Apparatus for cleaning printing press blanket cylinder and method for
manufacturing the same
    21.
    发明授权
    Apparatus for cleaning printing press blanket cylinder and method for manufacturing the same 失效
    印刷机用橡皮滚筒清洗装置及其制造方法

    公开(公告)号:US5404819A

    公开(公告)日:1995-04-11

    申请号:US283168

    申请日:1994-08-03

    IPC分类号: B41F35/06 B41L41/06

    CPC分类号: B41F35/06 B41P2235/246

    摘要: A blanket cylinder cleaning apparatus includes a pressure pad for pressing a cleaning fabric against a rotating blanket cylinder in a printing press to wipe away unwanted matter such as residual ink on the peripheral surface of the blanket cylinder. The pressure pad is hollow and filled with gelatinous viscoelastic material to stably bring the cleaning fabric into adequate contact with the blanket cylinder to efficiently clean the blanket cylinder. The viscoelastic material is solated with heat and readily injected into the inside space of the pressure pad.

    摘要翻译: 橡皮布滚筒清洁装置包括用于将清洁织物压靠在印刷机中的旋转橡皮布滚筒上的压垫,以擦除不需要的物质,例如橡皮布滚筒的外周表面上的残留墨。 压力垫是中空的并且填充有凝胶状粘弹性材料,以稳定地使清洁织物与橡皮滚筒充分接触以有效地清洁橡皮布滚筒。 粘弹性材料被热固化并容易地注入到压力垫的内部空间中。

    Device and method for detecting foreign material on the surface of plasma processing apparatus
    24.
    发明授权
    Device and method for detecting foreign material on the surface of plasma processing apparatus 失效
    用于检测等离子体处理装置表面的异物的装置和方法

    公开(公告)号:US07526948B2

    公开(公告)日:2009-05-05

    申请号:US11214963

    申请日:2005-08-31

    IPC分类号: G01N1/08 G01M19/00 H01L21/66

    摘要: A detection technique for detecting foreign material on the surface of a plasma processing apparatus, capable of accurately sucking/extracting and measuring foreign material contained in the measurement object surface is provided. The detection device comprises a gauge head or probe having a gas blow out opening for intermittently blowing a gas of a predetermined pressure to a measurement object surface and a gas suction opening for sucking foreign material discharged by the gas blown out from the gas blow out opening a particle counter having a suction pump for continuously sucking in a predetermined amount of gas from the gas suction opening for counting the number of foreign material particles contained in the gas sucked by the suction pump and a pressure adjustment unit for intermittently supplying gas of a predetermined pressure to the gas blowing out opening.

    摘要翻译: 提供一种用于检测等离子体处理装置表面上异物的检测技术,其能够精确地吸取/提取和测量包含在测量对象表面中的异物。 检测装置包括具有用于间歇地向测量对象表面吹送预定压力的气体的气体吹出口的测量头或探针,以及用于吸入从气体吹出口吹出的气体排出的异物的吸气口 具有吸入泵的颗粒计数器,用于连续吸入来自吸入口的预定量的气体,用于计数由吸入泵抽吸的气体中包含的异物颗粒的数量;以及压力调节单元,用于间歇地供给预定的 对气体吹出口的压力。

    Method for processing semiconductor
    25.
    发明授权
    Method for processing semiconductor 有权
    半导体处理方法

    公开(公告)号:US07473332B2

    公开(公告)日:2009-01-06

    申请号:US11066221

    申请日:2005-02-28

    IPC分类号: H01L21/00 C23C16/00 C22C14/00

    摘要: A method of processing a semiconductor which includes providing a process gas supply unit for supplying a process gas to a sample stand to hold a sample in a process chamber and to the process chamber, successively supplying a plurality of samples of a lot to the process chamber to conduct an intra-lot successive process, predicting, before a lot process is started and according to sensor data detected by a state sensor to detect a state in the process chamber, intra-lot variation patterns of results of the intra-lot successive process, and changing, according to a result of the prediction by the intra-lot variation pattern prediction unit, a process condition applied to a sample of the lot and conducting the lot process.

