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公开(公告)号:US20150200437A1
公开(公告)日:2015-07-16
申请号:US14155130
申请日:2014-01-14
Applicant: Infineon Technologies AG
Inventor: Valentyn Solomko , Winfried Bakalski , Nikolay Ilkov , Werner Simbuerger , Daniel Kehrer
CPC classification number: H01P5/18 , G01R1/203 , G01R1/206 , G01R19/00 , G01R21/07 , H01P5/04 , H03H7/48
Abstract: In accordance with an embodiment, a circuit includes a current sensing circuit comprising a current input terminal coupled to an input port, a current output terminal coupled to a transmitted port, and a current sensing output terminal configured to provide a current sensing signal proportional to a current flowing between the current input terminal and the current output terminal. The circuit further includes a voltage sensing circuit having a voltage input terminal coupled to the transmitted port and a voltage sensing output terminal configured to provide a voltage sensing signal proportional to a voltage at the transmitted port. A combining circuit has a first input coupled to the current sensing output terminal, a second input coupled to the voltage sensing output terminal, and a combined output node coupled to an output port.
Abstract translation: 根据实施例,电路包括电流检测电路,其包括耦合到输入端口的电流输入端子,耦合到发射端口的电流输出端子,以及电流感测输出端子,其被配置为提供与 电流输入端与电流输出端之间流动的电流。 电路还包括电压感测电路,其电压输入端耦合到传输端口,电压感测输出端被配置为提供与传输端口处的电压成比例的电压感测信号。 组合电路具有耦合到电流感测输出端的第一输入,耦合到电压感测输出端的第二输入和耦合到输出端的组合输出节点。
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公开(公告)号:US09941909B2
公开(公告)日:2018-04-10
申请号:US15241736
申请日:2016-08-19
Applicant: Infineon Technologies AG
Inventor: Daniel Kehrer
IPC: H03K9/00 , H04B1/00 , H04B1/10 , H04B7/0452
CPC classification number: H04B1/006 , H04B1/1027 , H04B7/0452
Abstract: According to an embodiment, a circuit package includes a programmable switch component having a plurality of input terminals arranged on the programmable switch component, a plurality of output terminals arranged on the programmable switch component and configured to be coupled to a plurality of amplifiers, and a plurality of switches. Each switch of the plurality of switches is coupled between an input terminal of the plurality of input terminals and an output terminal of the plurality of output terminals. Each switch of the plurality of switches includes a radio frequency (RF) switch and is configured to pass an RF signal when closed. Each input terminal of the plurality of input terminals is coupled to two switches of the plurality of switches.
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公开(公告)号:US20160248388A1
公开(公告)日:2016-08-25
申请号:US15144907
申请日:2016-05-03
Applicant: Infineon Technologies AG
Inventor: Nikolay Ilkov , Paulo Oliveira , Daniel Kehrer
IPC: H03F3/19
CPC classification number: H03F3/19 , H03F1/0261 , H03F3/191 , H03F2200/111 , H03F2200/249 , H03F2200/294 , H03F2200/39 , H03F2200/451 , H04B1/10
Abstract: In accordance with an embodiment, a circuit includes a low noise amplifier transistor disposed on a first integrated circuit, a single pole multi throw (SPMT) switch disposed on a second integrated circuit, and a bypass switch coupled between a control node of the low noise amplifier transistor and an output node of the low noise amplifier transistor. The SPMT switch couples a plurality of module input terminals to a control node of the low noise amplifier transistor, and the bypass switch including a first switch coupled between the control node of the low noise amplifier transistor and an intermediate node, a second switch coupled between the intermediate node and the output node of the low noise amplifier transistor, and a third switch coupled between the intermediate node and a first reference node. The first integrated circuit and the second integrated circuit are disposed on a substrate.
Abstract translation: 根据实施例,电路包括设置在第一集成电路上的低噪声放大器晶体管,设置在第二集成电路上的单极多掷(SPMT)开关,以及耦合在低噪声控制节点之间的旁路开关 放大器晶体管和低噪声放大器晶体管的输出节点。 SPMT开关将多个模块输入端子耦合到低噪声放大器晶体管的控制节点,并且旁路开关包括耦合在低噪声放大器晶体管的控制节点和中间节点之间的第一开关,第二开关耦合在 低噪声放大器晶体管的中间节点和输出节点,以及耦合在中间节点和第一参考节点之间的第三开关。 第一集成电路和第二集成电路设置在基板上。
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公开(公告)号:US20150295594A1
公开(公告)日:2015-10-15
申请号:US14252322
申请日:2014-04-14
Applicant: Infineon Technologies AG
Inventor: Daniel Kehrer
CPC classification number: H04B1/006 , H04B1/1027 , H04B7/0452
Abstract: According to an embodiment, a circuit package includes a programmable switch component having a plurality of input terminals arranged on the programmable switch component, a plurality of output terminals arranged on the programmable switch component and configured to be coupled to a plurality of amplifiers, and a plurality of switches. Each switch of the plurality of switches is coupled between an input terminal of the plurality of input terminals and an output terminal of the plurality of output terminals. Each switch of the plurality of switches includes a radio frequency (RF) switch and is configured to pass an RF signal when closed. Each input terminal of the plurality of input terminals is coupled to two switches of the plurality of switches.
Abstract translation: 根据实施例,电路封装包括具有布置在可编程开关组件上的多个输入端的可编程开关组件,布置在可编程开关组件上并被配置为耦合到多个放大器的多个输出端子,以及 多个开关。 多个开关的每个开关耦合在多个输入端子的输入端子和多个输出端子的输出端子之间。 多个开关的每个开关包括射频(RF)开关,并且被配置为在关闭时传递RF信号。 多个输入端子的每个输入端子耦合到多个开关的两个开关。
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公开(公告)号:US20140231974A1
公开(公告)日:2014-08-21
申请号:US14266348
申请日:2014-04-30
Applicant: INFINEON TECHNOLOGIES AG
Inventor: Daniel Kehrer , Ulrich Krumbein , Beng-Keh See , Horst Theuss , Helmut Wietschorke , Tze Yang Hin , Stefan Martens
IPC: H01L23/495 , H01L23/00 , H01L23/66
CPC classification number: H01L23/495 , H01L23/3107 , H01L23/315 , H01L23/49548 , H01L23/49575 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/83 , H01L25/16 , H01L2223/6611 , H01L2224/16145 , H01L2224/16245 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01047 , H01L2924/01322 , H01L2924/181 , H01L2924/3011 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
Abstract: A module and a method for manufacturing a module are disclosed. An embodiment of a module includes a first semiconductor device, a frame arranged on the first semiconductor device, the frame including a cavity, and a second semiconductor device arranged on the frame wherein the second semiconductor device seals the cavity.
Abstract translation: 公开了一种用于制造模块的模块和方法。 模块的实施例包括第一半导体器件,布置在第一半导体器件上的框架,包括空腔的框架和布置在框架上的第二半导体器件,其中第二半导体器件密封空腔。
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