公开(公告)号：US06177739B1

公开(公告)日：2001-01-23

申请号：US09178301

申请日：1998-10-23

申请人： Tadashi Matsudaira ,  Masashi Sugano ,  Hiroshi Oyama ,  Masayuki Watanabe

发明人： Tadashi Matsudaira ,  Masashi Sugano ,  Hiroshi Oyama ,  Masayuki Watanabe

IPC分类号： H01H4700

CPC分类号： G03G15/5004 ,  Y10T307/696 ,  Y10T307/702 ,  Y10T307/826

摘要： In an electric power supply for supplying electric power, after a power factor has been improved, to an equipment having a power saving mode which is transferred to the power saving mode when the equipment is not operated for a predetermined period of time, the electric power supply includes: a power factor improvement section for improving the power factor by a switching operation; and a switch provided between a power source and the power factor improvement section for switching the electric power to either the power factor improvement section or the equipment. When the equipment is transferred to the power saving mode, the electric power is supplied by the switch to the equipment without passing through the power factor improvement section.

摘要翻译： 在功率因数提高的电力供给装置中，在设备未在规定时间内运转时，将具有省电模式的设备转换为省电模式的电力， 电源包括：用于通过切换操作来改善功率因数的功率因数改善部分; 以及设置在电源和功率因数改善部之间的开关，用于将功率切换到功率因数改善部或设备。 当设备转移到省电模式时，电源由开关提供给设备而不通过功率因数改善部分。

公开(公告)号：US08720976B2

公开(公告)日：2014-05-13

申请号：US13641592

申请日：2011-04-28

申请人： Hiroshi Oyama ,  Junichi Shimada ,  Mikito Sawaki

发明人： Hiroshi Oyama ,  Junichi Shimada ,  Mikito Sawaki

IPC分类号： B60J7/00

CPC分类号： B62D25/082 ,  B60H1/2209 ,  B60H2001/2293 ,  B62D21/152

摘要： A vehicle collision protection apparatus includes a bracket. The bracket includes a deflecting force generating component provided at a rear end of the bracket. The bracket is disposed in a vehicle front space of a vehicle and extends in a front to rear direction of the vehicle and attach a vehicle component to a body of the vehicle. The deflecting force generating component deflects the rear end of the bracket in a width direction of the vehicle and rotates the bracket together with the vehicle component in the width direction when the deflecting force generating component impinges against a portion of the vehicle body as the rear end of the bracket is displaced in a rearward direction of the vehicle due to crushing of a front end of the vehicle during a collision at the front end of the vehicle.

摘要翻译： 车辆碰撞保护装置包括支架。 支架包括设置在支架后端的偏转力产生部件。 支架设置在车辆的车辆前部空间中，并且在车辆的前后方向上延伸，并且将车辆部件附接到车辆的车身。 偏转力产生部件在车辆的宽度方向使托架的后端偏转，并且当偏转力产生部件碰撞车体的一部分时，作为后端部而使车架部件沿宽度方向旋转支架 由于在车辆的前端碰撞期间车辆的前端被破坏，托架在车辆的后方向上移位。

公开(公告)号：US08110907B2

公开(公告)日：2012-02-07

申请号：US12318798

申请日：2009-01-08

申请人： Masahiro Yamaguchi ,  Emi Sawayama ,  Hiroshi Oyama ,  Shigeharu Tsunoda ,  Yasuo Amano ,  Naoki Matsushima

发明人： Masahiro Yamaguchi ,  Emi Sawayama ,  Hiroshi Oyama ,  Shigeharu Tsunoda ,  Yasuo Amano ,  Naoki Matsushima

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  H01L23/5387 ,  H01L24/48 ,  H01L24/50 ,  H01L24/93 ,  H01L2224/0401 ,  H01L2224/05644 ,  H01L2224/78313 ,  H01L2225/06579 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a semiconductor chip, a first substrate, and a second substrate. The first substrate includes a plurality of wires and a plurality of first electrodes, each first electrode being connected with each wire. The second substrate includes the semiconductor chip that is mounted thereon, and a plurality of second electrodes with, each second electrode being connected with the each first electrode of the first substrate. The widths of the wires of the first substrate are different depending on the lengths of the wires. By changing the widths of the wires depending on their lengths, it is possible to reduce variation in stiffness of the electrodes and vicinities of electrodes, whereby variation in ultrasonic bonding strength can be reduced.

