公开(公告)号：US08344447B2

公开(公告)日：2013-01-01

申请号：US11732889

申请日：2007-04-05

申请人： Hsien-Hsin Lin ,  Weng Chang ,  Chien-Chang Su ,  Kuan-Yu Chen ,  Hsueh-Chang Sung ,  Ming-Hua Yu

发明人： Hsien-Hsin Lin ,  Weng Chang ,  Chien-Chang Su ,  Kuan-Yu Chen ,  Hsueh-Chang Sung ,  Ming-Hua Yu

IPC分类号： H01L29/94

CPC分类号： H01L29/66477 ,  H01L21/02532 ,  H01L29/165 ,  H01L29/665 ,  H01L29/66628 ,  H01L29/66636 ,  H01L29/7848

摘要： A composite semiconductor structure and method of forming the same are provided. The composite semiconductor structure includes a first silicon-containing compound layer comprising an element selected from the group consisting essentially of germanium and carbon; a silicon layer on the first silicon-containing compound layer, wherein the silicon layer comprises substantially pure silicon; and a second silicon-containing compound layer comprising the element on the silicon layer. The first and the second silicon-containing compound layers have substantially lower silicon concentrations than the silicon layer. The composite semiconductor structure may be formed as source/drain regions of metal-oxide-semiconductor (MOS) devices.

摘要翻译： 提供一种复合半导体结构及其形成方法。 复合半导体结构包括第一含硅化合物层，其包含选自基本上由锗和碳组成的组的元素; 所述第一含硅化合物层上的硅层，其中所述硅层包含基本上纯的硅; 以及在所述硅层上包含所述元素的第二含硅化合物层。 第一和第二含硅化合物层具有比硅层低的硅浓度。 复合半导体结构可以形成为金属氧化物半导体（MOS）器件的源极/漏极区域。

公开(公告)号：US20080246057A1

公开(公告)日：2008-10-09

申请号：US11732889

申请日：2007-04-05

申请人： Hsien-Hsin Lin ,  Weng Chang ,  Chien-Chang Su ,  Kuan-Yu Chen ,  Hsueh-Chang Sung ,  Ming-Hua Yu

发明人： Hsien-Hsin Lin ,  Weng Chang ,  Chien-Chang Su ,  Kuan-Yu Chen ,  Hsueh-Chang Sung ,  Ming-Hua Yu

IPC分类号： H01L29/78

CPC分类号： H01L29/66477 ,  H01L21/02532 ,  H01L29/165 ,  H01L29/665 ,  H01L29/66628 ,  H01L29/66636 ,  H01L29/7848

摘要： A composite semiconductor structure and method of forming the same are provided. The composite semiconductor structure includes a first silicon-containing compound layer comprising an element selected from the group consisting essentially of germanium and carbon; a silicon layer on the first silicon-containing compound layer, wherein the silicon layer comprises substantially pure silicon; and a second silicon-containing compound layer comprising the element on the silicon layer. The first and the second silicon-containing compound layers have substantially lower silicon concentrations than the silicon layer. The composite semiconductor structure may be formed as source/drain regions of metal-oxide-semiconductor (MOS) devices.

摘要翻译： 提供一种复合半导体结构及其形成方法。 复合半导体结构包括第一含硅化合物层，其包含选自基本上由锗和碳组成的组的元素; 所述第一含硅化合物层上的硅层，其中所述硅层包含基本上纯的硅; 以及在所述硅层上包含所述元素的第二含硅化合物层。 第一和第二含硅化合物层具有比硅层低的硅浓度。 复合半导体结构可以形成为金属氧化物半导体（MOS）器件的源极/漏极区域。

