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    Balance filter packaging chip having balun mounted therein and manufacturing method thereof
    1.
    发明授权
    Balance filter packaging chip having balun mounted therein and manufacturing method thereof 有权
    具有平衡 - 不平衡转换器的平衡过滤器包装芯片及其制造方法

    公开(公告)号：US08624369B2

    公开(公告)日：2014-01-07

    申请号：US11844084

    申请日：2007-08-23

    申请人： Kuang-woo Nam ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

    发明人： Kuang-woo Nam ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

    IPC分类号： H01L23/02

    CPC分类号： H03H9/0547

    摘要： A balance filter packaging chip having a balun mounted therein and a manufacturing method thereof are provided. The balance filter packaging chip includes a device substrate; a balance filter mounted on the device substrate; a bonding layer stacked on a certain area of the device substrate; a packaging substrate having a cavity formed over the balance filter, and combined with the device substrate by the bonding layer; a balun located on a certain area over the packaging substrate; and an insulator layer for passivating the balun. Accordingly, the present invention can reduce an element size and simplify a manufacturing process.

    摘要翻译： 提供一种其中安装有平衡 - 不平衡转换器的平衡滤波器封装芯片及其制造方法。 平衡滤波器封装芯片包括器件基板; 安装在装置基板上的平衡过滤器; 层叠在所述器件基板的特定区域上的接合层; 封装基板，其具有形成在所述平衡滤波器上方的空腔，并且通过所述接合层与所述器件基板结合; 位于包装衬底上的某个区域上的平衡 - 不平衡转换器; 以及用于钝化平衡 - 不平衡变换器的绝缘体层。 因此，本发明可以减小元件尺寸并简化制造工艺。

    BALANCE FILTER PACKAGING CHIP HAVING BALUN MOUNTED THEREIN AND MANUFACTURING METHOD THEREOF
    4.
    发明申请
    BALANCE FILTER PACKAGING CHIP HAVING BALUN MOUNTED THEREIN AND MANUFACTURING METHOD THEREOF 有权
    平衡过滤器包装板及其制造方法

    公开(公告)号：US20070285908A1

    公开(公告)日：2007-12-13

    申请号：US11844084

    申请日：2007-08-23

    申请人： Kuang-woo NAM ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

    发明人： Kuang-woo NAM ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

    IPC分类号： H05K7/00

    CPC分类号： H03H9/0547

    摘要： A balance filter packaging chip having a balun mounted therein and a manufacturing method thereof are provided. The balance filter packaging chip includes a device substrate; a balance filter mounted on the device substrate; a bonding layer stacked on a certain area of the device substrate; a packaging substrate having a cavity formed over the balance filter, and combined with the device substrate by the bonding layer; a balun located on a certain area over the packaging substrate; and an insulator layer for passivating the balun. Accordingly, the present invention can reduce an element size and simplify a manufacturing process.

    摘要翻译： 提供一种其中安装有平衡 - 不平衡转换器的平衡滤波器封装芯片及其制造方法。 平衡滤波器封装芯片包括器件基板; 安装在装置基板上的平衡过滤器; 层叠在所述器件基板的特定区域上的接合层; 封装基板，其具有形成在所述平衡滤波器上方的空腔，并且通过所述接合层与所述器件基板结合; 位于包装衬底上的某个区域上的平衡 - 不平衡转换器; 以及用于钝化平衡 - 不平衡变换器的绝缘体层。 因此，本发明可以减小元件尺寸并简化制造工艺。

    Balance filter packaging chip having balun mounted therein and manufacturing method thereof
    5.
    发明申请
    Balance filter packaging chip having balun mounted therein and manufacturing method thereof 有权
    具有平衡 - 不平衡转换器的平衡过滤器包装芯片及其制造方法

    公开(公告)号：US20070023882A1

    公开(公告)日：2007-02-01

    申请号：US11435986

    申请日：2006-05-18

    申请人： Kuang-woo Nam ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

    发明人： Kuang-woo Nam ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

    IPC分类号： H01L21/00

    CPC分类号： H03H9/0547

    摘要： A balance filter packaging chip having a balun mounted therein and a manufacturing method thereof are provided. The balance filter packaging chip includes a device substrate; a balance filter mounted on the device substrate; a bonding layer stacked on a certain area of the device substrate; a packaging substrate having a cavity formed over the balance filter, and combined with the device substrate by the bonding layer; a balun located on a certain area over the packaging substrate; and an insulator layer for passivating the balun. Accordingly, the present invention can reduce an element size and simplify a manufacturing process.

