-
公开(公告)号：US10016983B2
公开(公告)日：2018-07-10
申请号：US15304767
申请日：2014-04-24
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Chien-Hua Chen , Michael W Cumbie , Devin Alexander Mourey
CPC classification number: B41J2/17553 , B41J2/14145 , B41J2/1601 , B41J2/1623 , B41J2/17513 , B41J2/17559 , B41J2002/14362
Abstract: An ink delivery device is described. The ink delivery device includes an ink die with a first surface. The ink delivery device also includes an overmold to encapsulate a number of surfaces of the ink die. The overmold has a second surface that is wider than the first surface. The second surface receives an adhesive to attach the ink delivery device to a printhead. The ink delivery device also includes an ink slot passing through the overmold and at least a portion of the ink die.
-
公开(公告)号：US20170036451A1
公开(公告)日：2017-02-09
申请号：US15304767
申请日：2014-04-24
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Chien-Hua CHEN , Michael W Cumbie , Devin Alexander Mourey
IPC: B41J2/175
CPC classification number: B41J2/17553 , B41J2/14145 , B41J2/1601 , B41J2/1623 , B41J2/17513 , B41J2/17559 , B41J2002/14362
Abstract: An ink delivery device is described. The ink delivery device includes an ink die with a first surface. The ink delivery device also includes an overmold to encapsulate a number of surfaces of the ink die. The overmold has a second surface that is wider than the first surface. The second surface receives an adhesive to attach the ink delivery device to a printhead. The ink delivery device also includes an ink slot passing through the overmold and at least a portion of the ink die.
Abstract translation: 描述了墨水输送装置。 油墨输送装置包括具有第一表面的油墨模头。 墨水输送装置还包括用于封装墨水模具的多个表面的包覆成型。 包覆模具具有比第一表面更宽的第二表面。 第二表面接收粘合剂以将墨水输送装置附着到打印头。 墨水输送装置还包括通过包覆成型体和至少一部分墨水模头的墨水槽。
-
公开(公告)号：US20160009086A1
公开(公告)日：2016-01-14
申请号：US14770608
申请日：2013-09-27
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Silam J. Choy , Michael W. Cumbie , Devin Alexander Mourey , Chien-Hua Chen
CPC classification number: B41J2/1637 , B41J2/14 , B41J2/16 , B41J2002/14491 , B41J2202/19 , B41J2202/20
Abstract: In one example, a printhead includes: a printhead die having a front face along which fluid may be dispensed from the die, the die molded into a monolithic molding having a channel therein through which fluid may pass directly to a back part of the die, the front face of the die exposed outside the molding and the back part of the die covered by the molding except at the channel; an electrical contact exposed outside the molding to connect to circuitry external to the printhead; a printed circuit board molded into the molding, the printed circuit board having an exposed front face co-planar with and surrounding the exposed front face of the die and a conductor electrically connected to the contact; and an electrical connection between the die and the printed circuit board conductor fully encapsulated in the molding.
Abstract translation: 在一个示例中，打印头包括：打印头芯片，其具有可以从模具分配流体的前表面，模具模制成具有通道的整体模制件，流体可以通过该通道直接传递到模具的后部， 裸露在模具外部的模具的前表面和除了通道之外的由模制物覆盖的模具的后部; 暴露在模制件外部以连接到打印头外部的电路的电触头; 模制到模制品中的印刷电路板，印刷电路板具有与裸露的前表面共面并且围绕裸露的前表面的暴露的前表面和与触点电连接的导体; 以及在模具和完全封装在模制件中的印刷电路板导体之间的电连接。
-
公开(公告)号：US20150316465A1
公开(公告)日：2015-11-05
申请号：US14377708
申请日：2012-02-28
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Devin Alexander Mourey , Vladek Kasperchik , James William Stasiak
CPC classification number: G01N21/01 , G01N21/658 , G01N2201/02 , G01N2201/068
Abstract: The present disclosure describes a surface enhanced Raman spectroscopy (SERS) apparatus and methods of forming and using the SERS apparatus. An example of a SERS apparatus includes a nanoporous material on an upper surface of a substrate, a plurality of SERS-active structures on an upper surface of the nanoporous material, and a Raman-active material on a surface of each of SERS-active structures.
