公开(公告)号：US20070285908A1

公开(公告)日：2007-12-13

申请号：US11844084

申请日：2007-08-23

申请人： Kuang-woo NAM ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

发明人： Kuang-woo NAM ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

IPC分类号： H05K7/00

CPC分类号： H03H9/0547

摘要： A balance filter packaging chip having a balun mounted therein and a manufacturing method thereof are provided. The balance filter packaging chip includes a device substrate; a balance filter mounted on the device substrate; a bonding layer stacked on a certain area of the device substrate; a packaging substrate having a cavity formed over the balance filter, and combined with the device substrate by the bonding layer; a balun located on a certain area over the packaging substrate; and an insulator layer for passivating the balun. Accordingly, the present invention can reduce an element size and simplify a manufacturing process.

摘要翻译： 提供一种其中安装有平衡 - 不平衡转换器的平衡滤波器封装芯片及其制造方法。 平衡滤波器封装芯片包括器件基板; 安装在装置基板上的平衡过滤器; 层叠在所述器件基板的特定区域上的接合层; 封装基板，其具有形成在所述平衡滤波器上方的空腔，并且通过所述接合层与所述器件基板结合; 位于包装衬底上的某个区域上的平衡 - 不平衡转换器; 以及用于钝化平衡 - 不平衡变换器的绝缘体层。 因此，本发明可以减小元件尺寸并简化制造工艺。

公开(公告)号：US20070023882A1

公开(公告)日：2007-02-01

申请号：US11435986

申请日：2006-05-18

申请人： Kuang-woo Nam ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

发明人： Kuang-woo Nam ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

IPC分类号： H01L21/00

CPC分类号： H03H9/0547

摘要： A balance filter packaging chip having a balun mounted therein and a manufacturing method thereof are provided. The balance filter packaging chip includes a device substrate; a balance filter mounted on the device substrate; a bonding layer stacked on a certain area of the device substrate; a packaging substrate having a cavity formed over the balance filter, and combined with the device substrate by the bonding layer; a balun located on a certain area over the packaging substrate; and an insulator layer for passivating the balun. Accordingly, the present invention can reduce an element size and simplify a manufacturing process.

摘要翻译： 提供一种其中安装有平衡 - 不平衡转换器的平衡滤波器封装芯片及其制造方法。 平衡滤波器封装芯片包括器件基板; 安装在装置基板上的平衡过滤器; 层叠在所述器件基板的特定区域上的接合层; 封装基板，其具有形成在所述平衡滤波器上方的空腔，并且通过所述接合层与所述器件基板结合; 位于包装衬底上的某个区域上的平衡 - 不平衡转换器; 以及用于钝化平衡 - 不平衡变换器的绝缘体层。 因此，本发明可以减小元件尺寸并简化制造工艺。

公开(公告)号：US07535319B2

公开(公告)日：2009-05-19

申请号：US11637768

申请日：2006-12-13

申请人： Yun-kwon Park ,  In-sang Song ,  Seok-chul Yun ,  Kuang-woo Nam

发明人： Yun-kwon Park ,  In-sang Song ,  Seok-chul Yun ,  Kuang-woo Nam

IPC分类号： H03H9/70 ,  H03H9/54

CPC分类号： H03H9/706

摘要： A band pass filter for improving filtering, realizing high integration, and reducing manufacturing costs, and a duplexer having the band pass filter. The band pass filter comprises a first resonant circuit in which n first resonators are connected in series, where n is a natural number greater than 1; a second resonator circuit which faces the first resonant circuit and has m second resonators connected in series, where m is a natural number greater than 1; and a third resonant circuit in which k third resonators are connected in parallel on branching lines linking the first and second resonant circuits, where k is a natural number greater than 1. By arranging the resonators of the respective resonant circuits in the bridge structure, the filtering characteristics can be improved, the number of inductors used to adjust the resonant frequency characteristics of the resonators can be reduced, high integration can be realized and manufacture cost can be reduced.