摘要翻译： 半导体器件包括半导体芯片，第一基板和第二基板。 第一基板包括多个导线和多个第一电极，每个第一电极与每个导线连接。 第二基板包括安装在其上的半导体芯片，以及多个第二电极，每个第二电极与第一基板的每个第一电极连接。 第一基板的导线的宽度根据导线的长度而不同。 通过根据其长度改变电线的宽度，可以减少电极的刚度变化和电极附近，从而可以降低超声波接合强度的变化。

公开(公告)号：US20090206492A1

公开(公告)日：2009-08-20

申请号：US12318798

申请日：2009-01-08

申请人： Masahiro Yamaguchi ,  Emi Sawayama ,  Hiroshi Oyama ,  Shigeharu Tsunoda ,  Yasuo Amano ,  Naoki Matsushima

发明人： Masahiro Yamaguchi ,  Emi Sawayama ,  Hiroshi Oyama ,  Shigeharu Tsunoda ,  Yasuo Amano ,  Naoki Matsushima

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  H01L23/5387 ,  H01L24/48 ,  H01L24/50 ,  H01L24/93 ,  H01L2224/0401 ,  H01L2224/05644 ,  H01L2224/78313 ,  H01L2225/06579 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a semiconductor chip, a first substrate, and a second substrate. The first substrate includes a plurality of wires and a plurality of first electrodes, each first electrode being connected with each wire. The second substrate includes the semiconductor chip that is mounted thereon, and a plurality of second electrodes with, each second electrode being connected with the each first electrode of the first substrate. The widths of the wires of the first substrate are different depending on the lengths of the wires. By changing the widths of the wires depending on their lengths, it is possible to reduce variation in stiffness of the electrodes and vicinities of electrodes, whereby variation in ultrasonic bonding strength can be reduced.

摘要翻译： 半导体器件包括半导体芯片，第一基板和第二基板。 第一基板包括多个导线和多个第一电极，每个第一电极与每个导线连接。 第二基板包括安装在其上的半导体芯片，以及多个第二电极，每个第二电极与第一基板的每个第一电极连接。 第一基板的导线的宽度根据导线的长度而不同。 通过根据其长度改变电线的宽度，可以减少电极的刚度变化和电极附近，从而可以降低超声波接合强度的变化。

公开(公告)号：US07561927B2

公开(公告)日：2009-07-14

申请号：US11172487

申请日：2005-06-30

申请人： Hiroshi Oyama ,  Osamu Kuzuya ,  Yukinori Ootsubo

发明人： Hiroshi Oyama ,  Osamu Kuzuya ,  Yukinori Ootsubo

IPC分类号： G05B11/01 ,  G06F19/00 ,  H04M1/24 ,  G06F9/44

CPC分类号： G05B19/4155 ,  G05B2219/36019 ,  G05B2219/36032

摘要： A program interpreter which interprets and executes a numerical control program can recognize predetermined mnemonics (script mnemonics) prepared for instructions for setting, loading, and executing script programs. When the program interpreter recognizes the script mnemonic during interpretation and execution of the numerical control program, the program interpreter instructs execution of the script program (instance) indicated in the parameter of the mnemonic to a script engine. The script engine executes the instructed script program.

摘要翻译： 解释和执行数字控制程序的程序解释器可以识别准备好的用于设置，加载和执行脚本程序的指令的助记符（脚本助记符）。 当程序解释器在数字控制程序的解释和执行期间识别出脚本助记符时，程序解释器指示将脚本程序（实例）在助记符的参数中指示执行到脚本引擎。 脚本引擎执行指令脚本程序。

公开(公告)号：US20090103005A1

公开(公告)日：2009-04-23

申请号：US12254852

申请日：2008-10-21

申请人： Norio NAKAZATO ,  Kimihiko SUDO ,  Hiroshi Akai ,  Naoki Yotsumoto ,  Hiroshi Oyama ,  Shigeyuki Sasaki ,  Atsushi Hatakeyama ,  Takaaki Maruyama ,  Kouichi Tanabe

发明人： Norio NAKAZATO ,  Kimihiko SUDO ,  Hiroshi Akai ,  Naoki Yotsumoto ,  Hiroshi Oyama ,  Shigeyuki Sasaki ,  Atsushi Hatakeyama ,  Takaaki Maruyama ,  Kouichi Tanabe

IPC分类号： G02F1/13357 ,  F21V7/00 ,  G09F13/08

CPC分类号： H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/00

摘要： It is to provide a light source module capable of downsizing an edge-light type backlight in thickness and reducing the usage amount of resin. A method of manufacturing a light source module includes a process of preparing a substrate with a first reflector including a reflecting surface mounted thereon, a process of mounting a plurality of light emitting elements on the substrate, a process of mounting a wiring board having an electrode on the substrate, a process of connecting the electrode of the light emitting element and the electrode of the wiring board with metal wire, a process of mounting a second reflector having a reflecting surface on the wiring board, and a process of filling the space between the first reflector and the second reflector, with resin.