    摘要翻译: 一种处理半导体的方法,包括提供用于向样品台供应处理气体的处理气体供应单元,以将样品保持在处理室和处理室中,将多个样品批次连续地供应到处理室 进行批量间连续处理,在大量处理开始之前,根据由状态传感器检测到的传感器数据来检测处理室中的状态,批量间连续处理的结果的批内变化模式 并且根据批内变化模式预测单元的预测结果,改变应用于批次的样本的处理条件并进行批次处理。

    Process monitoring device for sample processing apparatus and control method of sample processing apparatus
    26.
    发明申请
    Process monitoring device for sample processing apparatus and control method of sample processing apparatus 有权
    样品处理装置的过程监控装置和样品处理装置的控制方法

    公开(公告)号:US20070162172A1

    公开(公告)日:2007-07-12

    申请号:US11645680

    申请日:2006-12-27

    IPC分类号: G06F19/00

    摘要: A plasma processing method for processing a sample by using plasma on a lot unit basis, including: detecting plural kinds of information as monitor data relating to a processing state of the sample, using a plurality of sensors; selecting a detection time range of the monitor data thus detected; converting the monitor data within the selected detection time range into a converted signal; predicting a pattern shape of the sample based on the converted signal; calculating a correction quantity of a processing parameter, for decreasing a deviation between the predicted pattern shape and a standard value; and converting the correction quantity of a processing parameter obtained by the calculating operation when a kind of a next sample of a next lot is different from the sample, thereby to use a converted correction quantity of the processing parameter for a processing of the next sample.

    摘要翻译: 一种等离子体处理方法,用于通过使用基于批量单位的等离子体处理样品,包括:使用多个传感器检测作为与样品的处理状态相关的监测数据的多种信息; 选择检测到的监视数据的检测时间范围; 将所选择的检测时间范围内的监视数据转换成转换信号; 基于转换的信号预测样本的图案形状; 计算处理参数的校正量,以减小预测图案形状与标准值之间的偏差; 并且当下一个批次的下一个样本的种类与样本不同时,转换通过计算操作获得的处理参数的校正量,从而使用用于下一个样本的处理的转换的处理参数的校正量。

    Device and method for detecting foreign material on the surface of plasma processing apparatus
    27.
    发明申请
    Device and method for detecting foreign material on the surface of plasma processing apparatus 失效
    用于检测等离子体处理装置表面的异物的装置和方法

    公开(公告)号:US20070032088A1

    公开(公告)日:2007-02-08

    申请号:US11214963

    申请日:2005-08-31

    IPC分类号: H01L21/302 H01L21/461

    摘要: A detection technique for detecting foreign material on the surface of a plasma processing apparatus, capable of accurately sucking/extracting and measuring foreign material contained in the measurement object surface is provided. The detection device comprises a gauge head or probe having a gas blow out opening for intermittently blowing a gas of a predetermined pressure to a measurement object surface and a gas suction opening for sucking foreign material discharged by the gas blown out from the gas blow out opening a particle counter having a suction pump for continuously sucking in a predetermined amount of gas from the gas suction opening for counting the number of foreign material particles contained in the gas sucked by the suction pump and a pressure adjustment unit for intermittently supplying gas of a predetermined pressure to the gas blowing out opening.

    摘要翻译: 提供一种用于检测等离子体处理装置表面上异物的检测技术,其能够精确地吸取/提取和测量包含在测量对象表面中的异物。 检测装置包括具有用于间歇地向测量对象表面吹送预定压力的气体的气体吹出口的测量头或探针,以及用于吸入从气体吹出口吹出的气体排出的异物的吸气口 具有吸入泵的颗粒计数器,用于连续吸入来自吸入口的预定量的气体,用于计数由吸入泵抽吸的气体中包含的异物颗粒的数量;以及压力调节单元,用于间歇地供给预定的 对气体吹出口的压力。

    AF control apparatus
    28.
    发明授权
    AF control apparatus 失效
    AF控制装置

    公开(公告)号:US07119968B2

    公开(公告)日:2006-10-10

    申请号:US11121013

    申请日:2005-05-04

    IPC分类号: G02B15/14 G03B17/00

    CPC分类号: G02B7/102 G02B7/282 G02B7/36

    摘要: An AF control apparatus includes a plurality of movable lens groups, each of which is movable along an optical axis for performing focusing independently, and a driving system for moving each of the movable lens groups. A moving path of each of the movable lens groups during an autofocusing operation is defined so that a ratio of moving distances of the each of the movable lens groups is constant over an entire zoom range.

