公开(公告)号：US06301779B1

公开(公告)日：2001-10-16

申请号：US09181599

申请日：1998-10-29

Applicant: Kaveh Azar

Inventor： Kaveh Azar

IPC: B23P1526

CPC classification number: H01L21/4882 ,  B23P15/26 ,  B23P2700/10 ,  F28F3/02 ,  H01L23/3672 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

Abstract: A plurality of substantially similar fins is produced from the thermally conductive and formable sheet stock, for example aluminum or copper, preferably using a set of matched forming dies. Each die in the set produces a fin that is cupped in side elevation. Each fin has two flanges (in the preferred embodiment) extending from the base portion of the cup, and the fin is preferably rectangular in plan. The die cavities are substantially identical in geometry, but differ slightly in dimension so that the base portion of the cup-shaped fin-pair produced by each die in a set varies in width. Each die in the set includes a feature for producing a locating lug or dimple, or alternatively a hole, in each fin produced. The plurality of substantially geometrically identical, but dimensionally differing fin-pairs are then assembled in a nested stack in accordance with the invention. Each fin-pair in the stack is substantially identical in geometry but the base portion of each fin is successively smaller in dimension, moving axially from top to bottom of the fin stack, to allow for the nesting and so that edges of successive fins define gaps of predetermined dimension. The dimple allows for registration and fine alignment and as the nested dimple substantially align themselves as each fin is assembled in the stack. An interference fit between the dimples may be used to secure the assembled stack. Conventional fabrication techniques are optionally used, including bonding, welding, and brazing, to secure the nested fins to each other. Alternatively, a through hole may be used to effectuate both location of the nested fins and provide for mechanical fastening.

Abstract translation: 多个基本相似的翅片由导热和可成形的片材原料（例如铝或铜）制成，优选使用一组匹配的成型模具。 集合中的每个模具产生一个在侧面拔出的翅片。 每个翅片具有从杯的基部延伸的两个凸缘（在优选实施例中），翅片优选是矩形的。 模腔在几何形状上基本上相同，但在尺寸上略有不同，使得由套件中的每个模具产生的杯形鳍片对的基部宽度变化。 该组件中的每个模具包括用于在每个制成的翅片中产生定位凸耳或凹窝的特征，或者可选地，产生孔。 然后根据本发明将多个基本上几何相同但尺寸不同的翅片对组装成嵌套的堆叠。 堆叠中的每个翅片对的几何形状基本上相同，但是每个翅片的基部部分的尺寸依次较小，从翅片堆叠的顶部到底部轴向移动，以允许嵌套，并且使得连续翅片的边缘限定间隙 的预定尺寸。 凹坑允许配准和精细对准，并且当每个翅片组装在堆叠中时，嵌套凹坑基本上对准自身。 可以使用凹坑之间的干涉配合来固定组装的叠层。 任选地使用常规的制造技术，包括粘合，焊接和钎焊，以将嵌套翅片彼此固定。 或者，可以使用通孔来实现嵌套翅片的两个位置并提供机械紧固。

公开(公告)号：US06269002B1

公开(公告)日：2001-07-31

申请号：US09383079

申请日：1999-08-26

Applicant: Kaveh Azar

Inventor： Kaveh Azar

IPC: H05K720

CPC classification number: H01L23/467 ,  F28F3/02 ,  F28F13/06 ,  F28F2215/08 ,  H01L23/3672 ,  H01L2924/0002 ,  Y10T29/49915 ,  H01L2924/00

Abstract: A heat exchanger is disclosed for dissipating heat from a heat generating component. The heat exchanger comprises a thermally conductive base in thermal communication with the component, a plurality of thermally conductive plate fins affixed to the base wherein the plate fins define a fin field and channels, and fluid control for controlling the fluid flow within the fin field. In a first embodiment of the invention, the heat exchanger comprises a flow guide extending over a top region of the fin field. The flow guide comprises a front portion adjacent to the inlet region of the fin field extending a predetermined distance in front of the fin field, and extending at an angle relative to the front plane of the fin field. The mounting of the flow guides across the top of the fin field and forward of the inlet region enhances acceleration of fluid flow at both the inlet and exhaust regions. In a second embodiment of the invention, the flow guide extends from an area forward of the inlet region to an area rearward of the exhaust region. The portion of the flow guide adjacent to the inlet region is similar to that of the first embodiment of the invention, and the portion of the flow guide adjacent to the exhaust region extends at an obtuse angle relative to the exhaust region. The mounting of the flow guide in the second embodiment of the invention both accelerates fluid flow adjacent to the inlet region and decreases pressure at the exhaust region. Accordingly, mounting of the flow guide across the top of the fin field and across the inlet and outlet regions as disclosed provides enhanced fluid flow through the heat exchanger.

