Data processing apparatus and program
    22.
    发明申请
    Data processing apparatus and program 有权
    数据处理装置和程序

    公开(公告)号:US20080086659A1

    公开(公告)日:2008-04-10

    申请号:US11866718

    申请日:2007-10-03

    IPC分类号: G06F11/00

    CPC分类号: G06F11/1441

    摘要: A data processing apparatus which saves data in a volatile memory into a nonvolatile memory when power is off, the data processing apparatus including: a detecting circuit for outputting: a momentary interruption detecting signal when a power source voltage is below a first threshold voltage, and a power failure detecting signal when the power source voltage is below a second threshold voltage that is lower than the first threshold voltage; and a control section adapted to start saving of the data in the volatile memory into the nonvolatile memory when the detecting circuit has output the momentary interruption detecting signal, continue save of the data, and carry out a predetermined shutdown processing when the detecting circuit has output the power failure detecting signal after the detecting circuit has output the momentary interruption detecting signal.

    摘要翻译: 一种数据处理装置,当电源关闭时,将易失性存储器中的数据保存到非易失性存储器中,所述数据处理装置包括:检测电路,用于在电源电压低于第一阈值电压时输出瞬时中断检测信号;以及 当电源电压低于低于第一阈值电压的第二阈值电压时的电源故障检测信号; 以及控制部,其适于在检测电路输出瞬时中断检测信号时开始将易失性存储器中的数据保存到非易失性存储器中,继续保存数据,并且当检测电路具有输出时执行预定的关闭处理 检测电路之后的电源故障检测信号输出瞬时中断检测信号。

    DATA SAVE APPARATUS AND DATA SAVE METHOD
    23.
    发明申请
    DATA SAVE APPARATUS AND DATA SAVE METHOD 审中-公开
    数据保存装置和数据保存方法

    公开(公告)号:US20080086587A1

    公开(公告)日:2008-04-10

    申请号:US11868199

    申请日:2007-10-05

    IPC分类号: G06F12/00

    CPC分类号: G06F11/1441 G06F11/1461

    摘要: A data save apparatus including: a system memory, in which a plurality of segment regions having uneven capacities are provided; a nonvolatile memory, into which data having been memorized in the system memory are saved; and a controller which controls to save data with a unit of each of the segment regions into the nonvolatile memory from the system memory, wherein the controller determines whether saving data of each of the segment regions into the nonvolatile memory is necessary, and when a total capacity of segment regions, data in which having been determined to be necessary to be saved, reaches to a prescribed value, the controller transfers the data of the segment regions determined to be necessary to be saved into the nonvolatile memory by a DMA (Direct Memory Access) mode in descending order of segment region capacity.

    摘要翻译: 一种数据保存装置,包括:系统存储器,其中提供具有不均匀容量的多个段区域; 保存已存储在系统存储器中的数据的非易失性存储器; 以及控制器,其控制以将来自所述分段区域的单位的数据的数据从所述系统存储器保存到所述非易失性存储器中,其中,所述控制器确定是否需要将每个所述分段区域的数据保存到所述非易失性存储器中, 分段区域的容量已被确定为需要保存的数据达到规定值,控制器通过DMA(直接存储器)将确定为需要保存的非易失性存储器的段区域的数据 访问)模式按区段容量的降序排列。

    PRINTING APPARATUS AND CONVEYANCE CONTROL METHOD
    24.
    发明申请
    PRINTING APPARATUS AND CONVEYANCE CONTROL METHOD 有权
    印刷设备和输送控制方法

    公开(公告)号:US20080049089A1

    公开(公告)日:2008-02-28

    申请号:US11842573

    申请日:2007-08-21

    IPC分类号: B41J2/01

    摘要: This invention relates to a printing apparatus and a conveyance control method capable of allowing even an arrangement having a plurality of conveyance rollers in a printing medium conveyance path to accurately control conveyance of a printing medium. A pattern having a predetermined uniform density is printed on a printing medium a plurality of number of times by using a printhead while conveying the printing medium and changing the conveyance amount by a small amount. A conveyance correction amount obtained on the basis of the conveyance amount upon printing a pattern selected from a plurality of printed pattern is stored in a storage medium. Conveyance of the printing medium is controlled while correcting the conveyance amount of the printing medium by the conveyance means on the basis of the conveyance correction amount stored in the storage means.

    摘要翻译: 本发明涉及一种打印设备和输送控制方法,其能够允许甚至在打印介质输送路径中具有多个传送辊的布置,以精确地控制打印介质的传送。 通过使用打印头在打印介质上输送打印介质并将输送量改变少量,将打印介质上多次打印具有预定均匀浓度的图案。 在打印从多个印刷图案中选择的图案时,基于输送量获得的输送校正量被存储在存储介质中。 控制打印介质的输送,同时基于存储在存储装置中的输送校正量来校正输送装置的打印介质的输送量。

    BAKE PLATE HAVING ENGAGEABLE THERMAL MASS
    25.
    发明申请
    BAKE PLATE HAVING ENGAGEABLE THERMAL MASS 审中-公开
    具有可焊接热质的烤盘

    公开(公告)号:US20070295276A1

    公开(公告)日:2007-12-27

    申请号:US11849946

    申请日:2007-09-04

    IPC分类号: C23C16/00

    摘要: A bake station comprising a bake plate adapted to heat a substrate supported on an upper surface of the bake plate, the bake plate vertically moveable between an upper baking position and a lower cooling position; and a plurality of heat sinks adapted to be engageably coupled to a lower surface of the bake plate when the bake plate is in the lower cooling position.

