Abstract:
Disclosed is a thin film transistor including a gate electrode on a substrate. A gate dielectric layer is disposed on the gate electrode and the substrate, and source/drain electrodes are disposed on the gate dielectric layer overlying two edge parts of the gate electrode. A channel layer is disposed on the gate dielectric layer overlying a center part of the gate electrode, and the channel region contacts the source/drain electrodes. An insulating capping layer overlies the channel layer, wherein the channel layer includes an oxide semiconductor.
Abstract:
A high-frequency probe card includes a circuit board having signal circuits and grounding circuits, transmission lines each having a bi-wire structure including a first lead wire for transmitting high-frequency signal and a second lead wire connected to the grounding circuits, and signal probes. High-frequency test signal provided by a test machine to the signal circuits can be transmitted to the signal probes through the first lead wires. Since the grounding circuits and second lead wires are provided adjacent to the signal circuits and first lead wires respectively, the high-frequency signal can be efficiently transmitted and the characteristic impedance matching can be maintained during high-frequency signal transmission. The bi-wire structure of the transmission lines has a diameter equal to or less than 1 millimeter, thereby allowing installation of a big number of the transmission lines such that the high-frequency test for a big number of electronic elements can be realized.
Abstract:
A projection lens provided is for projecting an image beam. The projection lens is disposed on a transmission path of the image beam and includes a first group of lenses and a second group of lenses. The first group of lenses includes a first spherical lens and a first aspheric lens. After the image beam passes through the first group of lenses, an intermediate image is formed between the first group of lenses and the second group of lenses, in which the first aspheric lens is the lens in the first group of lenses closest to the second group of lenses. A projection device using the projection lens is also provided. The projection device further includes a planar reflector on the transmission path of the image beam.
Abstract:
The image projection and capture apparatus for projecting an image beam to display an image on a screen and sensing a sensing beam from the image on the screen, the image projection and capture apparatus includes a light source, a light valve, a projection lens, an image capture lens, a dichroic unit, and an image sensor. The light source provides an illumination beam. The light valve is capable of converting the illumination beam to the image beam. The projection lens has a first optical axis. The image capture lens has a second optical axis. The first optical axis and the second optical axis are collinear. The dichroic unit is disposed between the projection lens and the image capture lens. The image sensor is disposed on a light path of the sensing beam.
Abstract:
An illumination system includes a first light source, a first rotation wheel, a first phosphor element, and a light combining element. The first light source is capable of emitting a first color beam. The first rotation wheel is disposed on a transmission path of the first color beam and includes a first transmissive region and a first reflective region. The first transmissive region is capable of allowing the first color beam to pass through so as to form a first color transmissive beam. The first reflective region is capable of reflecting the first color beam to form a first color reflective beam. One of the first color transmissive and reflective beams excites the first phosphor element to form a second color beam. The light combining element combines the second color beam and a beam originating from the other one of the first color transmissive and reflective beams.
Abstract:
A vertical probe device includes two guide members arranged in a stack manner and defining therebetween an accommodation chamber, a probe holder plate disposed between the guide members, and a plurality of probes inserted through the guide plates and the probe holder plate in such a manner that the probes are flexible within the accommodation chamber. One of the guide plates has at least one through hole. The probe holder plate is slightly moveable in horizontal and vertical directions but fixable to one of the guide plats under a force applied through the at least one through hole to the probe holder plate while the other of the guide plates is removed, thereby preventing damage of the probes or movement of the probes during a maintenance work.
Abstract:
A vertical probe device includes two guide members arranged in a stack manner and defining therebetween an accommodation chamber, a probe holder plate disposed between the guide members, and a plurality of probes inserted through the guide plates and the probe holder plate in such a manner that the probes are flexible within the accommodation chamber. One of the guide plates has at least one through hole. The probe holder plate is slightly moveable in horizontal and vertical directions but fixable to one of the guide plats under a force applied through the at least one through hole to the probe holder plate while the other of the guide plates is removed, thereby preventing damage of the probes or movement of the probes during a maintenance work.
Abstract:
A vertical-type probe card includes a circuit board, which has signal circuits and grounding circuits arranged in such a manner that each signal circuit is disposed in parallel and adjacent to one grounding circuit and kept a predetermined distance from the grounding circuit, and a probe assembly, which is arranged at the bottom side of the circuit board and has an upper guide plate, a lower guide plate, a conducting layer provided on the lower guide plate, a plurality of signal probes respectively electrically connected to the signal circuits and adjacent to a plurality of compensation probes, and at least one grounding probe electrically connected to the grounding circuits in a manner that the signal, compensation and grounding probes are vertically inserted through the upper and lower guide plates, and the conducting layer is conducted with the compensation probe and the grounding probe while electrically insulated to the signal probe.
Abstract:
A high-frequency probe card includes a circuit board having signal circuits and grounding circuits, transmission lines each having a bi-wire structure including a first lead wire for transmitting high-frequency signal and a second lead wire connected to the grounding circuits, and signal probes. High-frequency test signal provided by a test machine to the signal circuits can be transmitted to the signal probes through the first lead wires. Since the grounding circuits and second lead wires are provided adjacent to the signal circuits and first lead wires respectively, the high-frequency signal can be efficiently transmitted and the characteristic impedance matching can be maintained during high-frequency signal transmission. The bi-wire structure of the transmission lines has a diameter equal to or less than 1 millimeter, thereby allowing installation of a big number of the transmission lines such that the high-frequency test for a big number of electronic elements can be realized.
Abstract:
A method for making a guide panel for a vertical probe card in batch includes the steps of a) preparing a non-metal substrate, b) forming a shielding layer having a plurality of openings on the substrate, c) etching a part of the substrate corresponding to the openings of the shielding layer by an anisotropic etching so as to form bind holes with a predetermined depth on the substrate, d) grinding the substrate to open the blind holes by a back side thinning technology so as to form micro feed through holes on the substrate, and e) removing the shielding layer so as to obtain the desired guide panel.