公开(公告)号：US07494884B2

公开(公告)日：2009-02-24

申请号：US11543435

申请日：2006-10-05

申请人： Hsien-Hsin Lin ,  Li-Te S. Lin ,  Tze-Liang Lee ,  Ming-Hua Yu

发明人： Hsien-Hsin Lin ,  Li-Te S. Lin ,  Tze-Liang Lee ,  Ming-Hua Yu

IPC分类号： H01L21/8238 ,  H01L21/336 ,  H01L21/44

CPC分类号： H01L29/66636 ,  H01L21/02381 ,  H01L21/02529 ,  H01L21/02532 ,  H01L21/0262 ,  H01L21/02639 ,  H01L29/165 ,  H01L29/66628 ,  H01L29/7848

摘要： MOS transistors having localized stressors for improving carrier mobility are provided. Embodiments of the invention comprise a gate electrode formed over a substrate, a carrier channel region in the substrate under the gate electrode, and source/drain regions on either side of the carrier channel region. The source/drain regions include an embedded stressor having a lattice spacing different from the substrate. In a preferred embodiment, the substrate is silicon and the embedded stressor is SiGe or SiC. An epitaxy process that includes using HCl gas selectively forms a stressor layer within the crystalline source/drain regions and not on polycrystalline regions of the structure. A preferred epitaxy process dispenses with the source/drain hard mask required of conventional methods. The embedded SiGe stressor applies a compressive strain to a transistor channel region. In another embodiment, the embedded stressor comprises SiC, and it applies a tensile strain to the transistor channel region.

摘要翻译： 提供了具有用于改善载流子迁移率的局部应力源的MOS晶体管。 本发明的实施例包括形成在衬底上的栅极电极，栅电极下的衬底中的载流子通道区域和载流子通道区域两侧的源极/漏极区域。 源极/漏极区域包括具有与衬底不同的晶格间距的嵌入式应力源。 在优选实施例中，衬底是硅，并且嵌入的应力器是SiGe或SiC。 包括使用HCl气体的外延工艺选择性地在结晶源/漏区内形成应力层，而不是在结构的多晶区上形成。 优选的外延工艺省去了常规方法所需的源极/漏极硬掩模。 嵌入式SiGe应力器将压应变应用于晶体管沟道区。 在另一个实施例中，嵌入式应力器包括SiC，并且其对晶体管沟道区域施加拉伸应变。

公开(公告)号：US20080083948A1

公开(公告)日：2008-04-10

申请号：US11543435

申请日：2006-10-05

申请人： Hsien-Hsin Lin ,  Li-Te S. Lin ,  Tze-Liang Lee ,  Ming-Hua Yu

发明人： Hsien-Hsin Lin ,  Li-Te S. Lin ,  Tze-Liang Lee ,  Ming-Hua Yu

IPC分类号： H01L21/8234

CPC分类号： H01L29/66636 ,  H01L21/02381 ,  H01L21/02529 ,  H01L21/02532 ,  H01L21/0262 ,  H01L21/02639 ,  H01L29/165 ,  H01L29/66628 ,  H01L29/7848

摘要： MOS transistors having localized stressors for improving carrier mobility are provided. Embodiments of the invention comprise a gate electrode formed over a substrate, a carrier channel region in the substrate under the gate electrode, and source/drain regions on either side of the carrier channel region. The source/drain regions include an embedded stressor having a lattice spacing different from the substrate. In a preferred embodiment, the substrate is silicon and the embedded stressor is SiGe or SiC. An epitaxy process that includes using HCl gas selectively forms a stressor layer within the crystalline source/drain regions and not on polycrystalline regions of the structure. A preferred epitaxy process dispenses with the source/drain hard mask required of conventional methods. The embedded SiGe stressor applies a compressive strain to a transistor channel region. In another embodiment, the embedded stressor comprises SiC, and it applies a tensile strain to the transistor channel region.