Abstract translation: 公开了一种用于从发热部件散热的热交换器。 热交换器包括与部件热连通的导热基座，固定到基座的多个导热板翅片，其中板翅片限定翅片场和通道，以及用于控制翅片场内的流体流动的流体控制。 在本发明的第一实施例中，热交换器包括在鳍片的顶部区域上延伸的流动引导件。 流动引导件包括与翅片区域的入口区域相邻的前部，其在翅片区域前方延伸预定距离，并且相对于翅片区域的前平面以一定角度延伸。 流动引导件穿过翅片区域的顶部并且在入口区域的前方的安装增强了入口区域和排气区域处的流体流动的加速。 在本发明的第二实施例中，流动引导件从入口区域的前方区域延伸到排气区域后方的区域。 与引入区域相邻的流动引导部分与本发明的第一实施例相似，并且与排气区域相邻的流动引导部分相对于排气区域以钝角延伸。 在本发明的第二实施例中，流动引导件的安装既加速了与入口区域相邻的流体流动并减小了排气区域处的压力。 因此，如所公开的，流动引导件穿过翅片区域的顶部并跨过入口区域和出口区域的安装提供了增强的通过热交换器的流体流动。

公开(公告)号：US06234239B1

公开(公告)日：2001-05-22

申请号：US09345007

申请日：1999-07-02

Applicant: Kaveh Azar

Inventor： Kaveh Azar

IPC: H05K720

CPC classification number: H01L23/467 ,  F28F3/02 ,  F28F13/06 ,  F28F2215/08 ,  H01L23/3672 ,  H01L2924/0002 ,  Y10T29/49915 ,  H01L2924/00

Abstract: A heat exchanger and a method of manufacturing the heat exchanger is disclosed for dissipating heat from a heat generating component. The heat exchanger comprises a thermally conductive base in thermal communication with the component, a plurality of thermally conductive plate fins affixed to the base wherein the plate fins define a fin field and channels, and fluid control for controlling the fluid flow within the fin field. The individual fins of the heat exchanger comprise a plurality of vertical segments extending from the base to the top area of the heat exchanger. The vertical segments are spaced apart by apertures. In an alternative embodiment, the horizontal width of the segments may vary to adjust the fluid flow through the heat exchanger. In conjunction with the above-outlined embodiments, the heat exchanger may comprise a fluid control feature for substantially preventing premature egress of fluid from a top region of the fin field caused by the high pressure region within the fin field.

Abstract translation: 公开了用于从发热部件散热的热交换器和制造热交换器的方法。 热交换器包括与部件热连通的导热基座，固定到基座的多个导热板翅片，其中板翅片限定翅片场和通道，以及用于控制翅片场内的流体流动的流体控制。 热交换器的各个散热片包括从热交换器的底部延伸到顶部区域的多个垂直段。 垂直段通过孔隔开。 在替代实施例中，段的水平宽度可以改变以调节通过热交换器的流体流动。 结合上述实施例，热交换器可以包括流体控制特征，用于基本上防止流体从翅片区域内的高压区域引起的翅片顶部区域的过早流出。

公开(公告)号：US6055154A

公开(公告)日：2000-04-25

申请号：US118674

申请日：1998-07-17

Applicant: Kaveh Azar

Inventor： Kaveh Azar

IPC: H01L23/473 ,  H05K1/02 ,  H05K7/20

CPC classification number: H01L23/473 ,  H01L2924/0002 ,  H05K1/0204

Abstract: An integrated circuit chip cooling system includes a thermally conductive block on which the chip is directly mounted. The block is secured to a printed circuit board and is suspended into flowing coolant, with the chip being maintained out of contact with the coolant. The coolant is circulated to remove heat from the block.

Abstract translation: 集成电路芯片冷却系统包括其上直接安装芯片的导热块。 该块被固定到印刷电路板上并且悬挂在流动的冷却剂中，其中芯片保持与冷却剂不接触。 冷却剂循环以从块中去除热量。

公开(公告)号：US5957194A

公开(公告)日：1999-09-28

申请号：US673802

申请日：1996-06-27

Applicant: Kaveh Azar

Inventor： Kaveh Azar

IPC: F28F3/02 ,  F28F13/06 ,  H01L23/367 ,  H01L23/467 ,  H05K7/20 ,  F28F7/00

CPC classification number: H01L23/467 ,  F28F13/06 ,  F28F3/02 ,  H01L23/3672 ,  H01L2924/0002 ,  Y10T29/49915

Abstract: A heat exchanger is disclosed for dissipating heat from a heat generating component. The heat exchanger comprises a thermally conductive base in thermal communication with the component, a plurality of thermally conductive plate fins affixed to the base wherein the plate fins define a fin field and channels, and fluid control means for controlling the fluid flow within the fin field. In one embodiment, the fluid control means utilizes the low pressure created by flow bypass to vent relatively high pressure fluid within the fin field. Alternatively or in conjunction, the fluid control means substantially prevents premature egress of fluid from the top of the fin field caused by the high pressure region within the fin field.

