EMC MATERIAL FOR THERMAL TRANSPORT AND VIBRATION DAMPENING

    公开(公告)号:US20230180447A1

    公开(公告)日:2023-06-08

    申请号:US17643294

    申请日:2021-12-08

    CPC classification number: H05K9/0086 H05K9/0007

    Abstract: Embodiments relate to materials and methods for manufacturing the materials for an enclosure that houses one or more electronic devices. In some embodiments, the materials include a tuned micro-lattice that includes one or more metallic materials defining a micro-lattice configuration. In some embodiments, the one or more metallic materials extend over at least a portion of an elastomeric material. In some embodiments, the materials include a tuned composite metallic foam including one or more metallic materials. A first portion of the foam has a first porosity and a second portion of the foam has a second porosity. In some embodiments, the materials for the enclosure are one or more of a gasket and a coating that extends over a least a portion of an interior portion of the enclosure.

    LAND GRID ARRAY ELECTRICAL CONTACT COATING

    公开(公告)号:US20220029326A1

    公开(公告)日:2022-01-27

    申请号:US16936476

    申请日:2020-07-23

    Abstract: An land grid array (LGA) or hybrid land grid array (HLGA) includes a socket housing and a plurality of electrical contacts. The socket housing is made of a first material that defines a first dielectric constant. The plurality of electrical contacts extends through the socket housing to electrically couple a printed circuit board on a first side of the socket housing to a processor on a second side of the socket housing. A coating of a second material that defines a second dielectric constant that is higher than the first dielectric constant covers surfaces of a subset of the plurality of electrical contacts.

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