摘要翻译： 提供了具有用于改善载流子迁移率的局部应力源的MOS晶体管。 本发明的实施例包括形成在衬底上的栅极电极，栅电极下的衬底中的载流子通道区域和载流子通道区域两侧的源极/漏极区域。 源极/漏极区域包括具有与衬底不同的晶格间距的嵌入式应力源。 在优选实施例中，衬底是硅，并且嵌入的应力器是SiGe或SiC。 包括使用HCl气体的外延工艺选择性地在结晶源/漏区内形成应力层，而不是在结构的多晶区上形成。 优选的外延工艺省去了常规方法所需的源极/漏极硬掩模。 嵌入式SiGe应力器将压应变应用于晶体管沟道区。 在另一个实施例中，嵌入式应力器包括SiC，并且其对晶体管沟道区域施加拉伸应变。

公开(公告)号：US20110230022A1

公开(公告)日：2011-09-22

申请号：US13117782

申请日：2011-05-27

申请人： Ming-Hua Yu ,  Ling-Yen Yeh ,  Tze-Liang Lee

发明人： Ming-Hua Yu ,  Ling-Yen Yeh ,  Tze-Liang Lee

IPC分类号： H01L21/8238 ,  H01L21/20 ,  H01L21/336

CPC分类号： H01L29/7848 ,  H01L21/823807 ,  H01L21/823814 ,  H01L29/165 ,  H01L29/66628 ,  H01L29/66636

摘要： A semiconductor device and method of manufacture thereof wherein a PMOS source/drain region of a transistor within the substrate includes a first strained layer in the PMOS source/drain region and a first capping layer in contact with the first strained layer. Further, the semiconductor device and method provide for an NMOS source/drain region of a transistor within the substrate including a second strained layer in the NMOS source/drain region and a second capping layer in contact with the second strained layer.

摘要翻译： 一种半导体器件及其制造方法，其中所述衬底内的晶体管的PMOS源极/漏极区域包括所述PMOS源极/漏极区域中的第一应变层和与所述第一应变层接触的第一覆盖层。 此外，半导体器件和方法提供了衬底内的晶体管的NMOS源极/漏极区域，其包括NMOS源极/漏极区域中的第二应变层和与第二应变层接触的第二覆盖层。

公开(公告)号：US07973337B2

公开(公告)日：2011-07-05

申请号：US12844896

申请日：2010-07-28

申请人： Ming-Hua Yu ,  Ling-Yen Yeh ,  Tze-Liang Lee

发明人： Ming-Hua Yu ,  Ling-Yen Yeh ,  Tze-Liang Lee

IPC分类号： H01L31/0328

CPC分类号： H01L29/7848 ,  H01L21/823807 ,  H01L21/823814 ,  H01L29/165 ,  H01L29/66628 ,  H01L29/66636

摘要： A semiconductor device and method of manufacture thereof wherein a PMOS source/drain region of a transistor within the substrate includes a first strained layer in the PMOS source/drain region and a first capping layer in contact with the first strained layer. Further, the semiconductor device and method provide for an NMOS source/drain region of a transistor within the substrate including a second strained layer in the NMOS source/drain region and a second capping layer in contact with the second strained layer.

摘要翻译： 一种半导体器件及其制造方法，其中所述衬底内的晶体管的PMOS源极/漏极区域包括所述PMOS源极/漏极区域中的第一应变层和与所述第一应变层接触的第一覆盖层。 此外，半导体器件和方法提供了衬底内的晶体管的NMOS源极/漏极区域，其包括NMOS源极/漏极区域中的第二应变层和与第二应变层接触的第二覆盖层。

公开(公告)号：US20110049567A1

公开(公告)日：2011-03-03

申请号：US12841763

申请日：2010-07-22

申请人： Eric Peng ,  Chao-Cheng Chen ,  Ming-Hua Yu ,  Ying Hao Hsieh ,  Tze-Liang Lee ,  Chii-Horng Li ,  Syun-Ming Jang ,  Shih-Hao Lo

发明人： Eric Peng ,  Chao-Cheng Chen ,  Ming-Hua Yu ,  Ying Hao Hsieh ,  Tze-Liang Lee ,  Chii-Horng Li ,  Syun-Ming Jang ,  Shih-Hao Lo

