公开(公告)号：US08624369B2

公开(公告)日：2014-01-07

申请号：US11844084

申请日：2007-08-23

申请人： Kuang-woo Nam ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

发明人： Kuang-woo Nam ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

IPC分类号： H01L23/02

CPC分类号： H03H9/0547

摘要： A balance filter packaging chip having a balun mounted therein and a manufacturing method thereof are provided. The balance filter packaging chip includes a device substrate; a balance filter mounted on the device substrate; a bonding layer stacked on a certain area of the device substrate; a packaging substrate having a cavity formed over the balance filter, and combined with the device substrate by the bonding layer; a balun located on a certain area over the packaging substrate; and an insulator layer for passivating the balun. Accordingly, the present invention can reduce an element size and simplify a manufacturing process.

摘要翻译： 提供一种其中安装有平衡 - 不平衡转换器的平衡滤波器封装芯片及其制造方法。 平衡滤波器封装芯片包括器件基板; 安装在装置基板上的平衡过滤器; 层叠在所述器件基板的特定区域上的接合层; 封装基板，其具有形成在所述平衡滤波器上方的空腔，并且通过所述接合层与所述器件基板结合; 位于包装衬底上的某个区域上的平衡 - 不平衡转换器; 以及用于钝化平衡 - 不平衡变换器的绝缘体层。 因此，本发明可以减小元件尺寸并简化制造工艺。

公开(公告)号：US07341888B2

公开(公告)日：2008-03-11

申请号：US11435986

申请日：2006-05-18

申请人： Kuang-woo Nam ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

发明人： Kuang-woo Nam ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

IPC分类号： H01L23/02

CPC分类号： H03H9/0547

摘要： A balance filter packaging chip having a balun mounted therein and a manufacturing method thereof are provided. The balance filter packaging chip includes a device substrate; a balance filter mounted on the device substrate; a bonding layer stacked on a certain area of the device substrate; a packaging substrate having a cavity formed over the balance filter, and combined with the device substrate by the bonding layer; a balun located on a certain area over the packaging substrate; and an insulator layer for passivating the balun. Accordingly, the present invention can reduce an element size and simplify a manufacturing process.

摘要翻译： 提供一种其中安装有平衡 - 不平衡转换器的平衡滤波器封装芯片及其制造方法。 平衡滤波器封装芯片包括器件基板; 安装在装置基板上的平衡过滤器; 层叠在所述器件基板的特定区域上的接合层; 封装基板，其具有形成在所述平衡滤波器上方的空腔，并且通过所述接合层与所述器件基板结合; 位于包装衬底上的某个区域上的平衡 - 不平衡转换器; 以及用于钝化平衡 - 不平衡变换器的绝缘体层。 因此，本发明可以减小元件尺寸并简化制造工艺。

公开(公告)号：US20070024396A1

公开(公告)日：2007-02-01

申请号：US11448707

申请日：2006-06-08

申请人： Kuang-woo Nam ,  Kook-hyun Sunwoo ,  In-sang Song ,  Sang-wook Kwon ,  Duck-hwan Kim ,  Chul-soo Kim ,  Sang-chul Sul ,  Yun-kwon Park ,  Hae-seok Park ,  Jea-shik Shin ,  Dong-ha Shim ,  Young-tack Hong ,  Jong-seok Kim ,  Seok-mo Chang ,  Seok-Chul Yun

发明人： Kuang-woo Nam ,  Kook-hyun Sunwoo ,  In-sang Song ,  Sang-wook Kwon ,  Duck-hwan Kim ,  Chul-soo Kim ,  Sang-chul Sul ,  Yun-kwon Park ,  Hae-seok Park ,  Jea-shik Shin ,  Dong-ha Shim ,  Young-tack Hong ,  Jong-seok Kim ,  Seok-mo Chang ,  Seok-Chul Yun

IPC分类号： H03H9/56

CPC分类号： H03H9/588 ,  H03H3/02 ,  H03H9/02228 ,  H03H2003/0071

摘要： An integrated filter including a film bulk acoustic resonator (FBAR) and a surface acoustic wave (SAW) resonator and a method of fabricating the integrated filter. The integrated filter includes: a substrate; a first electrode positioned in a predetermined first area on an upper surface of the substrate; a first piezoelectric layer positioned on the first electrode; a second electrode positioned on the first piezoelectric layer; a second piezoelectric layer positioned in a predetermined second area on the upper surface of the substrate; and at least one inter-digital transducer (IDT) electrode positioned on the second piezoelectric layer. The IDT electrode includes: a first IDT electrode formed in a comb structure on the second piezoelectric layer; and a second IDT electrode formed in a comb structure on the second piezoelectric layer so as to mesh with the first IDT electrode. The first and second piezoelectric layers are formed of an identical material. Thus, an integrated filter which operates in various frequency bands can be made compact.