    摘要翻译： 提供一种其中安装有平衡 - 不平衡转换器的平衡滤波器封装芯片及其制造方法。 平衡滤波器封装芯片包括器件基板; 安装在装置基板上的平衡过滤器; 层叠在所述器件基板的特定区域上的接合层; 封装基板，其具有形成在所述平衡滤波器上方的空腔，并且通过所述接合层与所述器件基板结合; 位于包装衬底上的某个区域上的平衡 - 不平衡转换器; 以及用于钝化平衡 - 不平衡变换器的绝缘体层。 因此，本发明可以减小元件尺寸并简化制造工艺。

    Balance filter packaging chip having balun mounted therein and manufacturing method thereof
    6.
    发明授权
    Balance filter packaging chip having balun mounted therein and manufacturing method thereof 有权
    具有平衡 - 不平衡转换器的平衡过滤器包装芯片及其制造方法

    公开(公告)号：US07341888B2

    公开(公告)日：2008-03-11

    申请号：US11435986

    申请日：2006-05-18

    申请人： Kuang-woo Nam ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

    发明人： Kuang-woo Nam ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

    IPC分类号： H01L23/02

    CPC分类号： H03H9/0547

    摘要： A balance filter packaging chip having a balun mounted therein and a manufacturing method thereof are provided. The balance filter packaging chip includes a device substrate; a balance filter mounted on the device substrate; a bonding layer stacked on a certain area of the device substrate; a packaging substrate having a cavity formed over the balance filter, and combined with the device substrate by the bonding layer; a balun located on a certain area over the packaging substrate; and an insulator layer for passivating the balun. Accordingly, the present invention can reduce an element size and simplify a manufacturing process.

    摘要翻译： 提供一种其中安装有平衡 - 不平衡转换器的平衡滤波器封装芯片及其制造方法。 平衡滤波器封装芯片包括器件基板; 安装在装置基板上的平衡过滤器; 层叠在所述器件基板的特定区域上的接合层; 封装基板，其具有形成在所述平衡滤波器上方的空腔，并且通过所述接合层与所述器件基板结合; 位于包装衬底上的某个区域上的平衡 - 不平衡转换器; 以及用于钝化平衡 - 不平衡变换器的绝缘体层。 因此，本发明可以减小元件尺寸并简化制造工艺。

    Packaging chip having inductor therein
    7.
    发明授权
    Packaging chip having inductor therein 失效
    具有电感器的封装芯片

    公开(公告)号：US07541662B2

    公开(公告)日：2009-06-02

    申请号：US11435985

    申请日：2006-05-18

    申请人： Dong-ha Sim ,  In-sang Song ,  Duck-hwan Kim ,  Yun-kwon Park ,  Seok-chul Yun ,  Kuang-woo Nam

    发明人： Dong-ha Sim ,  In-sang Song ,  Duck-hwan Kim ,  Yun-kwon Park ,  Seok-chul Yun ,  Kuang-woo Nam

    IPC分类号： H01L29/00 ,  H01L23/12

    CPC分类号： H01L23/10 ,  H01F17/0006 ,  H01F27/027 ,  H01L23/49838 ,  H01L23/645 ,  H01L2924/16152

    摘要： A packaging chip having inductors therein is provided. The packaging chip includes a substrate for mounting a circuit element therein, at least one port formed on a surface of the substrate, a sealing portion electrically connected on the substrate to the circuit element and the at least one port, respectively, and a packaging substrate bonded to the substrate through the sealing portion and packaging the circuit element. In this case, the sealing portion has a certain magnitude of inductance since it is formed of a conductive material, thereby serving as an inductor. Accordingly, the packaging chip having an inductor therein can be implemented in a small size.

    摘要翻译： 提供其中具有电感器的封装芯片。 封装芯片包括用于在其中安装电路元件的基板，形成在基板的表面上的至少一个端口，分别电连接到基板上的电路元件和至少一个端口的密封部分和封装基板 通过密封部分粘合到基板上并封装电路元件。 在这种情况下，密封部分具有一定的电感量，因为其由导电材料形成，从而用作电感器。 因此，其中具有电感器的封装芯片可以实现为小尺寸。

    MEMS device package and method for manufacturing the same
    8.
    发明申请
    MEMS device package and method for manufacturing the same 有权
    MEMS器件封装及其制造方法

    公开(公告)号：US20060141650A1

    公开(公告)日：2006-06-29

    申请号：US11270482

    申请日：2005-11-10

    申请人： Jong-seok Kim ,  Yun-kwon Park ,  Kuang-woo Nam ,  Seok-chul Yun ,  In-sang Song

    发明人： Jong-seok Kim ,  Yun-kwon Park ,  Kuang-woo Nam ,  Seok-chul Yun ,  In-sang Song

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00269

    摘要： A micro electromechanical system (MEMS) device package and a method of manufacturing the same are provided. The inventive MEMS device package includes: a device substrate with a MEMS active device being formed on the top surface thereof; internal electrode pads, each of which is positioned on the opposite side of the MEMS active device to provide a space where the MEMS active device is positioned and an electrical path for the MEMS active device, each of the internal electrode pads, and comprises first and second pads arranged opposite to one another with a clearance therebetween; sealing pads positioned outside of the internal electrode pads; a closure substrate joined to the device substrate through the sealing pads, the closure substrate having via holes formed at the areas where the internal electrode pads are positioned; connection members each formed on the inner surfaces of the via holes to be in contact with the internal electrode pads at one ends thereof; and external electrode pads formed on the top surface of the closure substrate in such a way that the external electrode pads are in contact with the other ends of the connection members.

