Abstract:
A shift register apparatus is provided. The pull-down unit of each of the shift registers in the shift register apparatus is controlled by itself, previous, and next two shift registers to enhance the ability of pull-down and voltage regulating. Therefore, the circuit structure of each of the shift registers does not need to be designed a large compensation capacitor therein to substantially restrain the coupling noise effect caused by the clock signal, and thus permitting that each of the shift registers can be collocated with a small compensation capacitor to enhance the output capability thereof.
Abstract:
An extension to USB includes an insulative tongue portion and a number of contacts held in the insulative tongue portion. The contacts have four conductive contacts and two pairs of differential contacts for transferring differential signals. The four conductive contacts consist of a power contact, a ground contact, a − data contact and a + data contact. One pair of the differential contacts is located between the power contact and the − data contact and the other pair of the differential contacts is located between the power contact and the + data contact. The four conductive contacts are for USB protocol and arrangement of the four conductive contacts with the insulative tongue portion is compatible to the standard USB connector. The two pairs of differential contacts are for non-USB protocol. The extension to USB is capable of mated with a commentary standard USB connector and a commentary extension to USB, alternatively.
Abstract:
A connector assembly (100) includes a first connector (10) and a mating second connector (30). Each connector includes a number of leadframes (21, 41) stacked one by one. Each leadframe has a first leadframe housing (211, 411) and a second leadframe housing (214, 414) attached to the first leadframe housing. Each connector includes an array of first terminals (5) and an array of second terminals (6) respectively mounted along the second and the first leadframe housings, and a pair of latching members (25, 45) mounted at opposite sides of the leadframes together with the first and second terminals to tie the plurality of stacked leadframes as a whole.
Abstract:
An electrical connector includes an insulative housing, a plurality of first and second contacts retained in the insulative housing and a metallic ground. Each first contact comprises a first contact portion and a first mounting portion. Each second contact comprises a second contact portion and a second mounting portion. The first and second mounting portions are respectively arranged in first and second rows. The second contacts comprise a grounding contact. The ground piece comprises an elastic contact beam for abutting against the grounding contact so that the surface of the grounding contact is expanded. As a result, cross-talk occurred between the contacts can be decreased.
Abstract:
An electrical connector (100) includes an insulative housing (2) extending in a front-to-back direction, a conductive shell (7) enclosing the insulative housing and cooperating with the insulative housing to define a receiving cavity (101) adapted for receiving a complementary connector, a first set of contacts (3) held in the insulative housing for transmitting a first kind of signals, a second set of contacts (4) held in the insulative housing and comprising two pairs of differential contacts (41) respectively for transmitting and receiving a second kind of signals and a grounding contact (42), a first set of wires (51) and a second set of wires (52). Each first contact includes a contacting section (36) exposed in the receiving cavity and a tail section (35) extending rearward from the contacting section. Each of the second set of contacts includes a contacting section (43) exposed in the receiving cavity and a tail section (45) extending rearward form the contacting section. The first set of wires are aligned in one row and have inner conductors (510) electrically connecting with the tail sections of the first set of contacts. The second set of wires are aligned in one row and include a pair of differential pairs (521) electrically connecting with the two pairs of differential contacts for transmitting and receiving the second kind of signals and at least one grounding conductor (522) electrically connecting with the grounding contact.
Abstract:
Over-voltage indicator and related circuit and method. The over-voltage indicator can work with an I/O circuit of a chip for detecting over-voltage in an I/O pad and providing an indication signal accordingly. When over-voltage does not happen, the over-voltage indicator continues to detect a signal level of the I/O pad and keeps the indication signal low. Once over-voltage is detected, the over-voltage indicator pauses detecting, asserts a high level in the indication signal, and periodically resumes detecting until end of over-voltage is detected. With informing provided by the indication signal, a core cell of the chip can perform proper operation to reduce potential damage caused by over-voltage.
Abstract:
A composite semiconductor structure and method of forming the same are provided. The composite semiconductor structure includes a first silicon-containing compound layer comprising an element selected from the group consisting essentially of germanium and carbon; a silicon layer on the first silicon-containing compound layer, wherein the silicon layer comprises substantially pure silicon; and a second silicon-containing compound layer comprising the element on the silicon layer. The first and the second silicon-containing compound layers have substantially lower silicon concentrations than the silicon layer. The composite semiconductor structure may be formed as source/drain regions of metal-oxide-semiconductor (MOS) devices.
Abstract:
An electroluminescent display includes an electroluminescent panel, and at least one brightness enhanced film. The electroluminescent panel has a plurality of sub-pixels, and at least one illumination surface. The brightness enhanced film is disposed on the at least one illumination surface. The brightness enhanced film has a plurality of micro lenses, and the width of the micro lens is smaller than half of the minimum width of the sub-pixels.
Abstract:
A process of automatically translating an extended activity diagram (EAD) into a hardware component graph (HCG). For translating the high level programming language into a Very High Speed Integrated Circuit Hardware Description Language (VHDL), the high level programming language is first translated into an activity diagram (AD), then the AD is translated into an HCG, which can indicate a connection relation between hardware components, and finally corresponding HDL codes are generated according to the HCG