摘要:
A blanket cylinder cleaning apparatus includes a pressure pad for pressing a cleaning fabric against a rotating blanket cylinder in a printing press to wipe away unwanted matter such as residual ink on the peripheral surface of the blanket cylinder. The pressure pad is hollow and filled with gelatinous viscoelastic material to stably bring the cleaning fabric into adequate contact with the blanket cylinder to efficiently clean the blanket cylinder. The viscoelastic material is solated with heat and readily injected into the inside space of the pressure pad.
摘要:
A detection technique for detecting foreign material on the surface of a plasma processing apparatus, capable of accurately sucking/extracting and measuring foreign material contained in the measurement object surface is provided. The detection device comprises a gauge head or probe having a gas blow out opening for intermittently blowing a gas of a predetermined pressure to a measurement object surface and a gas suction opening for sucking foreign material discharged by the gas blown out from the gas blow out opening a particle counter having a suction pump for continuously sucking in a predetermined amount of gas from the gas suction opening for counting the number of foreign material particles contained in the gas sucked by the suction pump and a pressure adjustment unit for intermittently supplying gas of a predetermined pressure to the gas blowing out opening.
摘要:
A method of processing a semiconductor which includes providing a process gas supply unit for supplying a process gas to a sample stand to hold a sample in a process chamber and to the process chamber, successively supplying a plurality of samples of a lot to the process chamber to conduct an intra-lot successive process, predicting, before a lot process is started and according to sensor data detected by a state sensor to detect a state in the process chamber, intra-lot variation patterns of results of the intra-lot successive process, and changing, according to a result of the prediction by the intra-lot variation pattern prediction unit, a process condition applied to a sample of the lot and conducting the lot process.
摘要:
A plasma processing method for processing a sample by using plasma on a lot unit basis, including: detecting plural kinds of information as monitor data relating to a processing state of the sample, using a plurality of sensors; selecting a detection time range of the monitor data thus detected; converting the monitor data within the selected detection time range into a converted signal; predicting a pattern shape of the sample based on the converted signal; calculating a correction quantity of a processing parameter, for decreasing a deviation between the predicted pattern shape and a standard value; and converting the correction quantity of a processing parameter obtained by the calculating operation when a kind of a next sample of a next lot is different from the sample, thereby to use a converted correction quantity of the processing parameter for a processing of the next sample.
摘要:
A detection technique for detecting foreign material on the surface of a plasma processing apparatus, capable of accurately sucking/extracting and measuring foreign material contained in the measurement object surface is provided. The detection device comprises a gauge head or probe having a gas blow out opening for intermittently blowing a gas of a predetermined pressure to a measurement object surface and a gas suction opening for sucking foreign material discharged by the gas blown out from the gas blow out opening a particle counter having a suction pump for continuously sucking in a predetermined amount of gas from the gas suction opening for counting the number of foreign material particles contained in the gas sucked by the suction pump and a pressure adjustment unit for intermittently supplying gas of a predetermined pressure to the gas blowing out opening.
摘要:
An AF control apparatus includes a plurality of movable lens groups, each of which is movable along an optical axis for performing focusing independently, and a driving system for moving each of the movable lens groups. A moving path of each of the movable lens groups during an autofocusing operation is defined so that a ratio of moving distances of the each of the movable lens groups is constant over an entire zoom range.
摘要:
A plasma processing method utilizing a plasma processing apparatus comprising a control unit and a processing chamber for performing a plasma processing in which the processing chamber comprises a plasma status detecting unit for detecting the processing status in the processing chamber and outputting plural output signals. The method includes storing data related to past wafer processing results, plasma status detection data obtained during the past wafer processing, and a relational expression correlating the two data; computing a prediction of the processing result based on the relational expression and the detected data of the processing chamber status transmitted from the plasma status detecting unit, and evaluating the processing chamber status based on the computed prediction of the processing result.
摘要:
A semiconductor processing apparatus for processing a semiconductor wafer includes a sensor for monitoring a processing state of the semiconductor processing apparatus, a processing result input unit which inputs measured values for processing results of a semiconductor wafer processed by the semiconductor processing apparatus, and a model equation generation unit relying on sensed data acquired by the sensor and the measured values to generate a model equation for predicting a processing result using the sensed data as an explanatory variable. The apparatus includes a processing result prediction unit which predicts a processing result based on the model equation and the sensed data, and a process recipe control unit which compares the predicted processing result with a previously set value to control a processing condition or input parameter. The process recipe control unit includes a controller which controls at least one of a plurality of different processing performances for processing of the semiconductor wafer.