摘要翻译： 提供能够使边缘光型背光的厚度小型化并且减少树脂的使用量的光源模块。 一种制造光源模块的方法包括：制备具有安装在其上的反射表面的第一反射器的基板的处理，将多个发光元件安装在基板上的工艺，安装具有电极的布线板的工艺 在基板上，使用金属线将发光元件的电极和布线板的电极连接的过程，在布线基板上安装具有反射面的第二反射体的处理以及填充 第一反射器和第二反射器，具有树脂。

公开(公告)号：US5088055A

公开(公告)日：1992-02-11

申请号：US483461

申请日：1990-02-22

申请人： Hiroshi Oyama

发明人： Hiroshi Oyama

IPC分类号： G01B21/20 ,  B23Q15/00 ,  G01B21/00 ,  G05B19/408 ,  G05B19/42

CPC分类号： G05B19/4207

摘要： A digitize control apparatus having a measuring function of the present invention determines a correct contact point between a stylus and a model on the basis of the displacement vector of a stylus obtained by a scanning head and a position vector indicating a machine coordinate value obtained by a position detecting apparatus, and therefore the influence of friction generated between a stylus and a model can be removed, thereby reducing error in the measurements.

摘要翻译： 具有本发明的测量功能的数字化控制装置基于由扫描头获得的触控笔的位移矢量和指示由一个扫描头获得的机器坐标值的位置向量来确定触控笔和模型之间的正确接触点 位置检测装置，因此可以消除在触笔和模型之间产生的摩擦的影响，从而减少测量中的误差。

公开(公告)号：US08611767B2

公开(公告)日：2013-12-17

申请号：US13296927

申请日：2011-11-15

申请人： Kenji Izumiya ,  Atsushi Takahashi ,  Hiroshi Oyama ,  Yumiko Higashi ,  Katsuyuki Ikuta

发明人： Kenji Izumiya ,  Atsushi Takahashi ,  Hiroshi Oyama ,  Yumiko Higashi ,  Katsuyuki Ikuta

IPC分类号： G03G15/00

CPC分类号： G03G15/5041 ,  G03G15/55

摘要： Disclosed is an image forming apparatus, which makes it possible to reduce the frequency of image defect occurrences to a level as lower as possible by detecting abnormalities generated with age on the photoreceptor member and/or in the cleaning section, so as to suppress an amount of spoiled paper sheets and material. The image forming apparatus includes: a light source that is disposed at a position located between a cleaning section and a charging section, to emit an inspection light, which is to be irradiated onto a photoreceptor member over a main-scanning direction thereof; a tight-contact type image sensor that has a line image sensor to receive the inspection light reflected from a surface of the photoreceptor member; and a control section to determine a status of a surface of the photoreceptor member, based on a result of analyzing the inspection light receive by the line image sensor.

摘要翻译： 公开了一种图像形成装置，其可以通过检测感光体和/或清洁部分中的年龄产生的异常来将图像缺陷发生的频率降低到尽可能低的水平，以便抑制数量 被损坏的纸张和材料。 图像形成装置包括：光源，其设置在位于清洁部和充电部之间的位置，以发射要在其主扫描方向上照射到感光体上的检查光; 具有接收从感光体表面反射的检查光的行图像传感器的紧密接触型图像传感器; 以及控制部分，用于基于对由线形图像传感器接收的检查光进行分析的结果来确定感光体部件的表面的状态。

公开(公告)号：US20130303448A1

公开(公告)日：2013-11-14

申请号：US13981258

申请日：2012-01-25

申请人： Fumihito Sugihara ,  Naoki Inoue ,  Seiko Koizumi ,  Tadashi Yoshimoto ,  Hiroshi Oyama

发明人： Fumihito Sugihara ,  Naoki Inoue ,  Seiko Koizumi ,  Tadashi Yoshimoto ,  Hiroshi Oyama

