公开(公告)号：US11016288B2

公开(公告)日：2021-05-25

申请号：US16072161

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Sasha N. Oster ,  Feras Eid ,  Johanna M. Swan ,  Thomas L. Sounart ,  Aleksandar Aleksov ,  Shawna M. Liff ,  Baris Bicen ,  Valluri R. Rao

IPC: G02B26/08 ,  H01L27/20 ,  H01L41/09 ,  H01L41/253

Abstract: Embodiments of the invention include a display formed on an organic substrate and methods of forming such a device. According to an embodiment, an array of pixel mirrors may be formed on the organic substrate. For example, each of the pixel mirrors is actuatable about one or more axes out of the plane of the organic substrate. Additionally, embodiments of the invention may include an array of routing mirrors formed on the organic substrate. According to an embodiment, each of the routing mirrors is actuatable about two axes out of the plane of the organic substrate. In embodiments of the invention, a light source may be used for emitting light towards the array of routing mirrors. For example, light emitted from the light source may be reflected to one or more of the pixel mirrors by one of the routing mirrors.

公开(公告)号：US10804227B2

公开(公告)日：2020-10-13

申请号：US16312904

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Adel A. Elsherbini ,  Sasha N. Oster

IPC: H01L23/66 ,  H01L21/48 ,  H01L23/498 ,  H01L23/00 ,  H01Q1/36 ,  H01Q9/04 ,  H01Q9/16 ,  H01Q9/30

Abstract: In various embodiments, disclosed herein are systems and methods directed to the fabrication of a coreless semiconductor package (e.g., a millimeter (mm)-wave antenna package) having an asymmetric build-up layer count that can be fabricated on both sides of a temporary substrate (e.g., a core). The asymmetric build-up layer count can reduce the overall layer count in the fabrication of the semiconductor package and can therefore contribute to fabrication cost reduction. In further embodiments, the semiconductor package (e.g., a millimeter (mm)-wave antenna packages) can further comprise dummification elements disposed near one or more antenna layers. Further, the dummification elements disposed near one or more antenna layers can reduce image current and thereby increasing the antenna gain and efficiency.

公开(公告)号：US10649158B2

公开(公告)日：2020-05-12

申请号：US16098406

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Johanna M. Swan ,  Aleksandar Aleksov ,  Sasha N. Oster ,  Feras Eid ,  Baris Bicen ,  Thomas L. Sounart ,  Shawna M. Liff ,  Valluri R. Rao

IPC: G02B6/42 ,  G02B6/36

Abstract: Embodiments of the invention include an optoelectronic package that allows for in situ alignment of optical fibers. In an embodiment, the optoelectronic package may include an organic substrate. Embodiments include a cavity formed into the organic substrate. Additionally, the optoelectronic package may include an actuator formed on the organic substrate that extends over the cavity. In one embodiment, the actuator may include a first electrode, a piezoelectric layer formed on the first electrode, and a second electrode formed on the piezoelectric layer. According to an additional embodiment of the invention, the actuator may include a first portion and a second portion. In order to allow for resistive heating and actuation driven by thermal expansion, a cross-sectional area of the first portion of the beam may be greater than a cross-sectional area of the second portion of the beam.

公开(公告)号：US10593636B2

公开(公告)日：2020-03-17

申请号：US16127820

申请日：2018-09-11

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Sasha N. Oster ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Brandon M. Rawlings ,  Feras Eid

IPC: H01L23/36 ,  H01L23/66 ,  H01L23/498 ,  H01L23/367 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065

Abstract: Embodiments of the invention may include a packaged device that includes thermally stable radio frequency integrated circuits (RFICs). In one embodiment the packaged device may include an integrated circuit chip mounted to a package substrate. According to an embodiment, the package substrate may have conductive lines that communicatively couple the integrated circuit chip to one or more external components. One of the external components may be an RFIC module. The RFIC module may comprise an RFIC and an antenna. Additional embodiments may also include a packaged device that includes a plurality of cooling spots formed into the package substrate. In an embodiment the cooling spots may be formed proximate to interconnect lines the communicatively couple the integrated circuit chip to the RFIC.

公开(公告)号：US10424559B2

公开(公告)日：2019-09-24

申请号：US15388906

申请日：2016-12-22

Applicant: Intel Corporation

Inventor： Feras Eid ,  Nader N. Abazarnia ,  Johanna M. Swan ,  Taesha D. Beasley ,  Sasha N. Oster ,  Tannaz Harirchian ,  Shawna M. Liff

IPC: H01L25/065 ,  H01L23/373 ,  H01L23/48 ,  H01L23/498 ,  H01L21/56 ,  H01L23/367 ,  H01L23/31 ,  H01L23/00

Abstract: An embodiment includes an apparatus comprising: a semiconductor die; package molding that is molded onto and conformal with a first die surface of the semiconductor die and at least two sidewalls of the semiconductor die, the package molding including: (a)(i) a first surface contacting the semiconductor die, (a)(ii) a second surface opposite the first surface, and (a)(iii) an aperture that extends from the first surface to the second surface; and a polymer substantially filling the aperture; wherein the package molding includes a first thermal conductivity (watts per meter kelvin (W/(m·K)) and the polymer includes a second thermal conductivity that is greater than the first thermal conductivity. Other embodiments are described herein.