Abstract translation: 公开了一种用于从发热部件散热的热交换器。 热交换器包括与部件热连通的导热基座，固定到基座的多个导热板翅片，其中板翅片限定翅片场和通道，以及流体控制装置，用于控制翅片场内的流体流动 。 在一个实施例中，流体控制装置利用由流动旁路产生的低压来排出翅片场内的相对高压的流体。 替代地或结合地，流体控制装置基本上防止流体从翅片区域内的高压区域引起的翅片顶部的过早流出。

公开(公告)号：US5294831A

公开(公告)日：1994-03-15

申请号：US807688

申请日：1991-12-16

Applicant: Kaveh Azar ,  Richard E. Caron

Inventor： Kaveh Azar ,  Richard E. Caron

IPC: F28F3/02 ,  H01L23/367 ,  H05K7/20 ,  H01L23/02 ,  H01L25/04

CPC classification number: F28F3/02 ,  H01L23/367 ,  H01L2924/0002 ,  H01L2924/3011

Abstract: Dissipation of the heat produced by the operation of electronic circuitry may be improved by a heat sink which comprises a flat base from which a number of vertical fins extend. The fins are parallel to one another and define a number of parallel channels into which coolant flow is directed. The thermal resistance of the heat sink is optimized by setting fin thickness and channel width parameters to appropriate values. The heat sink may be attached in a heat conductive manner to a heat producing electronic component. One or more of these heat sinked components may be laid out in an in-line or staggered arrangement on a support in the form of a circuit pack. Cooling fluid is delivered to the circuit pack in a variety of ways to cool the heat sinked components. A method of determining the optimum fin thickness and channel width parameters involves determining a relationship between total thermal resistance of the heat sink and combinations of fin thickness and channel width parameters. A contour plot is produced in accordance with the relationship referred to above. The contour plot shows regions of optimum heat dissipation for heat sinks in accordance with the geometry identified here.

Abstract translation: 通过电子电路操作产生的热量的消散可以通过散热器来改善，该散热器包括一个平底座，多个垂直散热片从该基座延伸。 散热片彼此平行并且限定冷却剂流被引向其中的多个平行通道。 通过将翅片厚度和通道宽度参数设置为适当的值来优化散热器的热阻。 散热器可以以导热的方式附接到发热电子部件。 这些散热部件中的一个或多个可以以线性或交错布置布置在电路板形式的支撑件上。 冷却液以各种方式输送到电路板，以冷却散热部件。 确定最佳翅片厚度和通道宽度参数的方法包括确定散热器的总热阻与翅片厚度和通道宽度参数的组合之间的关系。 根据上述关系产生等高线图。 轮廓图显示了根据此处所标识的几何形状，散热片的最佳散热区域。

公开(公告)号：US5158136A

公开(公告)日：1992-10-27

申请号：US790897

申请日：1991-11-12

Applicant: Kaveh Azar

Inventor： Kaveh Azar

IPC: H01L23/36 ,  F28F1/12 ,  F28F3/02 ,  H01L23/367 ,  H01L23/467

CPC classification number: F28F1/124 ,  F28F3/022 ,  H01L23/3677 ,  H01L2924/0002 ,  H01L2924/3011

Abstract: Heat dissipation performance of a pin fin heat sink is improved by utilizing a flow guide arrangement. Flow guide members are positioned relative to the outer rows of the pin fins and longitudinal to fluid flow through the pin fin field of the heat sink. A gap between a lower edge of each flow guide member and a base surface of the heat sink forms apertures allowing potentially stagnant fluid in an interior region of the pin fin field of the heat sink to communicate with fluid flowing around the exterior of the heat sink. This causes a so-called "pump" action in which the potentially stagnant fluid is drawn along with the fluid flowing around the exterior of the heat sink.

公开(公告)号：US5103374A

公开(公告)日：1992-04-07

申请号：US527602

申请日：1990-05-23

Applicant: Kaveh Azar

Inventor： Kaveh Azar

IPC: H05K7/20

CPC classification number: H05K7/20563

Abstract: Disclosed is a fluid-cooled circuit pack which includes heat generating components on a front surface of a circuit board and another surface opposite to the front surface to create a channel for the flow of cooling fluid over the components. An array of rods, or turbulators, are provided on the surface opposite the printed circuit board front surface to create disturbances in the fluid flow and enhance heat transfer.

公开(公告)号：US5067047A

公开(公告)日：1991-11-19

申请号：US522290

申请日：1990-05-11

Applicant: Kaveh Azar

Inventor： Kaveh Azar

IPC: H01L23/473 ,  H05K1/02 ,  H05K7/20

CPC classification number: H05K7/20345 ,  H05K1/0272 ,  H01L2924/0002 ,  H05K2201/064 ,  H05K2201/09063 ,  Y10S165/908 ,  Y10S428/901

Abstract: Disclosed is a means for cooling heat generating components mounted on the front surface of printed circuit boards. A conduit member is attached to the back surface of the board to form a sealed plenum and to provide direction of cooling fluid toward the components. Holes in the board establish cooling jets directed at the components from the plenum.