IPC分类号： A61K38/39

CPC分类号： A61K38/39 ,  A61K38/05 ,  A61K38/06 ,  C07K5/06043 ,  C07K5/0606 ,  C07K5/06078 ,  C07K5/06104 ,  C07K5/0806 ,  C07K5/0812 ,  C07K5/0819 ,  C07K5/0823

摘要： A collagen peptide mixture containing three or more kinds selected from Glu-Hyp-Gly, Glu-Hyp, Leu-Hyp-Gly, Pro-Ala, Ser-Hyp, Ala-Hyp-Gly, chemically-modified substances thereof and pharmaceutically acceptable salts thereof, and at least one peptide selected from the group consisting of Glu-Hyp-Gly, Glu-Hyp, Leu-Hyp-Gly, Pro-Ala, Ser-Hyp, Ala-Hyp-Gly, Pro-Hyp-Gly, Leu-Hyp, Ile-Hyp, Ser-Hyp-Gly, Gly-Pro-Hyp, (Pro-Hyp-Gly)5, Pro-Hyp, Hyp-Gly, Pro-Gly, Pro-Pro and Ala-Hyp or a chemically-modified substance thereof or a pharmaceutically acceptable salt thereof have DPPTV inhibitory activity and/or GLP-1 secretion accelerating activity, and hence are effective as a therapeutic or preventive agent or the like for diabetes.

摘要翻译： 含有选自Glu-Hyp-Gly，Glu-Hyp，Leu-Hyp-Gly，Pro-Ala，Ser-Hyp，Ala-Hyp-Gly，化学修饰物质和药学上可接受的盐的三种或更多种的胶原肽混合物 以及至少一种选自Glu-Hyp-Gly，Glu-Hyp，Leu-Hyp-Gly，Pro-Ala，Ser-Hyp，Ala-Hyp-Gly，Pro-Hyp-Gly，Leu -Hyp，Ile-Hyp，Ser-Hyp-Gly，Gly-Pro-Hyp，（Pro-Hyp-Gly）5，Pro-Hyp，Hyp-Gly，Pro-Gly，Pro-Pro和Ala-Hyp或化学 其改性物质或其药学上可接受的盐具有DPPTV抑制活性和/或GLP-1分泌促进活性，因此作为糖尿病的治疗或预防剂等有效。

公开(公告)号：US07903840B2

公开(公告)日：2011-03-08

申请号：US11842679

申请日：2007-08-21

申请人： Hiroshi Oyama ,  Makoto Maruya

发明人： Hiroshi Oyama ,  Makoto Maruya

IPC分类号： G06K9/00

CPC分类号： G06K9/0063

摘要： The present invention provides an image processing method which can search, at high speed, for image coordinates of a pixel corresponding to a position whose three-dimensional position is known, with respect to a line sensor image in which a surface of an object (i.e. the earth) is continuously taken by a line sensor mounted on a flight vehicle. The method includes calculating coordinates transformation information that is transformation information from an image coordinates system to a three-dimensional reference coordinates system for each line of a line sensor image, searching for a line where a distance between a line sensor view for each line that is calculated using flight vehicle three-dimensional coordinates position/speed information and the coordinates transformation information for each line of a line sensor image and a point whose three-dimensional position is known is smallest as the most suitable line corresponding to the point whose three-dimensional position is known on a three-dimensional coordinates, and determining a pixel where a distance between a straight line calculated by using flight vehicle three-dimensional coordinates position/speed information and the coordinates transformation information for each line with respect to each pixel on a line that is searched for as the most suitable line and the point whose three-dimensional position is known is smallest as image coordinates of a pixel on the line sensor image corresponding to the point whose three-dimensional position is known.

摘要翻译： 本发明提供了一种图像处理方法，其能够高速地搜索与其三维位置已知的位置对应的像素的图像坐标相对于其中物体的表面（即， 地球）由安装在飞行器上的线传感器连续采集。 该方法包括：对于行传感器图像的每一行，将从图像坐标系向变换信息的坐标变换信息计算为三维参考坐标系，搜索线路的每行的线传感器视图之间的距离 使用飞行器车辆三维坐标位置/速度信息计算的坐标变换信息和线传感器图像的每一行的坐标变换信息和三维位置已知的点最小，作为对应于三维坐标点的三维坐标 在三维坐标中知道位置，并且确定通过使用飞行器车辆三维坐标位置/速度信息计算的直线与每行上的每个像素的坐标变换信息之间的距离的像素 被搜索为最合适的线和尖头 已知其三维位置的t最小，作为对应于其三维位置已知位置的线传感器图像上的像素的图像坐标。