摘要翻译： 用于改进滤波，实现高集成度和降低制造成本的带通滤波器，以及具有带通滤波器的双工器。 带通滤波器包括第一谐振电路，其中n个第一谐振器串联连接，其中n是大于1的自然数; 面向第一谐振电路并具有串联连接的m个第二谐振器的第二谐振器电路，其中m是大于1的自然数; 以及第三谐振电路，其中k个第三谐振器并联在连接第一和第二谐振电路的分支线上，其中k是大于1的自然数。通过将各个谐振电路的谐振器布置在桥结构中， 可以提高滤波特性，可以减少用于调节谐振器的谐振频率特性的电感器的数量，可以实现高集成度并且可以降低制造成本。

公开(公告)号：US07471167B2

公开(公告)日：2008-12-30

申请号：US11638507

申请日：2006-12-14

申请人： Chul-soo Kim ,  Dal Ahn ,  Kwi-soo Kim ,  In-sang Song ,  Yun-kwon Park ,  Seok-chul Yun ,  Kuang-woo Nam

发明人： Chul-soo Kim ,  Dal Ahn ,  Kwi-soo Kim ,  In-sang Song ,  Yun-kwon Park ,  Seok-chul Yun ,  Kuang-woo Nam

IPC分类号： H01P5/10 ,  H03H7/42 ,  H01P3/08

CPC分类号： H01P5/10

摘要： A balun capable of a reduced whole size. The balun includes an input line receiving an unbalanced signal, an output line receiving the unbalanced signal from the input line and outputting a balanced signal, and a ground part. The input and output lines are formed on a layer, and the ground part is formed on a different layer from the layer. The ground part includes an opening and is electrically connected to the input line, and a portion of the ground part is removed to form the opening so that a potential difference occurs between first and second output lines. Thus, although a length of the output line is less than ¼ of an input wavelength λ, a difference between phases of first and second output signals can be about 180°. As a result, the whole size of the balun can be reduced.

摘要翻译： 平衡 - 不平衡转换器能够减小整体尺寸。 平衡 - 不平衡转换器包括接收不平衡信号的输入线，输入线接收来自输入线的不平衡信号并输出​​平衡信号的输出线和接地部分。 输入和输出线形成在层上，并且接地部分形成在与该层不同的层上。 接地部分包括开口并且电连接到输入线，并且去除接地部分的一部分以形成开口，使得在第一和第二输出线之间产生电位差。 因此，尽管输出线的长度小于输入波长λ的1/4，但是第一和第二输出信号的相位差可以是大约180°。 结果，平衡不平衡变换器的整体尺寸可以减小。

公开(公告)号：US07341888B2

公开(公告)日：2008-03-11

申请号：US11435986

申请日：2006-05-18

申请人： Kuang-woo Nam ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

发明人： Kuang-woo Nam ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

IPC分类号： H01L23/02

CPC分类号： H03H9/0547

摘要： A balance filter packaging chip having a balun mounted therein and a manufacturing method thereof are provided. The balance filter packaging chip includes a device substrate; a balance filter mounted on the device substrate; a bonding layer stacked on a certain area of the device substrate; a packaging substrate having a cavity formed over the balance filter, and combined with the device substrate by the bonding layer; a balun located on a certain area over the packaging substrate; and an insulator layer for passivating the balun. Accordingly, the present invention can reduce an element size and simplify a manufacturing process.

摘要翻译： 提供一种其中安装有平衡 - 不平衡转换器的平衡滤波器封装芯片及其制造方法。 平衡滤波器封装芯片包括器件基板; 安装在装置基板上的平衡过滤器; 层叠在所述器件基板的特定区域上的接合层; 封装基板，其具有形成在所述平衡滤波器上方的空腔，并且通过所述接合层与所述器件基板结合; 位于包装衬底上的某个区域上的平衡 - 不平衡转换器; 以及用于钝化平衡 - 不平衡变换器的绝缘体层。 因此，本发明可以减小元件尺寸并简化制造工艺。

公开(公告)号：US20070194860A1

公开(公告)日：2007-08-23

申请号：US11638507

申请日：2006-12-14

申请人： Chul-soo Kim ,  Dal Ahn ,  Kwi-soo Kim ,  In-sang Song ,  Yun-kwon Park ,  Seok-chul Yun ,  Kuang-woo Nam

发明人： Chul-soo Kim ,  Dal Ahn ,  Kwi-soo Kim ,  In-sang Song ,  Yun-kwon Park ,  Seok-chul Yun ,  Kuang-woo Nam

IPC分类号： H03H5/00

CPC分类号： H01P5/10

摘要： A balun capable of a reduced whole size. The balun includes an input line receiving an unbalanced signal, an output line receiving the unbalanced signal from the input line and outputting a balanced signal, and a ground part. The input and output lines are formed on a layer, and the ground part is formed on a different layer from the layer. The ground part includes an opening and is electrically connected to the input line, and a portion of the ground part is removed to form the opening so that a potential difference occurs between first and second output lines. Thus, although a length of the output line is less than ¼ of an input wavelength λ, a difference between phases of first and second output signals can be about 180°. As a result, the whole size of the balun can be reduced.

