Adjustable retention device for heat sink assembly

    公开(公告)号:US12207446B2

    公开(公告)日:2025-01-21

    申请号:US17816767

    申请日:2022-08-02

    Abstract: A heat sink retention device for retaining a heat sink, including a spring, proximate an electronic device in a circuit board. The device includes a first component configured to be attached to a circuit board, and a second component configured to be adjustably attached to the first component, and including an opening configured to retain a portion of a spring of a heat sink. When the first and second components are attached together and the first component is attached to the circuit board, the heat sink retention device is adapted to allow application of a force on the spring in order to retain the heat sink proximate an electronic device mounted on the circuit board.

    ADJUSTABLE RETENTION DEVICE FOR HEAT SINK ASSEMBLY

    公开(公告)号:US20240049432A1

    公开(公告)日:2024-02-08

    申请号:US17816767

    申请日:2022-08-02

    CPC classification number: H05K7/2049

    Abstract: A heat sink retention device for retaining a heat sink, including a spring, proximate an electronic device in a circuit board. The device includes a first component configured to be attached to a circuit board, and a second component configured to be adjustably attached to the first component, and including an opening configured to retain a portion of a spring of a heat sink. When the first and second components are attached together and the first component is attached to the circuit board, the heat sink retention device is adapted to allow application of a force on the spring in order to retain the heat sink proximate an electronic device mounted on the circuit board.

    STRUCTURALLY ENHANCED FAN LOUVER ASSEMBLY
    10.
    发明公开

    公开(公告)号:US20230200002A1

    公开(公告)日:2023-06-22

    申请号:US17644786

    申请日:2021-12-16

    CPC classification number: H05K7/20181 H05K7/1425

    Abstract: A server includes a printed circuit board (PCB), an electronic component connected to the PCB, and a chassis connected to the PCB. The chassis includes a first end with a first aperture configured to allow airflow into the server, a second end with a second aperture configured to allow the airflow out of the server after having passed across the electronic component, and a movable bulkhead comprising a first set of louvers, the movable bulkhead being movable between a closed position and an opened position, wherein each of the louvers includes a leading edge contact feature configured to interface with a trailing edge of a respective adjacent louver. In the closed position, the first set of louvers forms a wall in a primary path of the airflow, and, in the opened position, the first set of louvers are oriented in a direction of the primary path of the airflow.

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