ,  B81C1/0023 ,  B81C2203/0118 ,  B81C2203/058 ,  B81C2203/0785 ,  H04R19/04 ,  H04R31/00 ,  H04R31/006 ,  H04R2201/003

Abstract: The present invention provides a method for manufacturing a fully wafer-level-packaged MEMS microphone and a microphone manufactured with the same, the method comprises: separately manufacturing a first packaging wafer, an MEMS microphone wafer and a second packaging wafer; performing wafer-to-wafer bonding for the three wafers to form a plurality of fully wafer-level-packaged MEMS microphone units; singulating the fully wafer-level-packaged MEMS microphone units to form a plurality of fully wafer-level-packaged MEMS microphones, which are fully packaged at wafer level and do not need any further process after die singulation. The method can improve cost-effectiveness, performance consistency, manufacturability, quality, scaling capability of the packaged MEMS microphone.

公开(公告)号：US20170055081A1

公开(公告)日：2017-02-23

申请号：US15119116

申请日：2014-07-15

Applicant: GOERTEK INC.

Inventor： Quanbo ZOU ,  Zhe WANG

IPC: H04R7/14 ,  H04R1/04 ,  B81B3/00 ,  H04R19/04

CPC classification number: H04R7/14 ,  B81B3/0021 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/019 ,  B81C1/0023 ,  B81C2201/115 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/15192 ,  H04R1/04 ,  H04R19/016 ,  H04R19/04 ,  H04R2201/003 ,  H04R2307/027 ,  H01L2924/00014

Abstract: The present invention provides a silicon microphone with a high-aspect-ratio corrugated diaphragm and a microphone package including the same. The microphone comprises the corrugated diaphragm on which at least one ring-shaped corrugation is formed in the vicinity of the edge of the diaphragm which is fixed to the substrate, the corrugated diaphragm is flexible, wherein the ratio of the depth of the corrugation to the thickness of the diaphragm is larger than 5:1, preferably 20:1, and the walls of the corrugation are inclined to the surface of the diaphragm at an angle in the range of 80° to 100°. The microphone with the high-aspect-ratio corrugated diaphragm can achieve a consistent and optimal sensitivity and greatly reduce impact applied thereto in a drop test so that the performances, the reproducibility, the reliability and the yield can be improved. The microphone package of the present invention further provides a simplified processing, an improved sensitivity and an improved SNR.

Abstract translation: 本发明提供一种具有高纵横比的波纹状隔膜的硅麦克风和包括该硅麦克风的麦克风封装。 麦克风包括波纹膜片，在该波纹膜片上，在隔膜的边缘附近形成有至少一个环形波纹，该波纹膜片固定到基底上，波纹膜片是柔性的，其中波纹深度与 隔膜的厚度大于5:1，优选为20:1，并且波纹壁相对于隔膜的表面以80°至100°的范围内的角度倾斜。 具有高纵横比波纹膜片的麦克风可以实现一致和最佳的灵敏度，并且在跌落测试中大大降低了对其的影响，从而可以提高性能，再现性，可靠性和产量。 本发明的麦克风封装还提供简化的处理，改进的灵敏度和改进的SNR。