摘要翻译： 平衡 - 不平衡转换器能够减小整体尺寸。 平衡 - 不平衡转换器包括接收不平衡信号的输入线，输入线接收来自输入线的不平衡信号并输出​​平衡信号的输出线和接地部分。 输入和输出线形成在层上，并且接地部分形成在与该层不同的层上。 接地部分包括开口并且电连接到输入线，并且去除接地部分的一部分以形成开口，使得在第一和第二输出线之间产生电位差。 因此，尽管输出线的长度小于输入波长λ的1/4，但是第一和第二输出信号的相位差可以是大约180°。 结果，平衡不平衡变换器的整体尺寸可以减小。

公开(公告)号：US20070182508A1

公开(公告)日：2007-08-09

申请号：US11637768

申请日：2006-12-13

申请人： Yun-kwon Park ,  In-sang Song ,  Seok-chul Yun ,  Kuang-woo Nam

发明人： Yun-kwon Park ,  In-sang Song ,  Seok-chul Yun ,  Kuang-woo Nam

IPC分类号： H03H9/70

CPC分类号： H03H9/706

摘要： A band pass filter for improving filtering, realizing high integration, and reducing manufacturing costs, and a duplexer having the band pass filter. The band pass filter comprises a first resonant circuit in which n first resonators are connected in series, where n is a natural number greater than 1; a second resonator circuit which faces the first resonant circuit and has m second resonators connected in series, where m is a natural number greater than 1; and a third resonant circuit in which k third resonators are connected in parallel on branching lines linking the first and second resonant circuits, where k is a natural number greater than 1. By arranging the resonators of the respective resonant circuits in the bridge structure, the filtering characteristics can be improved, the number of inductors used to adjust the resonant frequency characteristics of the resonators can be reduced, high integration can be realized and manufacture cost can be reduced.

摘要翻译： 用于改进滤波，实现高集成度和降低制造成本的带通滤波器，以及具有带通滤波器的双工器。 带通滤波器包括第一谐振电路，其中n个第一谐振器串联连接，其中n是大于1的自然数; 面向第一谐振电路并具有串联连接的m个第二谐振器的第二谐振器电路，其中m是大于1的自然数; 以及第三谐振电路，其中k个第三谐振器并联在连接第一和第二谐振电路的分支线上，其中k是大于1的自然数。通过将各个谐振电路的谐振器布置在桥结构中， 可以提高滤波特性，可以减少用于调节谐振器的谐振频率特性的电感器的数量，可以实现高集成度并且可以降低制造成本。

公开(公告)号：US20060109065A1

公开(公告)日：2006-05-25

申请号：US11262889

申请日：2005-11-01

申请人： Yun-kwon Park ,  In-sang Song ,  Seok-chul Yun ,  Seog-woo Hong ,  Byeoung-ju Ha ,  Dong-ha Shim ,  Hae-seok Park ,  Kuang-woo Nam ,  Duck-hwan Kim

发明人： Yun-kwon Park ,  In-sang Song ,  Seok-chul Yun ,  Seog-woo Hong ,  Byeoung-ju Ha ,  Dong-ha Shim ,  Hae-seok Park ,  Kuang-woo Nam ,  Duck-hwan Kim

IPC分类号： H03H9/70

CPC分类号： H03H3/02 ,  H03H9/0571 ,  H03H9/706 ,  Y10T29/42 ,  Y10T29/43 ,  Y10T29/4902 ,  Y10T29/49155

摘要： A subminiature, high-performance monolithic duplexer is disclosed. The monolithic duplexer includes a substrate, a transmitting-end filter formed in a first area on an upper surface of the substrate, a receiving-end filter formed in a second area on the upper surface of the substrate, a packaging substrate, bonded on an area on the upper surface of the substrate, for packaging the transmitting-end filter and the receiving-end filter in a sealed state, and a phase shifter, formed on one surface of the packaging substrate and connected to the transmitting-end filter and the receiving-end filter, respectively, for intercepting a signal inflow between the transmitting-end filter and the receiving-end filter.