摘要翻译： 一种包括膜体声波谐振器（FBAR）和表面声波（SAW）谐振器的集成滤波器以及一体化滤波器的制造方法。 集成滤波器包括：基板; 位于所述基板的上表面上的预定第一区域中的第一电极; 位于所述第一电极上的第一压电层; 位于所述第一压电层上的第二电极; 位于所述基板的上表面上的预定的第二区域中的第二压电层; 和位于第二压电层上的至少一个数字间换能器（IDT）电极。 IDT电极包括：在第二压电层上形成为梳状结构的第一IDT电极; 以及在第二压电层上形成为梳状结构的第二IDT电极，以便与第一IDT电极啮合。 第一和第二压电层由相同的材料形成。 因此，可以使在各种频带中工作的集成滤波器紧凑。

公开(公告)号：US07439825B2

公开(公告)日：2008-10-21

申请号：US11448707

申请日：2006-06-08

申请人： Kuang-woo Nam ,  Kook-hyun Sunwoo ,  In-sang Song ,  Sang-wook Kwon ,  Duck-hwan Kim ,  Chul-soo Kim ,  Sang-chul Sul ,  Yun-kwon Park ,  Hae-seok Park ,  Jea-shik Shin ,  Dong-ha Shim ,  Young-tack Hong ,  Jong-seok Kim ,  Seok-mo Chang ,  Seok-chul Yun

发明人： Kuang-woo Nam ,  Kook-hyun Sunwoo ,  In-sang Song ,  Sang-wook Kwon ,  Duck-hwan Kim ,  Chul-soo Kim ,  Sang-chul Sul ,  Yun-kwon Park ,  Hae-seok Park ,  Jea-shik Shin ,  Dong-ha Shim ,  Young-tack Hong ,  Jong-seok Kim ,  Seok-mo Chang ,  Seok-chul Yun

IPC分类号： H03H9/56 ,  H03H9/54

CPC分类号： H03H9/588 ,  H03H3/02 ,  H03H9/02228 ,  H03H2003/0071

摘要： An integrated filter including a film bulk acoustic resonator (FBAR) and a surface acoustic wave (SAW) resonator and a method of fabricating the integrated filter. The integrated filter includes: a substrate; a first electrode positioned in a predetermined first area on an upper surface of the substrate; a first piezoelectric layer positioned on the first electrode; a second electrode positioned on the first piezoelectric layer; a second piezoelectric layer positioned in a predetermined second area on the upper surface of the substrate; and at least one inter-digital transducer (IDT) electrode positioned on the second piezoelectric layer. The IDT electrode includes: a first IDT electrode formed in a comb structure on the second piezoelectric layer; and a second IDT electrode formed in a comb structure on the second piezoelectric layer so as to mesh with the first IDT electrode. The first and second piezoelectric layers are formed of an identical material. Thus, an integrated filter which operates in various frequency bands can be made compact.

摘要翻译： 一种包括膜体声波谐振器（FBAR）和表面声波（SAW）谐振器的集成滤波器以及一体化滤波器的制造方法。 集成滤波器包括：基板; 位于所述基板的上表面上的预定第一区域中的第一电极; 位于所述第一电极上的第一压电层; 位于所述第一压电层上的第二电极; 位于所述基板的上表面上的预定的第二区域中的第二压电层; 和位于第二压电层上的至少一个数字间换能器（IDT）电极。 IDT电极包括：在第二压电层上形成为梳状结构的第一IDT电极; 以及在第二压电层上形成为梳状结构的第二IDT电极，以便与第一IDT电极啮合。 第一和第二压电层由相同的材料形成。 因此，可以使在各种频带中工作的集成滤波器紧凑。

公开(公告)号：US20070285908A1

公开(公告)日：2007-12-13

申请号：US11844084

申请日：2007-08-23

申请人： Kuang-woo NAM ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

发明人： Kuang-woo NAM ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

IPC分类号： H05K7/00

CPC分类号： H03H9/0547

摘要： A balance filter packaging chip having a balun mounted therein and a manufacturing method thereof are provided. The balance filter packaging chip includes a device substrate; a balance filter mounted on the device substrate; a bonding layer stacked on a certain area of the device substrate; a packaging substrate having a cavity formed over the balance filter, and combined with the device substrate by the bonding layer; a balun located on a certain area over the packaging substrate; and an insulator layer for passivating the balun. Accordingly, the present invention can reduce an element size and simplify a manufacturing process.

