公开(公告)号：US20150061140A1

公开(公告)日：2015-03-05

申请号：US14015626

申请日：2013-08-30

Applicant: Infineon Technologies AG

Inventor： Tian San Tan ,  Theng Chao Long ,  Teck Siang Hee

IPC: H01L23/00 ,  H01L23/28

CPC classification number: H01L23/32 ,  H01L23/057 ,  H01L23/16 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/48 ,  H01L24/06 ,  H01L24/29 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/42 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0603 ,  H01L2224/29101 ,  H01L2224/33181 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01R13/405 ,  H01R24/58 ,  H01R24/86 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/014 ,  H01L2924/00012

Abstract: A semiconductor package includes a semiconductor die having a plurality of terminals, a molding compound encapsulating the semiconductor die, and a pluggable lead dimensioned for insertion into an external receptacle. The pluggable lead protrudes from the molding compound and provides a separate electrical pathway for more than one terminal of the semiconductor die. The separate electrical pathways of the pluggable lead can be provided by electrical conductors isolated from one another by electrical insulator such as molding compound or other insulation material/medium.

Abstract translation: 半导体封装包括具有多个端子的半导体管芯，封装半导体管芯的模制化合物和用于插入到外部插座中的可插拔引线。 可插拔引线从模制化合物突出并且为半导体管芯的多于一个端子提供单独的电路径。 可插拔引线的单独电路可以由电绝缘体（例如模塑料或其它绝缘材料/介质）彼此隔离的电导体提供。