摘要翻译： 公开了一种超小型高性能单片双工器。 单片双工器包括基板，形成在基板的上表面上的第一区域中的透射端滤光器，形成在基板的上表面上的第二区域中的接收端滤光器，粘合在基板上的封装基板 在封装状态下将发送端滤波器和接收端滤波器封装在基板的上表面上的区域，以及形成在封装基板的一个表面上并与发送端滤波器连接的移相器 接收端滤波器分别用于截取发送端滤波器与接收端滤波器之间的信号流入。

公开(公告)号：US07250831B2

公开(公告)日：2007-07-31

申请号：US11130156

申请日：2005-05-17

申请人： In-sang Song ,  Byeoung-ju Ha ,  Yun-kwon Park ,  Jong-seok Kim ,  Duck-hwan Kim ,  Kuang-woo Nam ,  Hae-seok Park ,  Seog-woo Hong

发明人： In-sang Song ,  Byeoung-ju Ha ,  Yun-kwon Park ,  Jong-seok Kim ,  Duck-hwan Kim ,  Kuang-woo Nam ,  Hae-seok Park ,  Seog-woo Hong

IPC分类号： H03H9/70 ,  H03H9/54

CPC分类号： H03H9/564 ,  H03H3/02 ,  H03H9/0542 ,  H03H9/0571 ,  H03H9/173 ,  H03H9/568 ,  H03H9/605 ,  H03H9/706 ,  Y10T29/42

摘要： A filter using an air gap type film bulk acoustic resonator is provided. The present filter includes a substrate on which a first port, a second port, and a ground port are formed to be connected to an external terminal; at least one first film bulk acoustic resonator serially connecting the first port to the second port on the substrate; at least one second film bulk acoustic resonator parallel connected to an interconnection node formed between the first port and the second port; and at least one inductor serially connecting the second film bulk acoustic resonator to the ground port. The inductor included in the filter is fabricated with the first and second film bulk acoustic resonators as one body. Accordingly, a small-sized filter may be fabricated through a simplified process.

摘要翻译： 提供了使用气隙型膜体声波谐振器的滤波器。 本发明的滤光器包括：基板，其上形成有第一端口，第二端口和接地端口，以连接到外部端子; 将所述第一端口与所述基板上的所述第二端口串联连接的至少一个第一膜体声波谐振器; 至少一个第二膜体声波谐振器并联连接到形成在第一端口和第二端口之间的互连节点; 以及将第二膜体声波谐振器串联连接到接地端口的至少一个电感器。 包括在滤波器中的电感器由第一和第二膜体声波谐振器制成为一体。 因此，可以通过简化的过程制造小尺寸的过滤器。

公开(公告)号：US20050253668A1

公开(公告)日：2005-11-17

申请号：US11130156

申请日：2005-05-17

申请人： In-sang Song ,  Byeoung-ju Ha ,  Yun-kwon Park ,  Jong-seok Kim ,  Duck-hwan Kim ,  Kuang-woo Nam ,  Hae-seok Park ,  Seog-woo Hong

发明人： In-sang Song ,  Byeoung-ju Ha ,  Yun-kwon Park ,  Jong-seok Kim ,  Duck-hwan Kim ,  Kuang-woo Nam ,  Hae-seok Park ,  Seog-woo Hong

IPC分类号： H01L41/09 ,  H01L41/187 ,  H01L41/22 ,  H01L41/311 ,  H03H3/02 ,  H03H9/05 ,  H03H9/17 ,  H03H9/54 ,  H03H9/56 ,  H03H9/58 ,  H03H9/60 ,  H03H9/70

CPC分类号： H03H9/564 ,  H03H3/02 ,  H03H9/0542 ,  H03H9/0571 ,  H03H9/173 ,  H03H9/568 ,  H03H9/605 ,  H03H9/706 ,  Y10T29/42

摘要： A filter using an air gap type film bulk acoustic resonator is provided. The present filter includes a substrate on which a first port, a second port, and a ground port are formed to be connected to an external terminal; at least one first film bulk acoustic resonator serially connecting the first port to the second port on the substrate; at least one second film bulk acoustic resonator parallel connected to an interconnection node formed between the first port and the second port; and at least one inductor serially connecting the second film bulk acoustic resonator to the ground port. The inductor included in the filter is fabricated with the first and second film bulk acoustic resonators as one body. Accordingly, a small-sized filter may be fabricated through a simplified process.

摘要翻译： 提供了使用气隙型膜体声波谐振器的滤波器。 本发明的滤光器包括：基板，其上形成有第一端口，第二端口和接地端口，以连接到外部端子; 将所述第一端口与所述基板上的所述第二端口串联连接的至少一个第一膜体声波谐振器; 至少一个第二膜体声波谐振器并联连接到形成在第一端口和第二端口之间的互连节点; 以及将第二膜体声波谐振器串联连接到接地端口的至少一个电感器。 包括在滤波器中的电感器由第一和第二膜体声波谐振器制成为一体。 因此，可以通过简化的过程制造小尺寸的过滤器。