公开(公告)号：US20220084962A1

公开(公告)日：2022-03-17

申请号：US17024307

申请日：2020-09-17

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Kristof Darmawikarta ,  Benjamin Duong ,  Telesphor Kamgaing ,  Miranda Ngan ,  Srinivas Pietambaram

IPC: H01L23/66 ,  H05K1/02 ,  H01P3/08 ,  H01Q1/22 ,  H01L25/065 ,  H01L25/00

Abstract: An electronic assembly, such as an integrated circuit package, may be formed comprising a package substrate, a plurality of integrated circuit devices electrically attached to the package substrate, wherein each integrated circuit device of the plurality of integrated circuit devices includes an active surface and a backside surface, and wherein a first integrated circuit device and a second integrated circuit device of the plurality of integrated circuit devices includes radio frequency logic circuitry and a radio frequency antenna formed in or attached thereto, and a radio frequency waveguide on the backside surface of the first integrated circuit device and on the backside surface of the second integrated circuit device.

公开(公告)号：US20210408655A1

公开(公告)日：2021-12-30

申请号：US16911934

申请日：2020-06-25

Applicant: Intel Corporation

Inventor： Neelam Prabhu Gaunkar ,  Georgios Dogiamis ,  Telesphor Kamgaing ,  Henning Braunisch ,  Diego Correas-Serrano

IPC: H01P3/16 ,  H01P1/20 ,  H01Q13/26 ,  H01Q5/328

Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

公开(公告)号：US20210408654A1

公开(公告)日：2021-12-30

申请号：US16911883

申请日：2020-06-25

Applicant: Intel Corporation

Inventor： Diego Correas-Serrano ,  Georgios Dogiamis ,  Henning Braunisch ,  Neelam Prabhu Gaunkar ,  Telesphor Kamgaing

IPC: H01P3/16 ,  H01P3/12 ,  H01P5/08 ,  H01P5/107

Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

公开(公告)号：US20210407934A1

公开(公告)日：2021-12-30

申请号：US16911543

申请日：2020-06-25

Applicant: Intel Corporation

Inventor： Neelam Prabhu Gaunkar ,  Georgios Dogiamis ,  Telesphor Kamgaing ,  Diego Correas-Serrano ,  Henning Braunisch

IPC: H01L23/66 ,  H01L23/498 ,  H01P3/00 ,  H01P3/08

Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

公开(公告)号：US11108433B2

公开(公告)日：2021-08-31

申请号：US16206919

申请日：2018-11-30

Applicant: Intel Corporation

Inventor： Henning Braunisch ,  Georgios Dogiamis ,  Jeff C. Morriss ,  Hyung-Jin Lee ,  Richard Dischler ,  Ajay Balankutty ,  Telesphor Kamgaing ,  Said Rami

IPC: H04B3/52 ,  H04L27/36

Abstract: Embodiments herein may relate to an interconnect that includes a transceiver, wherein the transceiver is configured to generate a single side band (SSB) signal for communication over a waveguide and a waveguide interconnect to communicate the SSB signal over the waveguide. In an example, an SSB operator is configured to generate the SSB signal and the SSB signal can be generated by use of a finite-impulse response filter. Other embodiments may be described and/or claimed.

公开(公告)号：US11107781B2

公开(公告)日：2021-08-31

申请号：US16481392

申请日：2017-03-30

Applicant: Intel Corporation

Inventor： Srinivas V. Pietambaram ,  Rahul N. Manepalli ,  Kristof Kuwawi Darmawikarta ,  Robert Alan May ,  Aleksandar Aleksov ,  Telesphor Kamgaing

IPC: H01L23/66 ,  H01L21/56 ,  H01L23/00

Abstract: Semiconductor packages having a die electrically connected to an antenna by a coaxial interconnect are described. In an example, a semiconductor package includes a molded layer between a first antenna patch and a second antenna patch of the antenna. The first patch may be electrically connected to the coaxial interconnect, and the second patch may be mounted on the molded layer. The molded layer may be formed from a molding compound, and may have a stiffness to resist warpage during fabrication and use of the semiconductor package.

公开(公告)号：US11050155B2

公开(公告)日：2021-06-29

申请号：US16345171

申请日：2016-12-14

Applicant: Intel Corporation

Inventor： Feras Eid ,  Sasha N. Oster ,  Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Aleksandar Aleksov

IPC: H01Q1/24 ,  H01Q1/38 ,  H01L23/66 ,  H01Q9/04 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L23/552 ,  H01Q1/22 ,  H01Q1/52 ,  H01Q19/22 ,  H01L23/367

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

公开(公告)号：US11037892B2

公开(公告)日：2021-06-15

申请号：US16465545

申请日：2016-12-30

Applicant: Intel Corporation

Inventor： Vijay K. Nair ,  Sasha N. Oster ,  Johanna M. Swan ,  Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Adel A. Elsherbini

IPC: H01L23/66 ,  H01L23/538 ,  H01P3/16

Abstract: Waveguides disposed in either an interposer layer or directly in the semiconductor package substrate may be used to transfer signals between semiconductor dies coupled to the semiconductor package. For example, inter-semiconductor die communications using mm-wave carrier signals launched into waveguides specifically tuned to optimize transmission parameters of such signals. The use of such high frequencies beneficially provides for reliable transmission of modulated high data rate signals with lower losses than conductive traces and less cross-talk. The use of mm-wave waveguides provides higher data transfer rates per bump for bump-limited dies as well as beneficially providing improved signal integrity even at such higher data transfer rates. Such mm-wave waveguides may be built directly into semiconductor package layers or may be incorporated into one or more interposed layers that are physically and communicably coupled between the semiconductor dies and the semiconductor package substrate.

公开(公告)号：US20210175873A1

公开(公告)日：2021-06-10

申请号：US16707497

申请日：2019-12-09

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Aleksandar Aleksov ,  Feras Eid ,  Telesphor Kamgaing ,  Johanna M. Swan

IPC: H03H9/54 ,  H03H9/64 ,  H03H9/02

Abstract: Embodiments may relate to a die such as an acoustic wave resonator (AWR) die. The die may include a first filter and a second filter in the die body. The die may further include an electromagnetic interference (EMI) structure that surrounds at least one of the filters. Other embodiments may be described or claimed.

公开(公告)号：US20210044030A1

公开(公告)日：2021-02-11

申请号：US16534820

申请日：2019-08-07

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Feras Eid ,  Georgios Dogiamis ,  Telesphor Kamgaing ,  Johanna M. Swan

IPC: H01Q23/00 ,  H01Q1/52 ,  H01Q1/02

Abstract: Embodiments may relate to a radio frequency (RF) multi-chip module that includes a first RF die and a second RF die. The first and second RF dies may be coupled with a package substrate at an inactive side of the respective dies. A bridge may be coupled with an active side of the first and second RF dies die such that the first and second RF dies are communicatively coupled through the bridge, and such that the first and second RF dies are at least partially between the package substrate and the bridge. Other embodiments may be described or claimed.