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公开(公告)号:US06791182B2
公开(公告)日:2004-09-14
申请号:US10103799
申请日:2002-03-25
申请人: Junpei Kusukawa , Ryozo Takeuchi , Toshiaki Ishii , Hiromichi Suzuki , Fujio Ito , Takafumi Nishita , Akihiko Kameoka , Masaru Yamada
发明人: Junpei Kusukawa , Ryozo Takeuchi , Toshiaki Ishii , Hiromichi Suzuki , Fujio Ito , Takafumi Nishita , Akihiko Kameoka , Masaru Yamada
IPC分类号: H01L2310
CPC分类号: H01L23/564 , H01L23/3128 , H01L23/4334 , H01L23/49582 , H01L23/49816 , H01L23/49866 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: At least a part of the inner leads 1a of a lead frame 1 is covered with a plating for a metallic fine wire connection, at least the entire portion where the lead frame 1 joins with the adhesive layer 2 is covered by at least one metal or alloy thereof different from the metallic fine wire connecting use plating. The metal or alloy is selected from the group consisting of gold, platinum, iridium, rhodium, palladium, ruthenium, indium, tin, molybdenum, tungsten, gallium, zinc, chromium, niobium, tantalum, titanium and zirconium. Thereby, generation of defects, such as leakage and shorting, due to ion migration can be prevented.
摘要翻译: 引线框架1的内部引线1a的至少一部分被用金属细线连接的电镀覆盖,至少引线框架1与粘合剂层2连接的整个部分被至少一种金属或 它们与金属细线不同的连接用电镀的合金。 金属或合金选自金,铂,铱,铑,钯,钌,铟,锡,钼,钨,镓,锌,铬,铌,钽,钛和锆。 因此,可以防止由于离子迁移而产生诸如泄漏和短路的缺陷。