Abstract translation: 本公开描述了表面增强拉曼光谱（SERS）装置以及形成和使用SERS装置的方法。 SERS装置的实例包括在基底的上表面上的纳米多孔材料，在纳米多孔材料的上表面上的多个SERS-活性结构，以及每个SERS活性结构的表面上的拉曼活性物质 。
-
公开(公告)号：US20240253303A1
公开(公告)日：2024-08-01
申请号：US18290081
申请日：2021-06-03
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Karsten N. Wilson , Emre Hiro Discekici , Vladek Kasperchik , Timothy L. Weber , Mark Kowalski , Sterling Chaffins , Devin Alexander Mourey
IPC: B29C64/165 , B33Y10/00 , B33Y30/00 , B33Y70/00
CPC classification number: B29C64/165 , B33Y10/00 , B33Y30/00 , B33Y70/00
Abstract: A method of three-dimensional printing can include iteratively applying a polymer build material as individual layers to a powder bed, where the polymer build material includes from about 80 wt % to 100 wt % polymeric particles, and based on a three-dimensional object model, selectively applying a coalescing agent onto individual layers of the polymer build material. The coalescing agent can include an aqueous liquid vehicle and a coalescing solvent that depresses a melting point of the polymeric particles. The method can include exposing the powder bed to heat to selectively coalesce portions of individual layers of the polymer build material in contact with the coalescing solvent. The heat may not be sufficient to coalesce the polymer build material that is not in contact with the coalescing solvent and may be sufficient to fuse the polymeric particles in contact with the coalescing solvent together to form a three-dimensional object.
-
Patent Agency Ranking
公开(公告)号：US11597646B2
公开(公告)日：2023-03-07
申请号：US16098991
申请日：2016-07-26
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Chien-Hua Chen , Devin Alexander Mourey , Michael W. Cumbie , Si-lam Choy
Abstract: A device includes: a die including a microfluidic device; a polymer substrate formed around the die; and a separate fluid manifold attached to the polymer substrate over the die and on a same side of the substrate as the die, the manifold to deliver fluid to the die.
-
公开(公告)号：US11440009B2
公开(公告)日：2022-09-13
申请号：US16097460
申请日：2016-07-15
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Chien-Hua Chen , Michael W. Cumbie , Devin Alexander Mourey
Abstract: A method may include etching a number of holes into a carrier wafer layer to form a plurality of filters in the carrier wafer layer, patterning a chamber layer over a first side of the carrier wafer layer to form chambers above each filter formed in the carrier wafer layer, forming a layer over the chamber layer, grinding a second side of the carrier wafer layer to expose the number of holes etched into the carrier wafer layer, and bonding a molded substrate to the carrier wafer layer opposite the chamber layer.
-
公开(公告)号：US11440008B2
公开(公告)日：2022-09-13
申请号：US16084765
申请日：2016-04-14
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Devin Alexander Mourey , Michael W Cumbie , Garrett E Clark
Abstract: Examples include microfluidic devices. Example microfluidic devices comprise a microfluidic channel, a capillary chamber, and a fluidic actuator. The microfluidic channel is fluidly connected to the capillary chamber. The capillary chamber is to restrict flow of fluid therethrough. The fluidic actuator is positioned proximate the capillary chamber. The fluidic actuator is to actuate to thereby initiate flow of fluid through the capillary chamber.
-
公开(公告)号：US11046084B2
公开(公告)日：2021-06-29
申请号：US16092350
申请日：2016-04-21
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Michael W. Cumbie , Chien-Hua Chen , Devin Alexander Mourey , Anthony D. Studer
Abstract: In one example a liquid level sensing device is described. The device includes a carrier and a liquid level sensing device disposed on the carrier. The liquid level sensing interface has an aspect ratio of at least 1:50. A number of liquid level sensing components are disposed on the liquid level sensing interface. The number of liquid level sensing components detect a liquid level in a liquid container. The liquid level sensing device also includes an electrical interconnect to output data collected from the number of liquid level sensing components.
-
公开(公告)号：US10377142B2
公开(公告)日：2019-08-13
申请号：US15988206
申请日：2018-05-24
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Chien-Hua Chen , Michael W. Cumbie , Devin Alexander Mourey
Abstract: An ink delivery device is described. The ink delivery device includes an ink die with a first surface. The ink delivery device also includes an overmold to encapsulate a number of surfaces of the ink die. The overmold has a second surface that is wider than the first surface. The second surface receives an adhesive to attach the ink delivery device to a printhead. The ink delivery device also includes an ink slot passing through the overmold and at least a portion of the ink die.
-
-
-
-
-
-
-
-
-
Search Results
43
records
(took 0.036 seconds)