摘要翻译： 提供一种其中安装有平衡 - 不平衡转换器的平衡滤波器封装芯片及其制造方法。 平衡滤波器封装芯片包括器件基板; 安装在装置基板上的平衡过滤器; 层叠在所述器件基板的特定区域上的接合层; 封装基板，其具有形成在所述平衡滤波器上方的空腔，并且通过所述接合层与所述器件基板结合; 位于包装衬底上的某个区域上的平衡 - 不平衡转换器; 以及用于钝化平衡 - 不平衡变换器的绝缘体层。 因此，本发明可以减小元件尺寸并简化制造工艺。

公开(公告)号：US20070023882A1

公开(公告)日：2007-02-01

申请号：US11435986

申请日：2006-05-18

申请人： Kuang-woo Nam ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

发明人： Kuang-woo Nam ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

IPC分类号： H01L21/00

CPC分类号： H03H9/0547

摘要： A balance filter packaging chip having a balun mounted therein and a manufacturing method thereof are provided. The balance filter packaging chip includes a device substrate; a balance filter mounted on the device substrate; a bonding layer stacked on a certain area of the device substrate; a packaging substrate having a cavity formed over the balance filter, and combined with the device substrate by the bonding layer; a balun located on a certain area over the packaging substrate; and an insulator layer for passivating the balun. Accordingly, the present invention can reduce an element size and simplify a manufacturing process.

摘要翻译： 提供一种其中安装有平衡 - 不平衡转换器的平衡滤波器封装芯片及其制造方法。 平衡滤波器封装芯片包括器件基板; 安装在装置基板上的平衡过滤器; 层叠在所述器件基板的特定区域上的接合层; 封装基板，其具有形成在所述平衡滤波器上方的空腔，并且通过所述接合层与所述器件基板结合; 位于包装衬底上的某个区域上的平衡 - 不平衡转换器; 以及用于钝化平衡 - 不平衡变换器的绝缘体层。 因此，本发明可以减小元件尺寸并简化制造工艺。

公开(公告)号：US07501911B2

公开(公告)日：2009-03-10

申请号：US11417242

申请日：2006-05-04

申请人： Young-tack Hong ,  Seok-chul Yun ,  Seok-mo Chang ,  Sang-wook Kwon ,  Che-heung Kim ,  Jong-seok Kim ,  Hee-moon Jeong ,  Sang-hun Lee ,  Jun-o Kim ,  In-sang Song

发明人： Young-tack Hong ,  Seok-chul Yun ,  Seok-mo Chang ,  Sang-wook Kwon ,  Che-heung Kim ,  Jong-seok Kim ,  Hee-moon Jeong ,  Sang-hun Lee ,  Jun-o Kim ,  In-sang Song

IPC分类号： H01P1/15

CPC分类号： H01H59/0009

摘要： A vertical comb actuator radio frequency (RF) micro-electro-mechanical system (MEMS) switch. The RF MEMS switch includes a substrate; first and second signal lines spaced at a predetermined interval from each other and deposited on an upper surface of the substrate; an actuator positioned over the first and second signal lines when viewed from the upper surface of the substrate and spaced at a predetermined interval from the first and second signal lines; and a fixing portion positioned over the actuator when viewed from the upper surface of the substrate, wherein the fixing portion permits the actuator to come in contact with the first and second signal lines when a predetermined driving voltage is applied. Thus, it is possible to prevent the actuator from sticking to the substrate. In addition, the RF MEMS switch can be operated with a low voltage and insertion loss and power loss can be reduced.

摘要翻译： 立式梳子致动器射频（RF）微机电系统（MEMS）开关。 RF MEMS开关包括基板; 第一和第二信号线以预定间隔彼此间隔开并沉积在基板的上表面上; 当从所述基板的上表面观察并且以与所述第一信号线和所述第二信号线预定的间隔隔开时，致动器定位在所述第一和第二信号线上方; 以及当从基板的上表面观察时定位在致动器上方的固定部分，其中当施加预定的驱动电压时，固定部分允许致动器与第一和第二信号线接触。 因此，可以防止致动器粘附到基板。 此外，RF MEMS开关可以在低电压和插入损耗下工作，并且可以降低功率损耗。

公开(公告)号：US20070024390A1

公开(公告)日：2007-02-01

申请号：US11417242

申请日：2006-05-04

申请人： Young-tack Hong ,  Seok-chul Yun ,  Seok-mo Chang ,  Sang-wook Kwon ,  Che-heung Kim ,  Jong-seok Kim ,  Hee-moon Jeong ,  Sang-hun Lee ,  Jun-o Kim ,  In-sang Song

