公开(公告)号：US20140231974A1

公开(公告)日：2014-08-21

申请号：US14266348

申请日：2014-04-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Daniel Kehrer ,  Ulrich Krumbein ,  Beng-Keh See ,  Horst Theuss ,  Helmut Wietschorke ,  Tze Yang Hin ,  Stefan Martens

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/66

CPC classification number: H01L23/495 ,  H01L23/3107 ,  H01L23/315 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L25/16 ,  H01L2223/6611 ,  H01L2224/16145 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A module and a method for manufacturing a module are disclosed. An embodiment of a module includes a first semiconductor device, a frame arranged on the first semiconductor device, the frame including a cavity, and a second semiconductor device arranged on the frame wherein the second semiconductor device seals the cavity.

Abstract translation: 公开了一种用于制造模块的模块和方法。 模块的实施例包括第一半导体器件，布置在第一半导体器件上的框架，包括空腔的框架和布置在框架上的第二半导体器件，其中第二半导体器件密封空腔。

公开(公告)号：US09691687B2

公开(公告)日：2017-06-27

申请号：US14266348

申请日：2014-04-30

Applicant: Infineon Technologies AG

Inventor： Daniel Kehrer ,  Ulrich Krumbein ,  Beng-Keh See ,  Horst Theuss ,  Helmut Wietschorke ,  Tze Yang Hin ,  Stefan Martens

IPC: H01L23/34 ,  H01L23/495 ,  H01L23/31 ,  H01L23/66 ,  H01L25/16 ,  H01L23/00

CPC classification number: H01L23/495 ,  H01L23/3107 ,  H01L23/315 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L25/16 ,  H01L2223/6611 ,  H01L2224/16145 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A module and a method for manufacturing a module are disclosed. An embodiment of a module includes a first semiconductor device, a frame arranged on the first semiconductor device, the frame including a cavity, and a second semiconductor device arranged on the frame wherein the second semiconductor device seals the cavity.

公开(公告)号：US20140167272A1

公开(公告)日：2014-06-19

申请号：US13716004

申请日：2012-12-14

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Stefan Martens ,  Berthold Schuderer ,  Mathias Vaupel ,  Raimund Peichl

IPC: H01L23/544 ,  H01L21/48

CPC classification number: H01L23/544 ,  H01L23/3171 ,  H01L2223/54406 ,  H01L2223/54413 ,  H01L2223/5442 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device includes a chip, a contact pad arranged over the front side of the chip and an identification mark arranged over the contact pad. The identification mark includes an information about a property of the chip.

Abstract translation: 半导体器件包括芯片，布置在芯片的前侧上的接触焊盘和布置在接触焊盘上的识别标记。 识别标记包括关于芯片的属性的信息。

公开(公告)号：US09475691B1

公开(公告)日：2016-10-25

申请号：US14751316

申请日：2015-06-26

Applicant: Infineon Technologies AG

Inventor： Kok Yau Chua ,  Sook Woon Chan ,  Chau Fatt Chiang ,  Stefan Martens ,  Matthias Steiert ,  Kian Hong Yeo ,  Hock Siang Chua ,  Mei Chin Ng ,  Swee Kah Lee

IPC: H01L23/495 ,  B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0064 ,  B81B7/0032 ,  B81B7/0048 ,  B81B7/0051 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2203/0315 ,  B81B2207/093 ,  B81C1/00333 ,  B81C2203/0154 ,  B81C2203/032 ,  H01L23/04 ,  H01L23/24 ,  H01L23/495 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49575 ,  H01L23/49861 ,  H01L2224/16245

Abstract: A semiconductor package includes an electrically conductive lead-frame, including a first die paddle having a first opening, and a plurality of electrically conductive leads, a ridge formed around a perimeter of the first opening, and an electrically insulating molding compound. The electrically insulating molding compound includes an interior cavity being defined by a planar base surface and outer sidewalls, a second opening formed in the base surface, and an interior sidewall within the interior cavity. The molding compound is formed around the lead-frame with the first die paddle in the interior cavity. The first and second openings are aligned with one another so as to form a port that provides access to the interior cavity. The ridge and the interior sidewall form a dam that is configured to collect liquefied sealant and prevent the liquefied sealant from overflowing into the port or into adjacent regions of the interior cavity.

Abstract translation: 半导体封装包括导电引线框架，其包括具有第一开口的第一管芯焊盘和多个导电引线，围绕第一开口周边形成的脊，以及电绝缘模塑料。 电绝缘模制化合物包括由平坦的基面和外侧壁限定的内腔，形成在基底表面中的第二开口和内腔内的内侧壁。 模制化合物围绕引线架形成，其中第一管芯焊盘在内部空腔中。 第一和第二开口彼此对齐，以便形成提供通向内腔的通路的端口。 脊和内侧壁形成一个水坝，其构造成收集液化的密封剂并防止液化的密封剂溢出到内部空腔的端口或邻近的区域中。

公开(公告)号：US09312226B2

公开(公告)日：2016-04-12

申请号：US13716004

申请日：2012-12-14

Applicant: Infineon Technologies AG

Inventor： Stefan Martens ,  Berthold Schuderer ,  Mathias Vaupel ,  Raimund Peichl

IPC: H01L23/485 ,  H01L23/544 ,  H01L23/31

CPC classification number: H01L23/544 ,  H01L23/3171 ,  H01L2223/54406 ,  H01L2223/54413 ,  H01L2223/5442 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device includes a chip, a contact pad arranged over the front side of the chip and an identification mark arranged over the contact pad. The identification mark includes an information about a property of the chip.

Abstract translation: 半导体器件包括芯片，布置在芯片的前侧上的接触焊盘和布置在接触焊盘上的识别标记。 识别标记包括关于芯片的属性的信息。

公开(公告)号：US20150087131A1

公开(公告)日：2015-03-26

申请号：US14032223

申请日：2013-09-20

Applicant: Infineon Technologies AG

Inventor： Stefan Martens ,  Raimund Peichl

IPC: H01L21/78 ,  H01L23/544

CPC classification number: H01L21/78 ,  H01L21/6835 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for processing a chip is provided. The method may include: providing a chip having a front side and a back side; and forming an orientation marker on the back side of the chip by forming a hole into the chip from the front side of the chip, the hole forming the orientation marker.

Abstract translation: 提供了一种处理芯片的方法。 该方法可以包括：提供具有前侧和后侧的芯片; 以及通过从所述芯片的前侧向所述芯片形成孔而形成所述芯片背面的取向标记，所述孔形成所述取向标记。