公开(公告)号：US20070075716A1

公开(公告)日：2007-04-05

申请号：US11607398

申请日：2006-12-01

Applicant: K. Gleason ,  Tim Lesher ,  Eric Strid ,  Mike Andrews ,  John Martin ,  John Dunklee ,  Leonard Hayden ,  Amr Safwat

Inventor： K. Gleason ,  Tim Lesher ,  Eric Strid ,  Mike Andrews ,  John Martin ,  John Dunklee ,  Leonard Hayden ,  Amr Safwat

IPC: G01R31/02

CPC classification number: G01R1/06772 ,  G01R1/06711 ,  G01R1/06755 ,  G01R1/06777

Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.

公开(公告)号：US07075320B2

公开(公告)日：2006-07-11

申请号：US11077810

申请日：2005-03-09

Applicant: Leonard Hayden ,  Scott Rumbaugh ,  Mike Andrews

Inventor： Leonard Hayden ,  Scott Rumbaugh ,  Mike Andrews

IPC: G01R31/02

CPC classification number: G01R1/06766 ,  G01R1/06738 ,  G01R1/06772

Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode. A probe and method of probing reduces signal distortion and power dissipation by transmitting a modulated signal to the device-under-test through an impedance matching resistor and transmitting of a direct current to the device-under-test over a second signal path that avoids the impedance matching resistor.

Abstract translation: 同时将直流电和调制信号施加到被测器件上的接触焊盘，例如激光二极管。 探头和探测方法通过阻抗匹配电阻将调制信号发送到被测器件，并通过第二个信号通路将直流电流传输到被测器件，从而降低信号失真和功耗 阻抗匹配电阻。

公开(公告)号：US20050151548A1

公开(公告)日：2005-07-14

申请号：US11077810

申请日：2005-03-09

Applicant: Leonard Hayden ,  Scott Rumbaugh ,  Mike Andrews

Inventor： Leonard Hayden ,  Scott Rumbaugh ,  Mike Andrews

IPC: G01R1/067 ,  G01R31/02

CPC classification number: G01R1/06766 ,  G01R1/06738 ,  G01R1/06772

Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode. A probe and method of probing reduces signal distortion and power dissipation by transmitting a modulated signal to the device-under-test through an impedance matching resistor and transmitting of a direct current to the device-under-test over a second signal path that avoids the impedance matching resistor.

Abstract translation: 同时将直流电和调制信号施加到被测器件上的接触焊盘，例如激光二极管。 探头和探测方法通过阻抗匹配电阻将调制信号发送到被测器件，并通过第二个信号通道将直流电流发送到被测器件，从而减少信号失真和功耗，避免了 阻抗匹配电阻。

公开(公告)号：US20050062489A1

公开(公告)日：2005-03-24

申请号：US10980083

申请日：2004-11-03

Applicant: Ron Peters ,  Leonard Hayden ,  Jeffrey Hawkins ,  R. Dougherty

Inventor： Ron Peters ,  Leonard Hayden ,  Jeffrey Hawkins ,  R. Dougherty

IPC: G01R31/26 ,  G01R1/04 ,  G01R1/06 ,  G01R31/28 ,  H01L21/66 ,  G01R31/02

CPC classification number: G01R1/18 ,  G01R1/04 ,  G01R31/002 ,  G01R31/2808 ,  G01R31/286 ,  G01R31/2886 ,  G01R31/2889

Abstract: A probe station for probing a test device has a chuck element for supporting the test device. An electrically conductive outer shield enclosure at least partially encloses such chuck element to provide EMI shielding therefor. An electrically conductive inner shield enclosure is interposed between and insulated from the outer shield enclosure and the chuck element, and at least partially encloses the chuck element.

公开(公告)号：US20050024069A1

公开(公告)日：2005-02-03

申请号：US10928688

申请日：2004-08-26

Applicant: Leonard Hayden ,  Scott Rumbaugh ,  Mike Andrews

Inventor： Leonard Hayden ,  Scott Rumbaugh ,  Mike Andrews

IPC: G01R1/067 ,  G01R31/02

CPC classification number: G01R1/06766 ,  G01R1/06738 ,  G01R1/06772

Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode. A probe and method of probing reduces signal distortion and power dissipation by transmitting a modulated signal to the device-under-test through an impedance matching resistor and transmitting of a direct current to the device-under-test over a second signal path that avoids the impedance matching resistor.