IPC分类号： H01L29/78 ,  H01L21/336

CPC分类号： H01L29/7848 ,  H01L21/30608 ,  H01L21/3065 ,  H01L29/165 ,  H01L29/66636

摘要： The present disclosure provides a method for fabricating a semiconductor device that includes providing a silicon substrate, forming a gate stack over the silicon substrate, performing a biased dry etching process to the substrate to remove a portion of the silicon substrate, thereby forming a recess region in the silicon substrate, performing a non-biased etching process to the recess region in the silicon substrate, thereby forming a bottle-neck shaped recess region in the silicon substrate, and epi-growing a semiconductor material in the bottle-neck shaped recess region in the silicon substrate. An embodiment may include a biased dry etching process including adding HeO2 gas and HBr gas. An embodiment may include performing a first biased dry etching process including N2 gas and performing a second biased dry etching process not including N2 gas. An embodiment may include performing an oxidation process to the recess region in the silicon substrate by adding oxygen gas to form silicon oxide on a portion of the recess region in the silicon substrate. As such, these processes form polymer protection to help form the bottle-neck shaped recess.

摘要翻译： 本公开提供了一种制造半导体器件的方法，其包括提供硅衬底，在硅衬底上形成栅极堆叠，对衬底执行偏置的干蚀刻工艺以去除硅衬底的一部分，从而形成凹陷区域 在硅衬底中，对硅衬底中的凹部进行无偏压蚀刻工艺，从而在硅衬底中形成瓶颈形凹部区域，并且在瓶颈形凹部区域中形成半导体材料 在硅衬底中。 一个实施例可以包括偏置的干蚀刻工艺，包括加入HeO2气体和HBr气体。 实施例可以包括执行包括N 2气体的第一偏压干法蚀刻工艺，并执行不包括N 2气体的第二偏压干式蚀刻工艺。 一个实施例可以包括通过在硅衬底中的一部分凹陷区域上添加氧气以形成氧化硅，来对硅衬底中的凹陷区域进行氧化处理。 因此，这些方法形成聚合物保护以帮助形成瓶颈形凹部。

公开(公告)号：US07781799B2

公开(公告)日：2010-08-24

申请号：US11923420

申请日：2007-10-24

申请人： Ming-Hua Yu ,  Ling-Yen Yeh ,  Tze-Liang Lee

发明人： Ming-Hua Yu ,  Ling-Yen Yeh ,  Tze-Liang Lee

IPC分类号： H01L31/0328

CPC分类号： H01L29/7848 ,  H01L21/823807 ,  H01L21/823814 ,  H01L29/165 ,  H01L29/66628 ,  H01L29/66636

摘要： A semiconductor device and method of manufacture thereof wherein a PMOS source/drain region of a transistor within the substrate includes a first strained layer in the PMOS source/drain region and a first capping layer in contact with the first strained layer. Further, the semiconductor device and method provide for an NMOS source/drain region of a transistor within the substrate including a second strained layer in the NMOS source/drain region and a second capping layer in contact with the second strained layer.

摘要翻译： 一种半导体器件及其制造方法，其中所述衬底内的晶体管的PMOS源极/漏极区域包括所述PMOS源极/漏极区域中的第一应变层和与所述第一应变层接触的第一覆盖层。 此外，半导体器件和方法提供了衬底内的晶体管的NMOS源极/漏极区域，其包括NMOS源极/漏极区域中的第二应变层和与第二应变层接触的第二覆盖层。

公开(公告)号：US20100151648A1

公开(公告)日：2010-06-17

申请号：US12714001

申请日：2010-02-26

申请人： Ming-Hua Yu ,  Tai-Chun Huang

发明人： Ming-Hua Yu ,  Tai-Chun Huang

IPC分类号： H01L21/336

CPC分类号： H01L21/823807 ,  H01L21/823814 ,  H01L29/1054 ,  H01L29/665 ,  H01L29/6659 ,  H01L29/66628 ,  H01L29/66636 ,  H01L29/7833

摘要： A semiconductor device, such as a PMOS or an NMOS transistor, having a stressed channel region is provided. The semiconductor device is formed by recessing the source/drain regions after forming a gate stack. The substrate is removed under the gate stack. Thereafter, an epitaxial layer is formed under the gate stack and in the source/drain regions. The epitaxial layer may be doped in the source/drain regions. In an embodiment, a lower portion of the epitaxial layer and the epitaxial layer under the gate stack may be doped with a conductivity type opposite of the conductivity type of the source/drain regions. In another embodiment of the present invention, a lower portion of the epitaxial layer is left undoped.

