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公开(公告)号:US11204411B2
公开(公告)日:2021-12-21
申请号:US15897632
申请日:2018-02-15
Applicant: Infineon Technologies AG
Inventor: Reinhard-Wolfgang Jungmaier , Saverio Trotta , Ashutosh Baheti , Jagjit Singh Bal
IPC: G01S7/41 , G01S7/35 , G01S13/06 , G01S13/88 , G01S7/03 , G01S13/87 , G01S13/02 , G01S13/34 , G01S7/02
Abstract: A method of operating a radar system includes transmitting a plurality of transmitted radio frequency (RF) signals by a plurality of directional antennas. The plurality of directional antennas is disposed on a planar surface of a substrate. Each of the plurality of antennas is in a fixed orientation and position on the planar surface. A respective individual coverage of each of the plurality of directional antennas is less than 360°. A combined coverage of the plurality of transmitted RF signals completely covers a 360° region surrounding the radar system. The method also includes receiving a reflected RF signal by a directional antenna of the plurality of directional antennas.
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公开(公告)号:US20200348393A1
公开(公告)日:2020-11-05
申请号:US16903463
申请日:2020-06-17
Applicant: Infineon Technologies AG
Inventor: Saverio Trotta , Reinhard-Wolfgang Jungmaier , Dennis Noppeney , Ashutosh Baheti , Ismail Nasr , Jagjit Singh Bal
Abstract: In accordance with an embodiment, a method of operating a radar system includes receiving radar configuration data from a host, and receiving a start command from the host after receiving the radar configuration data. The radar configuration data includes chirp parameters and frame sequence settings. After receiving the start command, configuring a frequency generation circuit is configured with the chirp parameters and radar frames are triggered at a preselected rate.
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23.
公开(公告)号:US10746625B2
公开(公告)日:2020-08-18
申请号:US15852907
申请日:2017-12-22
Applicant: Infineon Technologies AG
Inventor: Avik Santra , Jagjit Singh Bal
Abstract: In accordance with an embodiment, a method of monitoring a structural object includes performing a first set of radar measurements using a first millimeter-wave radar sensor to produce a first set of radar data, extracting a first interferometric phase from the first set of radar measurements, and determining a structural integrity of the structural object based on the extracted first interferometric phase.
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24.
公开(公告)号:US20190195728A1
公开(公告)日:2019-06-27
申请号:US15852907
申请日:2017-12-22
Applicant: Infineon Technologies AG
Inventor: Avik Santra , Jagjit Singh Bal
Abstract: In accordance with an embodiment, a method of monitoring a structural object includes performing a first set of radar measurements using a first millimeter-wave radar sensor to produce a first set of radar data, extracting a first interferometric phase from the first set of radar measurements, and determining a structural integrity of the structural object based on the extracted first interferometric phase.
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公开(公告)号:US10218407B2
公开(公告)日:2019-02-26
申请号:US15231544
申请日:2016-08-08
Applicant: Infineon Technologies AG
Inventor: Saverio Trotta , Ashutosh Baheti , Reinhard-Wolfgang Jungmaier , Jagjit Singh Bal
IPC: G01S7/41 , H04B1/44 , G06F3/01 , H01Q21/00 , H04B1/3827 , G01S13/88 , G06F1/16 , H01Q21/06 , G06F3/0346 , H01Q1/27 , G01S13/93 , H01Q3/24 , H01Q3/26
Abstract: A radio frequency (RF) system includes an RF integrated circuit (IC) die. The RF IC die includes a first transmit circuit, a second transmit circuit, a first receive circuit, a second receive circuit, and a control circuit coupled to the first transmit circuit, the second transmit circuit, the first receive circuit, and the second receive circuit. The RF system further includes a first antenna coupled to the first transmit circuit and the first receive circuit using a first coupling structure. The control circuit is configured to activate the first transmit circuit and deactivate the first receive circuit during a first operation mode. The RF system further includes a second antenna coupled to the second transmit circuit and the second receive circuit using a second coupling structure. The control circuit is configured to activate the second transmit circuit and deactivate the second receive circuit during a second operation mode.
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公开(公告)号:US20150117862A1
公开(公告)日:2015-04-30
申请号:US14067640
申请日:2013-10-30
Applicant: Infineon Technologies AG
Inventor: Saverio Trotta , Jagjit Singh Bal , Maciej Wojnowski , Ernst Seler , Mehran Pour Mousavi
IPC: H01P3/12 , H04B10/2575 , H05K1/18 , H04B10/572 , H05K1/11 , H05K1/02
CPC classification number: H01P5/107 , H01P3/12 , H04B10/2575 , H04B10/572 , H05K1/0206 , H05K1/024 , H05K1/0242 , H05K1/0251 , H05K1/116 , H05K1/181 , H05K3/4697
Abstract: According to an embodiment, a circuit board includes a signal line including at least portion of a first conductive layer that has a first portion extending over a cavity in the circuit board from a first side of the cavity. The circuit board also includes a first plurality of conductive vias surrounding the cavity and the first plurality of vias include at least one blind via disposed adjacent to the first side of the cavity.
Abstract translation: 根据实施例,电路板包括信号线,该信号线包括第一导电层的至少一部分,第一导电层具有第一部分,该第一部分从空腔的第一侧延伸到电路板中的空腔上。 电路板还包括围绕空腔的第一多个导电通孔,并且第一多个通孔包括邻近空腔的第一侧设置的至少一个盲孔。
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