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公开(公告)号:US20250105119A1
公开(公告)日:2025-03-27
申请号:US18373848
申请日:2023-09-27
Applicant: Intel Corporation
Inventor: Yuqin LI , Jesse JONES , Sandrine LTEIF , Srinivas V. PIETAMBARAM , Suresh Tanaji NARUTE , Pramod MALATKAR , Gang DUAN , Khaled AHMED
IPC: H01L23/498 , H01L21/48 , H01L23/00 , H01L23/15
Abstract: Embodiments disclosed herein include glass cores with vias that are lined by a self-healing liner. In an embodiment, an apparatus comprises a substrate that comprises a solid glass layer with an opening through a thickness of the substrate. In an embodiment, a liner is in contact with a sidewall of the opening, where the liner comprises a polymer matrix with capsules distributed through the polymer matrix. In an embodiment, each capsule comprises a shell, and a core within the shell. In an embodiment, the core comprises an organic material. In an embodiment, a via is in the opening and in contact with the liner, and the via is electrically conductive.
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公开(公告)号:US20190393377A1
公开(公告)日:2019-12-26
申请号:US16563558
申请日:2019-09-06
Applicant: Intel Corporation
Inventor: Khaled AHMED , Anup PANCHOLI , Ali KHAKIFIROOZ
Abstract: Micro light-emitting diode (LED) displays and assembly apparatuses are described. In an example, a pixel element for a micro-light emitting diode (LED) display panel includes a first color nanowire LED, a second color nanowire LED, the second color different than the first color, and a pair of third color nanowire LEDs, the third color different than the first and second colors. A continuous insulating material layer ius laterally surrounding the first color nanowire LED, the second color nanowire LED, and the pair of third color nanowire LEDs.
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公开(公告)号:US20180261785A1
公开(公告)日:2018-09-13
申请号:US15918893
申请日:2018-03-12
Applicant: Intel Corporation
Inventor: Khaled AHMED , Ali KHAKIFIROOZ , Richmond HICKS
IPC: H01L51/50 , H01L51/56 , H01L27/32 , G02B6/27 , G02B6/35 , G02B27/10 , G06F3/01 , G02B27/01 , H01S5/183
CPC classification number: H01L51/508 , G02B6/2706 , G02B6/3516 , G02B27/0172 , G02B27/0176 , G02B27/10 , G02B2027/0174 , G02B2027/0178 , G06F3/011 , H01L27/3211 , H01L27/323 , H01L27/326 , H01L33/20 , H01L33/24 , H01L51/5012 , H01L51/5064 , H01L51/56 , H01S5/183
Abstract: Embodiments related to emissive devices for displays are discussed. Some embodiments include light emitting diodes including an electron transport layer core having a tube shape with an inner and an outer sidewall, an emission layer on the inner and outer sidewalls, and a hole transport layer on the emission layer, displays and systems including such light emitting diodes, and methods for fabricating them. Other embodiments include emissive laser devices having an emission layer between a hole transport layer and an electron transport layer and first and second metasurface mirrors adjacent to the hole transport layer and the electron transport layer, respectively, displays and systems including such emissive laser devices, and methods for fabricating them.
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