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公开(公告)号:US12207446B2
公开(公告)日:2025-01-21
申请号:US17816767
申请日:2022-08-02
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor: Mehdi Hamid Vishkasougheh , Kevin O'Connell , Eric J. Campbell , Arshad Alfoqaha , Connor L. Smith
Abstract: A heat sink retention device for retaining a heat sink, including a spring, proximate an electronic device in a circuit board. The device includes a first component configured to be attached to a circuit board, and a second component configured to be adjustably attached to the first component, and including an opening configured to retain a portion of a spring of a heat sink. When the first and second components are attached together and the first component is attached to the circuit board, the heat sink retention device is adapted to allow application of a force on the spring in order to retain the heat sink proximate an electronic device mounted on the circuit board.
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公开(公告)号:US12022632B2
公开(公告)日:2024-06-25
申请号:US17710994
申请日:2022-03-31
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor: Arthur J. Higby , Camillo Sassano , Christopher M. Marroquin , Brandon R. Christenson , Kevin O'Connell
CPC classification number: H05K7/1409 , H05K7/1489
Abstract: A latch assembly includes a lever arm affixed to a latch pivot point of rotation with a cam having a connecting slot. A load mechanism is configured to apply a force on the latch pivot point to retain the lever arm in a first position. The load mechanism is tuned to apply the force along a tolerance range of operation of the latch assembly.
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公开(公告)号:US11289836B2
公开(公告)日:2022-03-29
申请号:US16936476
申请日:2020-07-23
Applicant: International Business Machines Corporation
Inventor: Kevin O'Connell , Mark K. Hoffmeyer , Matthew Doyle
Abstract: An land grid array (LGA) or hybrid land grid array (HLGA) includes a socket housing and a plurality of electrical contacts. The socket housing is made of a first material that defines a first dielectric constant. The plurality of electrical contacts extends through the socket housing to electrically couple a printed circuit board on a first side of the socket housing to a processor on a second side of the socket housing. A coating of a second material that defines a second dielectric constant that is higher than the first dielectric constant covers surfaces of a subset of the plurality of electrical contacts.
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公开(公告)号:US12075578B2
公开(公告)日:2024-08-27
申请号:US18476961
申请日:2023-09-28
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor: Adam Spiegelman , Kevin O'Connell , Kenneth E. Lubahn , Justin Christopher Rogers , Eric J. Campbell
CPC classification number: H05K5/0221 , E05C3/14 , E05C5/02 , E05C19/06
Abstract: A latch mechanism includes a mounting bracket, a stop connected to the mounting bracket, a first spring connected to the mounting bracket and in contact with the stop to preload the first spring, and a latch. The latch includes a second spring rotatably connected to the mounting bracket, and a body connected to the second spring. The body includes a pad at one end of the body, and a first pawl at a second end of the body opposite of the pad.
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公开(公告)号:US20240258795A1
公开(公告)日:2024-08-01
申请号:US18103273
申请日:2023-01-30
Applicant: International Business Machines Corporation
Inventor: George Paulik , Timothy Lindquist , George Russell Zettles, IV , Jarrett Betke , Daniel Ramirez , Timothy Clyde Buchholtz , Kevin O'Connell , Austin Carter
Abstract: Techniques are provided to convert utility power having an unstable utility frequency into supply power having a stable frequency, which can be distributed and utilized as a system reference. For example, a system comprises a power generator and a power distribution system. The power generator is configured to convert utility power having an unstable utility frequency to supply power having a stable frequency component. The power distribution system is coupled to an output of the power generator, and is configured to distribute the supply power having the stable frequency component to at least one power consumer which is configured to utilize the stable frequency component of the supply power as a reference frequency.
