公开(公告)号：US6096565A

公开(公告)日：2000-08-01

申请号：US265438

申请日：1999-03-09

申请人： David B. Goland ,  Richard A. Shelleman ,  Subhash L. Shinde ,  Lisa M. Studzinski ,  Rao V. Vallabhaneni

发明人： David B. Goland ,  Richard A. Shelleman ,  Subhash L. Shinde ,  Lisa M. Studzinski ,  Rao V. Vallabhaneni

IPC分类号： H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H01L21/00

CPC分类号： H01L21/4857 ,  H01L23/49888 ,  H01L23/5383 ,  H01L23/5384 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S428/93

摘要： A multilayer ceramic substrate electronic component is provided having high temperature superconductor material circuitry. The high temperature superconductor material is preferably yttrium-barium-copper-oxide and is encased within a noble metal such as silver or gold when forming the surface circuitry or filling of the vias. The noble metal layers preferably have through-openings to enable direct connection of circuitry to the encased superconductor layer. A method is also provided for fabricating such multilayer ceramic substrate electronic components.

摘要翻译： 提供具有高温超导体材料电路的多层陶瓷基板电子部件。 高温超导体材料优选为钇钡钡氧化物，并且当形成表面电路或填充通孔时被包裹在贵金属如银或金中。 贵金属层优选具有通孔以使得电路能够直接连接到被封装的超导体层。 还提供了一种用于制造这种多层陶瓷衬底电子部件的方法。

公开(公告)号：US5759669A

公开(公告)日：1998-06-02

申请号：US577179

申请日：1995-12-22

申请人： Jon Alfred Casey ,  Cynthia Jeane Calli ,  Darren T. Cook ,  David B. Goland ,  John Ulrich Knickerbocker ,  Mark Joseph LaPlante ,  David Clifford Long ,  Daniel Scott Mackin ,  Kathleen Mary McGuire ,  Keith Colin O'Neil ,  Kevin Michael Prettyman ,  Michael Thomas Puchalski ,  Joseph Christopher Saltarelli ,  Candace Anne Sullivan

发明人： Jon Alfred Casey ,  Cynthia Jeane Calli ,  Darren T. Cook ,  David B. Goland ,  John Ulrich Knickerbocker ,  Mark Joseph LaPlante ,  David Clifford Long ,  Daniel Scott Mackin ,  Kathleen Mary McGuire ,  Keith Colin O'Neil ,  Kevin Michael Prettyman ,  Michael Thomas Puchalski ,  Joseph Christopher Saltarelli ,  Candace Anne Sullivan

IPC分类号： B32B3/08 ,  B32B3/26 ,  B32B15/02 ,  H05K1/03 ,  H05K3/40 ,  B29C37/00 ,  B32B3/24

CPC分类号： B32B15/02 ,  B32B3/08 ,  B32B3/26 ,  H05K3/4061 ,  H05K1/0306 ,  H05K2203/0156 ,  H05K2203/082 ,  Y10S428/901 ,  Y10T29/49163 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24331 ,  Y10T428/24339 ,  Y10T428/24802

摘要： The present invention relates generally to a new apparatus and method for screening using porous backing material. More particularly, the invention encompasses an apparatus that uses a porous backing material which is adhered to a green sheet during the screening process. Basically, a backing layer having a very high porosity is adhered to a green sheet, while the green sheet is screened. During the drying process of the green sheet some of the screening fluids are absorbed by the porous backing layer, which allows the screened vias of the green sheet to have a smooth surface.

摘要翻译： 本发明一般涉及使用多孔背衬材料进行筛选的新装置和方法。 更具体地说，本发明包括使用在筛选过程中粘附到生片上的多孔背衬材料的装置。 基本上，具有非常高的孔隙率的背衬层粘附到生片上，同时筛分生片。 在生片的干燥过程中，一些筛选液被多孔背衬层吸收，这允许生片的筛选通孔具有光滑的表面。

公开(公告)号：US5194196A

公开(公告)日：1993-03-16

申请号：US418435

申请日：1989-10-06

申请人： Dudley A. Chance ,  David B. Goland ,  Ho-Ming Tong

发明人： Dudley A. Chance ,  David B. Goland ,  Ho-Ming Tong

IPC分类号： H01L23/08 ,  H01L21/48 ,  H01L21/50 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46

CPC分类号： H01L21/50 ,  H01L21/4807 ,  H01L21/486

摘要： A hermetic package for an electronic device is manufactured by providing a green glass ceramic body with a green via to produce a workpiece. The workpiece is sintered at a temperature at or above 500.degree. C., while compressing the workpiece at a pressure at or above 100 pounds per square inch, so as to obtain a hermetic package. The green via comprises a mixture of copper and a glass ceramic material with a sufficient volume of glass to produce a hermetic package, yet with sufficient copper to have a suitable electrical conductivity.The hermetic package thus produced comprises a sintered glass ceramic body having an electrically conductive sintered via which is hermetically bonded to the glass ceramic body and which comprises a mixture of an electrically conductive material and a glass ceramic material. The electrically conductive material forms at most 50 volume percent of the via.The workpiece may be sintered in a sintering fixture having a frame and a compensating insert. The compensating insert and frame bound a sintering chamber for accommodating the workpiece. By providing a frame having a thermal expansion coefficient greater than that of the workpiece, and by providing a compensating insert having a thermal expansion coefficient greater than that of the frame, a close fit can be assured between the workpiece and the sintering fixture over a large range of temperatures.