    摘要翻译： 提供了微机电系统（MEMS）装置封装及其制造方法。 本发明的MEMS器件封装包括：在其顶表面上形成有MEMS有源器件的器件衬底; 内部电极焊盘，每个内部电极焊盘位于MEMS有源器件的相对侧，以提供MEMS有源器件所在的空间，以及用于MEMS有源器件的电气路径，每个内部电极焊盘，并且包括第一和 第二垫彼此相对布置，其间具有间隙; 位于内部电极焊盘外部的密封垫; 通过所述密封垫连接到所述装置基板的封闭基板，所述封闭基板具有形成在所述内部电极焊盘定位的区域处的通孔; 每个所述连接部件形成在所述通孔的内表面上，以在其一端与所述内部电极焊盘接触; 以及形成在封闭基板的​​顶表面上的外部电极焊盘，使得外部电极焊盘与连接构件的另一端接触。

    Monolithic duplexer
    9.
    发明授权
    Monolithic duplexer 有权
    单片双工器

    公开(公告)号：US07663450B2

    公开(公告)日：2010-02-16

    申请号：US11262889

    申请日：2005-11-01

    申请人： Yun-kwon Park ,  In-sang Song ,  Seok-chul Yun ,  Seog-woo Hong ,  Byeoung-ju Ha ,  Dong-ha Shim ,  Hae-seok Park ,  Kuang-woo Nam ,  Duck-hwan Kim

    发明人： Yun-kwon Park ,  In-sang Song ,  Seok-chul Yun ,  Seog-woo Hong ,  Byeoung-ju Ha ,  Dong-ha Shim ,  Hae-seok Park ,  Kuang-woo Nam ,  Duck-hwan Kim

    IPC分类号： H03H9/70

    CPC分类号： H03H3/02 ,  H03H9/0571 ,  H03H9/706 ,  Y10T29/42 ,  Y10T29/43 ,  Y10T29/4902 ,  Y10T29/49155

    摘要： A subminiature, high-performance monolithic duplexer is disclosed. The monolithic duplexer includes a substrate, a transmitting-end filter formed in a first area on an upper surface of the substrate, a receiving-end filter formed in a second area on the upper surface of the substrate, a packaging substrate, bonded on an area on the upper surface of the substrate, for packaging the transmitting-end filter and the receiving-end filter in a sealed state, and a phase shifter, formed on one surface of the packaging substrate and connected to the transmitting-end filter and the receiving-end filter, respectively, for intercepting a signal inflow between the transmitting-end filter and the receiving-end filter.

    摘要翻译： 公开了一种超小型高性能单片双工器。 单片双工器包括基板，形成在基板的上表面上的第一区域中的透射端滤光器，形成在基板的上表面上的第二区域中的接收端滤光器，粘合在基板上的封装基板 在封装状态下将发送端滤波器和接收端滤波器封装在基板的上表面上的区域，以及形成在封装基板的一个表面上并与发送端滤波器连接的移相器 接收端滤波器分别用于截取发送端滤波器与接收端滤波器之间的信号流入。

    Monolithic RF filter
    10.
    发明授权
    Monolithic RF filter 有权
    单片RF滤波器

    公开(公告)号：US07535322B2

    公开(公告)日：2009-05-19

    申请号：US11269844

    申请日：2005-11-09

    申请人： Yun-kwon Park ,  Duck-hwan Kim ,  Kuang-woo Nam ,  In-sang Song ,  Seok-chul Yun ,  Byeoung-ju Ha ,  Jong-seok Kim

    发明人： Yun-kwon Park ,  Duck-hwan Kim ,  Kuang-woo Nam ,  In-sang Song ,  Seok-chul Yun ,  Byeoung-ju Ha ,  Jong-seok Kim

    IPC分类号： H03H9/54 ,  H03H9/56

    CPC分类号： H03H9/0542 ,  H03H9/542 ,  H03H9/564 ,  H03H9/566

    摘要： A filter formed of film bulk acoustic resonators has a topology that enables a trimming inductor to be fabricated on the same substrate as the resonator arrays. The entire filter can be fabricated on a single chip, utilizing only integrated circuit processes. In an exemplary embodiment, a pair of shunt resonators each have one electrode connected to series-connected resonators. The other electrodes of the two shunt resonators are connected in common to one another. The trimming inductor is connected between the common electrode and ground potential. A third shunt resonator is connected between the series-connected resonators and ground potential.

    摘要翻译： 由膜体声波谐振器形成的滤波器具有能够将调谐电感器制造在与谐振器阵列相同的衬底上的拓扑结构。 整个滤波器可以在单个芯片上制造，仅利用集成电路工艺。 在示例性实施例中，一对并联谐振器各自具有连接到串联谐振器的一个电极。 两个并联谐振器的其他电极彼此共同连接。 微调电感连接在公共电极和地电位之间。 第三并联谐振器连接在串联谐振器和地电位之间。