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公开(公告)号:US20220367568A1
公开(公告)日:2022-11-17
申请号:US17877714
申请日:2022-07-29
Applicant: Kioxia Corporation
Inventor: Ryu OGIWARA , Daisaburo TAKASHIMA , Takahiko IIZUKA
Abstract: A memory device includes a memory cell and a first select transistor. The memory cell includes a variable resistance memory region, a first semiconductor layer being in contact with the variable resistance memory region, a first insulating layer being in contact with the first semiconductor layer, and a first voltage application electrode being in contact with the first insulating layer. The first select transistor includes a second semiconductor layer, a second insulating layer being in contact with the second semiconductor layer, and a second voltage application electrode extending in the second direction and being in contact with the second insulating layer.
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公开(公告)号:US20210287733A1
公开(公告)日:2021-09-16
申请号:US17015408
申请日:2020-09-09
Applicant: Kioxia Corporation
Inventor: Takahiko IIZUKA , Daisaburo TAKASHIMA , Ryu OGIWARA
IPC: G11C11/4096 , G11C11/4094 , G11C11/4074 , G11C11/408 , G11C5/02 , G11C5/06
Abstract: According to one embodiment, a driver that sequentially supplies a first voltage, a second voltage higher than the first voltage, and the first voltage to the bit line, during the writing operation to the first memory cell. The driver supplies a third voltage to the second word line and a fourth voltage to the second selecting gate line while changing the voltage of the bit line from the second voltage to the first voltage if a data is a first data. The driver supplies a fifth voltage to the second word line and a sixth voltage to the second selecting gate line while changing the voltage of the bit line from the second voltage to the first voltage if the data is a second data. At least the sixth voltage is larger than the fourth voltage or the fifth voltage is larger than the third voltage.
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公开(公告)号:US20210082959A1
公开(公告)日:2021-03-18
申请号:US17008236
申请日:2020-08-31
Applicant: KIOXIA CORPORATION
Inventor: Sumiko DOMAE , Daisaburo TAKASHIMA
IPC: H01L27/11597 , H01L27/11592 , H01L27/11509 , H01L27/11514 , H01L29/78 , H01L29/66 , G11C7/18 , G11C7/06
Abstract: A semiconductor storage device includes a stacked body and a columnar body. The stacked body includes a plurality of conductive layers spaced apart from each other in a stacking direction. The columnar body penetrates the stacked body in the stacking direction. The columnar body includes a columnar ferroelectric film, a semiconductor film disposed between the ferroelectric film and the conductive layers, and an insulating film disposed between the semiconductor film and the conductive layers.
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