    摘要翻译: 一种烘烤台,包括适于加热支撑在所述烘烤板的上表面上的基底的烘烤板,所述烘烤板可在上烘烤位置和下冷却位置之间垂直移动; 以及多个散热器,其适于在所述烘烤板处于所述下部冷却位置时可接合地联接到所述烘烤板的下表面。

    Systems and Methods for Detecting Abnormal Dispense of Semiconductor Process Fluids
    28.
    发明申请
    Systems and Methods for Detecting Abnormal Dispense of Semiconductor Process Fluids 审中-公开
    用于检测半导体工艺流体异常分配的系统和方法

    公开(公告)号:US20070254092A1

    公开(公告)日:2007-11-01

    申请号:US11380912

    申请日:2006-04-28

    IPC分类号: C23C16/52 B05C11/00

    CPC分类号: H01L21/67288 H01L21/6715

    摘要: Systems and methods for monitoring a dispense of a semiconductor process liquid are provided. A motor is driven to dispense the semiconductor process liquid in accordance with a liquid delivery plan. The delivery plan corresponds to a reference profile. A signal profile from a sensor is measured while the motor dispenses the process liquid in accordance with the plan. The measured profile is compared with a reference profile to characterize the dispense.

    摘要翻译: 提供了用于监测半导体处理液体分配的系统和方法。 驱动电动机以根据液体输送计划分配半导体工艺液体。 交付计划对应于参考资料。 在电机根据计划分配处理液体时,测量来自传感器的信号轮廓。 将测量的轮廓与参考轮廓进行比较以表征分配。

    Composite heater and chill plate
    29.
    发明申请
    Composite heater and chill plate 审中-公开
    复合加热器和冷却板

    公开(公告)号:US20070251456A1

    公开(公告)日:2007-11-01

    申请号:US11414730

    申请日:2006-04-27

    IPC分类号: C23C16/00

    CPC分类号: H01L21/67109

    摘要: An integrated system for baking and chilling wafers includes a heater for heating a wafer to an elevated temperature, a chiller for cooling the wafer, and a shuttle operatively connected to the heater and the chiller for transferring the wafer between the heater and the chiller. The chiller further includes a low thermal mass wafer support for providing support to a bottom surface of a wafer and a chill plate coupled to the low thermal mass wafer support for cooling the wafer. The low thermal mass wafer support has a higher thermal conductivity in the plane parallel to the bottom surface of the wafer than in the direction perpendicular to the bottom surface of the wafer. The low thermal mass wafer support can further include a plurality of proximity pins for supporting the wafer.

    摘要翻译: 用于烘烤和冷却晶片的集成系统包括用于将晶片加热到高温的加热器,用于冷却晶片的冷却器和可操作地连接到加热器的梭子和用于在加热器和冷却器之间传送晶片的冷却器。 冷却器还包括用于向晶片的底表面提供支撑的低热质量晶片支撑件和耦合到低热质量晶片支撑件以冷却晶片的冷却板。 低热质量晶片支架在垂直于晶片底表面的方向上平行于晶片底表面的平面具有较高的热导率。 低热质量晶片支撑件还可以包括用于支撑晶片的多个接近销。

    Integrated thermal unit having laterally adjacent bake and chill plates on different planes
    30.
    发明授权
    Integrated thermal unit having laterally adjacent bake and chill plates on different planes 有权
    集成热单元具有横向相邻的烘烤和冷却板在不同的平面上

    公开(公告)号:US07288746B2

    公开(公告)日:2007-10-30

    申请号:US11174782

    申请日:2005-07-05

    IPC分类号: H05B3/68 C23C16/00

    摘要: An integrated thermal unit comprising a bake plate having a substrate holding surface configured to hold and heat a substrate in a baking position and a chill plate having a substrate holding surface configured to hold and cool a substrate in a cooling position where the substrate holding surface of the bake plate is positioned in a first substantially horizontal plane when the bake plate is in the baking position and the substrate holding surface of the chill plate is positioned in a second substantially horizontal plane that is below the first plane when the chill plate is in a cooling position.

    摘要翻译: 一种集成热单元,包括具有被配置为在烘烤位置保持和加热基板的基板保持表面的烘烤板,以及具有基板保持表面的冷却板,所述冷却板被配置为在基板保持表面的基板保持表面的冷却位置保持和冷却基板 当烘烤板处于烘烤位置时,烘烤板定位在第一基本上水平的平面中,并且当冷却板处于烘烤位置时,冷却板的基板保持表面定位在第二基本水平的平面内,该第二基本水平的平面位于第一平面之下 冷却位置。