公开(公告)号：US20230219172A1

公开(公告)日：2023-07-13

申请号：US18014495

申请日：2021-03-29

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO

IPC: B23K26/53 ,  B23K26/40

CPC classification number: B23K26/53 ,  B23K26/40 ,  B23K2101/40

Abstract: A laser processing device includes: a light source configured to output laser light; a space light modulator for modulating the laser light output from the light source in accordance with a modulation pattern and outputting the modulated laser light; a converging lens for converging the laser light output from the space light modulator to an object, and forming a converging spot on the object; a movement unit for relatively moving the converging spot with respect to the object; and a control unit for relatively moving, while setting a position of the converging spot in a Z direction intersecting with an incident surface of the laser light on the object at a first Z position, the converging spot along a line extended in an X direction along the incident surface by controlling at least the space light modulator and the movement unit.

公开(公告)号：US20230154774A1

公开(公告)日：2023-05-18

申请号：US17916837

申请日：2021-03-31

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Takafumi OGIWARA ,  Iku SANO

IPC: H01L21/67 ,  H01L21/66 ,  B23K26/53

CPC classification number: H01L21/67253 ,  H01L22/12 ,  H01L22/24 ,  B23K26/53

Abstract: An inspection device includes: a laser irradiation unit; an imaging unit; and a control unit. The control unit is configured to execute a processing process of controlling the laser irradiation unit according to a recipe set such that a plurality of modified regions are formed inside a wafer by irradiating the wafer with a laser beam and a full-cut state where cracks extending from the modified regions have reached a back surface and a surface is attained; an identification process of identifying a state of the crack on the back surface extending from the modified region, and a state of at least one of the modified regions and the cracks inside the wafer, based on a signal; and a determination process of determining whether or not a dicing force applied to the wafer according to the recipe is proper, based on information identified in the identification process.

公开(公告)号：US20230113051A1

公开(公告)日：2023-04-13

申请号：US17908293

申请日：2021-03-03

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Takafumi OGIWARA ,  Iku SANO

IPC: H01L21/67 ,  H01L21/66

Abstract: This inspection device includes: a laser irradiation unit that irradiates a wafer having a back surface and a front surface with a laser beam from the back surface side of the wafer; an imaging unit that outputs light having permeability to the wafer and detects the light propagating through the wafer; and a control part configured to perform a first process of controlling the laser irradiation unit so that a modified region is formed inside the wafer by irradiating the wafer with the laser beam and a second process of deriving a position of the modified region on the basis of a signal output from the imaging unit that detects the light and deriving a thickness of the wafer on the basis of the derived position of the modified region and a set recipe.

公开(公告)号：US20230086426A1

公开(公告)日：2023-03-23

申请号：US17795309

申请日：2021-01-18

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Katsuhiro KOREMATSU ,  Takeshi SAKAMOTO

IPC: B23K26/06

Abstract: A laser processing apparatus emits a laser light with a part of a focusing region being on an object to form a modified region along a virtual plane inside the object. The laser processing apparatus includes a support portion, an emission portion that emits the laser light onto the object, a moving mechanism that moves at least one of the support portion and the emission portion so that the part of the focusing region moves along the virtual plane inside the object, and a controller. The emission portion includes a shaping portion that shapes the laser light such that the shape of the part of the focusing region in a plane perpendicular to an optical axis of the laser light has a longitudinal direction. The longitudinal direction is a direction intersecting the direction of movement of the part of the focusing region.

公开(公告)号：US20220001494A1

公开(公告)日：2022-01-06

申请号：US17288841

申请日：2019-10-30

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Katsuhiro KOREMATSU

IPC: B23K26/53 ,  B23K26/00 ,  B23K26/03 ,  B23K26/082 ,  B23K26/06 ,  B23K26/064

Abstract: A laser processing apparatus includes an irradiation portion, and a controller. The irradiation portion includes a shaping portion configured to shape the laser light. The controller includes: a determination portion configured to determine a first and a second orientation; a processing controller configured to perform a first process of forming the modified region along a first region and stopping formation of the modified region other than the first region, and a second process of forming the modified region along a second region and stopping formation of the modified region other than the second region; and an adjustment portion configured to adjust the orientation of the longitudinal direction to be the first orientation when the first process is performed, and to adjust the orientation of the longitudinal direction to be the second orientation when the second process is performed.