    摘要翻译: 一种AF控制装置包括多个可移动透镜组,每个可移动透镜组可沿着光轴移动以独立地进行聚焦;以及驱动系统,用于移动每个可移动透镜组。 定义在自动对焦操作期间每个可移动透镜组的移动路径,使得每个可移动透镜组的移动距离的比例在整个变焦范围内是恒定的。

    Plasma processing method
    29.
    发明申请
    Plasma processing method 审中-公开
    等离子体处理方法

    公开(公告)号:US20060151429A1

    公开(公告)日:2006-07-13

    申请号:US11032000

    申请日:2005-01-11

    IPC分类号: G01L21/30 C23F1/00

    CPC分类号: H01J37/32935

    摘要: A plasma processing method utilizing a plasma processing apparatus comprising a control unit and a processing chamber for performing a plasma processing in which the processing chamber comprises a plasma status detecting unit for detecting the processing status in the processing chamber and outputting plural output signals. The method includes storing data related to past wafer processing results, plasma status detection data obtained during the past wafer processing, and a relational expression correlating the two data; computing a prediction of the processing result based on the relational expression and the detected data of the processing chamber status transmitted from the plasma status detecting unit, and evaluating the processing chamber status based on the computed prediction of the processing result.

    摘要翻译: 一种利用等离子体处理装置的等离子体处理方法,包括控制单元和处理室,用于执行等离子体处理,其中处理室包括用于检测处理室中的处理状态并输出多个输出信号的等离子体状态检测单元。 该方法包括存储与过去晶片处理结果有关的数据,在过去的晶片处理期间获得的等离子体状态检测数据以及与两个数据相关的关系表达式; 基于从等离子体状态检测单元发送的处理室状态的关系表达和检测数据,计算处理结果的预测,以及基于所计算的处理结果的预测来评估处理室状态。

    Method of monitoring and/or controlling a semiconductor manufacturing apparatus and a system therefor
    30.
    发明授权
    Method of monitoring and/or controlling a semiconductor manufacturing apparatus and a system therefor 有权
    监控和/或控制半导体制造装置的方法及其系统

    公开(公告)号:US07058470B2

    公开(公告)日:2006-06-06

    申请号:US10999006

    申请日:2004-11-30

    IPC分类号: G06F19/00

    摘要: A semiconductor processing apparatus for processing a semiconductor wafer includes a sensor for monitoring a processing state of the semiconductor processing apparatus, a processing result input unit which inputs measured values for processing results of a semiconductor wafer processed by the semiconductor processing apparatus, and a model equation generation unit relying on sensed data acquired by the sensor and the measured values to generate a model equation for predicting a processing result using the sensed data as an explanatory variable. The apparatus includes a processing result prediction unit which predicts a processing result based on the model equation and the sensed data, and a process recipe control unit which compares the predicted processing result with a previously set value to control a processing condition or input parameter. The process recipe control unit includes a controller which controls at least one of a plurality of different processing performances for processing of the semiconductor wafer.

    摘要翻译: 用于处理半导体晶片的半导体处理装置包括:用于监视半导体处理装置的处理状态的传感器;输入由半导体处理装置处理的半导体晶片的处理结果的测量值的处理结果输入单元;以及模型方程 依赖于由传感器获取的感测数据和测量值,以产生用于使用感测数据作为解释变量来预测处理结果的模型方程。 该装置包括:处理结果预测单元,其基于模型方程和感测数据预测处理结果;以及处理配方控制单元,其将预测的处理结果与预先设定的值进行比较,以控制处理条件或输入参数。 处理配方控制单元包括控制器,用于控制用于处理半导体晶片的多个不同处理性能中的至少一个。