公开(公告)号：US10327331B2

公开(公告)日：2019-06-18

申请号：US15762811

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Nadine L. Dabby ,  Adel A. Elsherbini ,  Braxton Lathrop ,  Sasha N. Oster ,  Aleksandar Aleksov

IPC: H05K1/02 ,  G06F1/16 ,  H05K1/11

Abstract: Some forms relate to a stretchable computing device. The stretchable computing device includes a first layer that includes electrical interconnects at a first density wherein the first layer includes a first electronic component; a stretchable second layer electrically connected to the first layer, wherein the stretchable second layer includes electrical interconnects at a second density that is less than the first density, wherein the second layer includes a second electronic component; and a stretchable third layer electrically connected to the stretchable second layer, wherein the stretchable third layer includes electrical interconnects at a third density that is less than the second density.

公开(公告)号：US20190103932A1

公开(公告)日：2019-04-04

申请号：US15721868

申请日：2017-09-30

Applicant: Intel Corporation

Inventor： Sasha N. Oster ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Johanna M. Swan ,  Erich N. Ewy

IPC: H04J14/02 ,  G02B6/12 ,  H01S5/024 ,  H04B10/50 ,  H04B10/572

CPC classification number: H04J14/02 ,  G02B6/12004 ,  G02B6/12007 ,  G02B6/12019 ,  G02B6/12033 ,  H01S5/02415 ,  H04B10/506 ,  H04B10/572 ,  H04B10/90

Abstract: Embodiments include a wavelength selective communication system for use in vehicles. In an embodiment, the communication system may include a primary dielectric waveguide having a first cross-sectional area. In an embodiment, a coupling arm dielectric waveguide may be communicatively coupled to the primary dielectric waveguide. In an embodiment, the coupling arm has a second cross-sectional area that is smaller than or equal to the cross-sectional area of the first cross-sectional area. According to an embodiment, the coupling arm is communicatively coupled to the primary dielectric waveguide by a waveguide connector.

公开(公告)号：US20190013924A1

公开(公告)日：2019-01-10

申请号：US16127800

申请日：2018-09-11

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Emanuel Cohen ,  Sasha N. Oster

IPC: H04L5/14 ,  H04W72/04 ,  H04B1/44

Abstract: Embodiments of the present disclosure may relate to a transceiver to transmit and receive concurrently radio frequency (RF) signals via a dielectric waveguide. In embodiments, the transceiver may include a transmitter to transmit to a paired transceiver a channelized radio frequency (RF) transmit signal via the dielectric waveguide. A receiver may receive from the paired transceiver a channelized RF receive signal via the dielectric waveguide. In embodiments, the channelized RF receive signal may include an echo of the channelized RF transmit signal. The transceiver may further include an echo suppression circuit to suppress from the channelized RF receive signal the echo of the channelized RF transmit signal. In some embodiments, the channelized RF transmit signal and the channelized RF receive signal may be within a frequency range of approximately 30 gigahertz (GHz) to approximately 1 terahertz (THz), and the transceiver may provide full-duplex millimeter-wave communication.

公开(公告)号：US10116504B2

公开(公告)日：2018-10-30

申请号：US15283129

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Shawna M. Liff ,  Adel A. Elsherbini ,  Sasha N. Oster ,  Feras Eid ,  Georgios C. Dogiamis ,  Thomas L. Sounart ,  Johanna M. Swan

IPC: H01L41/047 ,  H01L41/09 ,  H04L12/24 ,  H01H57/00 ,  H01L41/187 ,  A61B5/0205 ,  A61B5/00 ,  A61B5/024 ,  A61B5/021 ,  A61B5/08 ,  A61B5/145

Abstract: Embodiments of the invention include a physiological sensor system. According to an embodiment the sensor system may include a package substrate, a plurality of sensors formed on the substrate, a second electrical component, and an encryption bank formed along a data transmission path between the plurality of sensors and the second electrical component. In an embodiment the encryption bank may include a plurality of portions that each have one or more switches integrated into the package substrate. In an embodiment each sensor transmits data to the second electrical component along different portions of the encryption bank. In some embodiments, the switches may be piezoelectrically actuated. In other embodiments the switches may be actuated by thermal expansion. Additional embodiments may include tri- or bi-stable mechanical switches.

公开(公告)号：US10079668B2

公开(公告)日：2018-09-18

申请号：US15388204

申请日：2016-12-22

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Emanuel Cohen ,  Sasha N. Oster

IPC: H04L5/14 ,  H04B1/44 ,  H04W72/04

Abstract: Embodiments of the present disclosure may relate to a transceiver to transmit and receive concurrently radio frequency (RF) signals via a dielectric waveguide. In embodiments, the transceiver may include a transmitter to transmit to a paired transceiver a channelized radio frequency (RF) transmit signal via the dielectric waveguide. A receiver may receive from the paired transceiver a channelized RF receive signal via the dielectric waveguide. In embodiments, the channelized RF receive signal may include an echo of the channelized RF transmit signal. The transceiver may further include an echo suppression circuit to suppress from the channelized RF receive signal the echo of the channelized RF transmit signal. In some embodiments, the channelized RF transmit signal and the channelized RF receive signal may be within a frequency range of approximately 30 gigahertz (GHz) to approximately 1 terahertz (THz), and the transceiver may provide full-duplex millimeter-wave communication.