摘要翻译： 提供具有应力通道区域的诸如PMOS或NMOS晶体管的半导体器件。 半导体器件通过在形成栅极堆叠之后使源极/漏极区域凹陷来形成。 在栅极堆叠下去除衬底。 此后，在栅叠层和源极/漏极区内形成外延层。 外延层可以掺杂在源极/漏极区域中。 在一个实施例中，外延层的下部和栅叠层下的外延层可以掺杂有与源极/漏极区的导电类型相反的导电类型。 在本发明的另一实施例中，外延层的下部未被掺杂。

公开(公告)号：US09054130B2

公开(公告)日：2015-06-09

申请号：US12841763

申请日：2010-07-22

申请人： Eric Peng ,  Chao-Cheng Chen ,  Ming-Hua Yu ,  Ying Hao Hsieh ,  Tze-Liang Lee ,  Chii-Horng Li ,  Syun-Ming Jang ,  Shih-Hao Lo

发明人： Eric Peng ,  Chao-Cheng Chen ,  Ming-Hua Yu ,  Ying Hao Hsieh ,  Tze-Liang Lee ,  Chii-Horng Li ,  Syun-Ming Jang ,  Shih-Hao Lo

IPC分类号： H01L21/302 ,  H01L29/66 ,  H01L21/306 ,  H01L21/3065 ,  H01L29/165

CPC分类号： H01L29/7848 ,  H01L21/30608 ,  H01L21/3065 ,  H01L29/165 ,  H01L29/66636

摘要： The present disclosure provides a method for fabricating a semiconductor device that includes providing a silicon substrate, forming a gate stack over the silicon substrate, performing a biased dry etching process to the substrate to remove a portion of the silicon substrate, thereby forming a recess region in the silicon substrate, performing a non-biased etching process to the recess region in the silicon substrate, thereby forming a bottle-neck shaped recess region in the silicon substrate, and epi-growing a semiconductor material in the bottle-neck shaped recess region in the silicon substrate. An embodiment may include a biased dry etching process including adding HeO2 gas and HBr gas. An embodiment may include performing a first biased dry etching process including N2 gas and performing a second biased dry etching process not including N2 gas. An embodiment may include performing an oxidation process to the recess region in the silicon substrate by adding oxygen gas to form silicon oxide on a portion of the recess region in the silicon substrate. As such, these processes form polymer protection to help form the bottle-neck shaped recess.

摘要翻译： 本公开提供了一种制造半导体器件的方法，其包括提供硅衬底，在硅衬底上形成栅极堆叠，对衬底执行偏置的干蚀刻工艺以去除硅衬底的一部分，从而形成凹陷区域 在硅衬底中，对硅衬底中的凹陷区域进行非偏置蚀刻工艺，从而在硅衬底中形成瓶颈形凹部区域，并且在瓶颈形凹部区域中生长半导体材料 在硅衬底中。 一个实施例可以包括偏置的干蚀刻工艺，包括加入HeO2气体和HBr气体。 实施例可以包括执行包括N 2气体的第一偏压干法蚀刻工艺，并执行不包括N 2气体的第二偏压干式蚀刻工艺。 一个实施例可以包括通过在硅衬底中的一部分凹陷区域上添加氧气以形成氧化硅，来对硅衬底中的凹陷区域进行氧化处理。 因此，这些方法形成聚合物保护以帮助形成瓶颈形凹部。