公开(公告)号：US20210402516A1

公开(公告)日：2021-12-30

申请号：US17289011

申请日：2019-10-30

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Junji OKUMA

IPC: B23K26/08 ,  B23K26/351 ,  B23K26/06

Abstract: A laser processing apparatus includes a support portion, a laser processing head, a vertical movement mechanism, a horizontal movement mechanism, and a controller. The controller controls starting and stopping of emission of a laser light from the laser processing head based on rotation information in a state where a focusing point is positioned at a position along a circumferential edge of an effective region in a target, while rotating the support portion, to perform a circumferential edge process for forming a modified region along the circumferential edge of the effective region in the target.

公开(公告)号：US20210398856A1

公开(公告)日：2021-12-23

申请号：US17288613

申请日：2019-10-30

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Junji OKUMA

IPC: H01L21/78 ,  B23K26/0622 ,  B23K26/53 ,  B23K26/18 ,  H01L21/67

Abstract: A laser processing method includes a laser light emitting step of emitting a pulsed laser light along a line from a back surface of a target having a functional element layer on side of a front surface. The laser light emitting step includes: a first step of irradiating the functional element layer with a first pulsed laser light along the line, to form a weakened region in the functional element layer along the line; and a second step of emitting a second pulsed laser light into the target to follow the first pulsed laser light along the line, to form a crack reaching the front surface along the line in the target. The first pulsed laser light has a pulse width that is shorter than a pulse width of the second pulsed laser light.

公开(公告)号：US20210394303A1

公开(公告)日：2021-12-23

申请号：US17288821

申请日：2019-10-30

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Junji OKUMA

IPC: B23K26/04 ,  B23K26/03 ,  B23K26/064 ,  G01B11/14 ,  G02B27/10 ,  G02B13/22

Abstract: A laser processing head includes: a housing; an entrance portion; an adjustment portion; and a condensing portion. A distance between a third wall portion and a fourth wall portion facing each other in a second direction is shorter than a distance between a first wall portion and a second wall portion facing each other in a first direction. The housing is configured to be attached to an attachment portion of a laser processing apparatus, with at least one of the first wall portion, the second wall portion, the third wall portion, and a fifth wall portion disposed on the side of the attachment portion. The condensing portion is disposed on a sixth wall portion, and is offset toward the fourth wall portion in the second direction.

公开(公告)号：US20210057222A1

公开(公告)日：2021-02-25

申请号：US16633808

申请日：2018-07-13

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Ryuji SUGIURA ,  Yuta KONDOH ,  Naoki UCHIYAMA

IPC: H01L21/268 ,  H01L21/683 ,  H01L25/065

Abstract: A laminated element manufacturing method includes a first forming step of forming a first modified region along a line to cut by irradiating a semiconductor substrate of a first wafer with a laser light along the line to cut, a first grinding step of grinding the semiconductor substrate of the first wafer, a bonding step of bonding a circuit layer of a second wafer to the semiconductor substrate of the first wafer, a second forming step of forming a second modified region along the line to cut by irradiating a semiconductor substrate of the second wafer with a laser light along the line to cut, and a second grinding step of grinding the semiconductor substrate of the second wafer.

公开(公告)号：US20210053158A1

公开(公告)日：2021-02-25

申请号：US16605300

申请日：2018-04-12

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Tomoya TAGUCHI

IPC: B23K26/364 ,  B23K26/38 ,  B23K26/53 ,  H01L21/3065 ,  H01L21/78 ,  H01L21/311

Abstract: An object cutting method includes: a first step of preparing an object to be processed including a single crystal silicon substrate and a functional device layer provided on a first main surface side and forming an etching protection layer on a second main surface of the object; a second step of irradiating the object with laser light to form at least one row of modified regions in the single crystal silicon substrate and to form a fracture in the object so as to extend between the at least one row of modified regions and a surface of the etching protection layer; and a third step of performing dry etching on the object from the second main surface side, in a state in which the etching protection layer is formed on the second main surface, to form a groove opening to the second main surface.