公开(公告)号：US20100251545A1

公开(公告)日：2010-10-07

申请号：US12818563

申请日：2010-06-18

Applicant: Leonard Hayden ,  John Martin ,  Mike Andrews

Inventor： Leonard Hayden ,  John Martin ,  Mike Andrews

IPC: H01R43/00

CPC classification number: G01R1/06772 ,  G01R1/07342 ,  Y10T29/49121 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208

Abstract: The present invention relates to a probe for testing of integrated circuits or other microelectronic devices.

Abstract translation: 本发明涉及一种用于集成电路或其他微电子器件测试的探针。

公开(公告)号：US07456646B2

公开(公告)日：2008-11-25

申请号：US11975175

申请日：2007-10-18

Applicant: Leonard Hayden ,  John Martin ,  Mike Andrews

Inventor： Leonard Hayden ,  John Martin ,  Mike Andrews

IPC: G01R1/073 ,  H01L21/00

CPC classification number: G01R1/06772 ,  G01R1/07342 ,  Y10T29/49121 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208

Abstract: The present invention relates to a probe for testing of integrated circuits or other microelectronic devices.

Abstract translation: 本发明涉及一种用于集成电路或其他微电子器件测试的探针。

公开(公告)号：US20080054929A1

公开(公告)日：2008-03-06

申请号：US11977280

申请日：2007-10-24

Applicant: K. Gleason ,  Tim Lesher ,  Eric Strid ,  Mike Andrews ,  John Martin ,  John Dunklee ,  Leonard Hayden ,  Amr Safwat

Inventor： K. Gleason ,  Tim Lesher ,  Eric Strid ,  Mike Andrews ,  John Martin ,  John Dunklee ,  Leonard Hayden ,  Amr Safwat

IPC: G01R11/067

CPC classification number: G01R1/06772 ,  G01R1/06711 ,  G01R1/06755 ,  G01R1/06777

Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.

公开(公告)号：US20080054923A1

公开(公告)日：2008-03-06

申请号：US11977282

申请日：2007-10-24

Applicant: K. Gleason ,  Tim Lesher ,  Eric Strid ,  Mike Andrews ,  John Martin ,  John Dunklee ,  Leonard Hayden ,  Amr Safwat

Inventor： K. Gleason ,  Tim Lesher ,  Eric Strid ,  Mike Andrews ,  John Martin ,  John Dunklee ,  Leonard Hayden ,  Amr Safwat

IPC: G01R1/067 ,  G01R31/02

CPC classification number: G01R1/06772 ,  G01R1/06711 ,  G01R1/06755 ,  G01R1/06777

Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.

公开(公告)号：US20080048693A1

公开(公告)日：2008-02-28

申请号：US11977338

申请日：2007-10-24

Applicant: Ron Peters ,  Leonard Hayden ,  Jeffrey Hawkins ,  R. Dougherty

Inventor： Ron Peters ,  Leonard Hayden ,  Jeffrey Hawkins ,  R. Dougherty

IPC: G01R31/02

CPC classification number: G01R1/18 ,  G01R1/04 ,  G01R31/002 ,  G01R31/2808 ,  G01R31/286 ,  G01R31/2886 ,  G01R31/2889

Abstract: A probe station for probing a test device has a chuck element for supporting the test device. An electrically conductive outer shield enclosure at least partially encloses such chuck element to provide EMI shielding therefor. An electrically conductive inner shield enclosure is interposed between and insulated from the outer shield enclosure and the chuck element, and at least partially encloses the chuck element.

Abstract translation: 用于探测测试装置的探测台具有用于支撑测试装置的卡盘元件。 导电外屏蔽外壳至少部分地包围这种卡盘元件以提供EMI屏蔽。 导电内屏蔽外壳被插入在外屏蔽外壳和卡盘元件之间并且与外屏​​蔽外壳和卡盘元件绝缘，并且至少部分地包围卡盘元件。