发明人： Young-tack Hong ,  Seok-chul Yun ,  Seok-mo Chang ,  Sang-wook Kwon ,  Che-heung Kim ,  Jong-seok Kim ,  Hee-moon Jeong ,  Sang-hun Lee ,  Jun-o Kim ,  In-sang Song

IPC分类号： H01P1/10

CPC分类号： H01H59/0009

摘要： A vertical comb actuator radio frequency (RF) micro-electro-mechanical system (MEMS) switch. The RF MEMS switch includes a substrate; first and second signal lines spaced at a predetermined interval from each other and deposited on an upper surface of the substrate; an actuator positioned over the first and second signal lines when viewed from the upper surface of the substrate and spaced at a predetermined interval from the first and second signal lines; and a fixing portion positioned over the actuator when viewed from the upper surface of the substrate, wherein the fixing portion permits the actuator to come in contact with the first and second signal lines when a predetermined driving voltage is applied. Thus, it is possible to prevent the actuator from sticking to the substrate. In addition, the RF MEMS switch can be operated with a low voltage and insertion loss and power loss can be reduced.

摘要翻译： 立式梳子致动器射频（RF）微机电系统（MEMS）开关。 RF MEMS开关包括基板; 第一和第二信号线以预定间隔彼此间隔开并沉积在基板的上表面上; 当从所述基板的上表面观察并且以与所述第一信号线和所述第二信号线预定的间隔隔开时，所述致动器位于所述第一和第二信号线上方; 以及当从基板的上表面观察时定位在致动器上方的固定部分，其中当施加预定的驱动电压时，固定部分允许致动器与第一和第二信号线接触。 因此，可以防止致动器粘附到基板。 此外，RF MEMS开关可以在低电压和插入损耗下工作，并且可以降低功率损耗。

公开(公告)号：US07977207B2

公开(公告)日：2011-07-12

申请号：US12856308

申请日：2010-08-13

申请人： Hee-moon Jeong ,  Jin-woo Cho ,  Yong-hwa Park ,  Jun-o Kim ,  Seok-mo Chang

发明人： Hee-moon Jeong ,  Jin-woo Cho ,  Yong-hwa Park ,  Jun-o Kim ,  Seok-mo Chang

IPC分类号： H02N1/00

CPC分类号： B81B3/0051 ,  B81B2201/042 ,  B81B2203/058 ,  G02B26/085 ,  G02B26/101 ,  G02B26/105

摘要： A microelectromechanical systems (MEMS) device includes a frame, an actuator formed on the same layer as the frame and connected to the frame to be capable of performing a relative motion with respect to the frame, and at least one stopper restricting a displacement of the actuator in a direction along the height of the actuator. The MEMS device is fabricated by bonding a second substrate to a first substrate, forming the frame and the actuator by partially removing the first substrate, and forming the at least one stopper by partially removing the second substrate.

摘要翻译： 微机电系统（MEMS）装置包括框架，致动器，其形成在与框架相同的层上并连接到框架以能够相对于框架执行相对运动;以及至少一个限制器 致动器沿着致动器高度的方向。 MEMS器件通过将第二衬底接合到第一衬底，通过部分去除第一衬底而形成框架和致动器，并且通过部分去除第二衬底来形成至少一个止动器来制造。

公开(公告)号：US20100304517A1

公开(公告)日：2010-12-02

申请号：US12856308

申请日：2010-08-13

申请人： Hee-moon Jeong ,  Jin-woo Cho ,  Yong-hwa Park ,  Jun-o Kim ,  Seok-mo Chang

发明人： Hee-moon Jeong ,  Jin-woo Cho ,  Yong-hwa Park ,  Jun-o Kim ,  Seok-mo Chang

IPC分类号： H01L21/00

CPC分类号： B81B3/0051 ,  B81B2201/042 ,  B81B2203/058 ,  G02B26/085 ,  G02B26/101 ,  G02B26/105

摘要： A microelectromechanical systems (MEMS) device includes a frame, an actuator formed on the same layer as the frame and connected to the frame to be capable of performing a relative motion with respect to the frame, and at least one stopper restricting a displacement of the actuator in a direction along the height of the actuator. The MEMS device is fabricated by bonding a second substrate to a first substrate, forming the frame and the actuator by partially removing the first substrate, and forming the at least one stopper by partially removing the second substrate.

摘要翻译： 微机电系统（MEMS）装置包括框架，致动器，其形成在与框架相同的层上并连接到框架以能够相对于框架执行相对运动;以及至少一个限制器 致动器沿着致动器高度的方向。 MEMS器件通过将第二衬底接合到第一衬底，通过部分去除第一衬底而形成框架和致动器，并且通过部分去除第二衬底来形成至少一个止动器来制造。