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公开(公告)号:US20230301014A1
公开(公告)日:2023-09-21
申请号:US17655581
申请日:2022-03-21
Applicant: International Business Machines Corporation
Inventor: William James Anderl , Alex Matos , Brenda Berg , Kevin O'Connell
IPC: H05K7/20
CPC classification number: H05K7/20145 , H05K7/20309 , H05K7/20336
Abstract: A heat sink to selectively dissipate heat from a plurality of heat-generating components. The heat sink includes a plurality of heat pipes, and a base plate configured to locate at least one of the plurality of heat pipes proximate each of the plurality of heat-generating components. The heat sink also includes a plurality of sets of fins operable to dissipate heat generated by the heat-generating components, and a plurality of sets of louvers, wherein each of the plurality of sets of louvers is associated with one of the plurality of sets of fins and is operable to open to selectively allow airflow from outside the heat sink to dissipate heat from one of the plurality of sets of fins.
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公开(公告)号:US20240426558A1
公开(公告)日:2024-12-26
申请号:US18341305
申请日:2023-06-26
Applicant: International Business Machines Corporation
Inventor: Kevin O'Connell , Phillip V. Mann , William James Anderl , Alexander Matos , Brenda Berg
Abstract: A heat pipe system, method, and heat sink system to enhance heat transfer from a heat-generating component. The method includes generating heat with the heat-generating component. The method also includes transferring at least a portion of the heat to at least a portion of a volatile fluid within one or more heat pipes. The method further includes modifying, dynamically, an active heat transfer region of the one or more heat pipes, thereby dynamically modulating heat transfer from the heat-generating component through the one or more heat pipes.
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公开(公告)号:US20240049432A1
公开(公告)日:2024-02-08
申请号:US17816767
申请日:2022-08-02
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor: Mehdi Hamid Vishkasougheh , Kevin O'Connell , Eric J. Campbell , Arshad Alfoqaha , Connor L. Smith
IPC: H05K7/20
CPC classification number: H05K7/2049
Abstract: A heat sink retention device for retaining a heat sink, including a spring, proximate an electronic device in a circuit board. The device includes a first component configured to be attached to a circuit board, and a second component configured to be adjustably attached to the first component, and including an opening configured to retain a portion of a spring of a heat sink. When the first and second components are attached together and the first component is attached to the circuit board, the heat sink retention device is adapted to allow application of a force on the spring in order to retain the heat sink proximate an electronic device mounted on the circuit board.
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公开(公告)号:US20230200023A1
公开(公告)日:2023-06-22
申请号:US17644562
申请日:2021-12-16
Applicant: International Business Machines Corporation
Inventor: Arshad Alfoqaha , Kevin O'Connell , Mehdi Hamid Vishkasougheh , Eric J. Campbell
CPC classification number: H05K7/20736 , G06F1/20 , H05K7/1492 , G06F1/185
Abstract: A server includes a printed circuit board (PCB), an electronic component connected to the printed circuit board, and a chassis connected to the PCB. The chassis includes a first end with a first aperture configured to allow airflow into the server, a second end with a second aperture configured to allow the airflow out of the server after having passed across the electronic component, and a temporary bulkhead that is movable between a deployed position and a stowed position, wherein in the deployed position, the temporary bulkhead is connected to the PCB and extends across the server in a path of the airflow, and wherein in the stowed position, the temporary bulkhead is disconnected from the PCB and is positioned to open the path of the airflow.
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公开(公告)号:US20230200002A1
公开(公告)日:2023-06-22
申请号:US17644786
申请日:2021-12-16
Applicant: International Business Machines Corporation
Inventor: Kevin O'Connell , Alex Matos , Janet Cederholm , Brenda Berg , William James Anderl
CPC classification number: H05K7/20181 , H05K7/1425
Abstract: A server includes a printed circuit board (PCB), an electronic component connected to the PCB, and a chassis connected to the PCB. The chassis includes a first end with a first aperture configured to allow airflow into the server, a second end with a second aperture configured to allow the airflow out of the server after having passed across the electronic component, and a movable bulkhead comprising a first set of louvers, the movable bulkhead being movable between a closed position and an opened position, wherein each of the louvers includes a leading edge contact feature configured to interface with a trailing edge of a respective adjacent louver. In the closed position, the first set of louvers forms a wall in a primary path of the airflow, and, in the opened position, the first set of louvers are oriented in a direction of the primary path of the airflow.
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