公开(公告)号：US20130027883A1

公开(公告)日：2013-01-31

申请号：US13189596

申请日：2011-07-25

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： H05K7/20809 ,  H05K7/20309 ,  H05K7/20318 ,  Y10T29/4935 ,  Y10T29/49377 ,  Y10T29/49378

摘要： A heat sink, and cooled electronic structure and cooled electronic apparatus utilizing the heat sink, are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels and one or more vapor-condensing channels. A membrane is disposed between the coolant-carrying channel(s) and the vapor-condensing channel(s). The membrane includes at least one vapor-permeable region, at least a portion of which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s) to the vapor-condensing channel(s). The heat sink further includes one or more coolant inlets coupled to provide a first liquid coolant flow to the coolant-carrying channel(s), and a second liquid coolant flow to condense vapor within the vapor-condensing channel(s).

摘要翻译： 提供了一种散热器，以及使用散热器的冷却电子结构和冷却电子设备。 散热器由导热结构制成，其包括一个或多个冷却剂输送通道和一个或多个蒸汽冷凝通道。 一个薄膜设置在冷却剂输送通道和蒸汽冷凝通道之间。 膜包括至少一个透气区域，其至少一部分覆盖着一部分冷却剂输送通道，并且有助于将蒸气从冷却剂输送通道移除到蒸汽冷凝通道（ s）。 散热器还包括一个或多个冷却剂入口，所述冷却剂入口联接以向所述冷却剂输送通道提供第一液体冷却剂流，以及第二液体冷却剂流以冷凝所述蒸汽冷凝通道内的蒸气。

公开(公告)号：US20130019614A1

公开(公告)日：2013-01-24

申请号：US13187561

申请日：2011-07-21

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： F25D31/00

CPC分类号： H05K7/20136 ,  H05K7/20209 ,  H05K7/203 ,  H05K7/20745 ,  H05K7/20781

摘要： A cooling apparatus and method are provided for cooling an electronic subsystem of an electronics rack. The cooling apparatus includes a local cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronic subsystem of the rack, and includes either a housing facilitating immersion cooling of electronic components of the electronic subsystem, or one or more liquid-cooled structures providing conductive cooling to the electronic components of the electronic subsystem. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger of the local cooling station. In operation, heat is transferred via circulating coolant from the electronic subsystem and rejected in the liquid-to-air heat exchanger of the local cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.

公开(公告)号：US20120111037A1

公开(公告)日：2012-05-10

申请号：US12939552

申请日：2010-11-04

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F25B1/00 ,  F25B29/00 ,  F25D31/00 ,  F25D15/00

CPC分类号： F25B49/02 ,  F25B2400/01 ,  F25B2500/28 ,  H05K7/20809 ,  H05K7/20836

摘要： Apparatus and method are provided for cooling an electronic component. The apparatus includes a refrigerant evaporator in thermal communication with the component(s) to be cooled, and a refrigerant loop coupled in fluid communication with the evaporator for facilitating flow of refrigerant through the evaporator. The apparatus further includes a compressor in fluid communication with the refrigerant loop, a refrigerant bypass pipe coupled to the refrigerant loop in parallel fluid communication with the evaporator, and a control valve for controlling refrigerant flow through the evaporator. The control valve is controlled to maintain temperature of the component(s) within a specified temperature range. The apparatus further includes a controllable refrigerant heater associated with the refrigerant bypass pipe for providing an adjustable heat load on refrigerant in the bypass pipe to ensure that refrigerant entering the compressor is in a superheated thermodynamic state.

摘要翻译： 提供了用于冷却电子部件的装置和方法。 该装置包括与要冷却的部件热连通的制冷剂蒸发器和与蒸发器流体连通的制冷剂回路，以便于制冷剂流过蒸发器。 该装置还包括与该制冷剂回路流体连通的压缩机，与该蒸发器并联流体连通的联接到制冷剂回路的制冷剂旁路管，以及用于控制通过蒸发器的制冷剂流动的控制阀。 控制阀被控制以将部件的温度保持在规定的温度范围内。 该装置还包括与制冷剂旁通管相关联的可控制冷剂加热器，用于在旁通管中的制冷剂上提供可调节的热负荷，以确保进入压缩机的制冷剂处于过热的热力学状态。

公开(公告)号：US20120111036A1

公开(公告)日：2012-05-10

申请号：US12939535

申请日：2010-11-04

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F25B1/00 ,  F25D17/02 ,  F25D31/00 ,  F25B43/00

CPC分类号： F25B49/02 ,  F25B25/005 ,  F25B2400/01 ,  F25B2400/24 ,  F25B2600/0251 ,  F28D20/021 ,  F28D2020/0008 ,  H05K7/20809 ,  Y02E60/145

摘要： Apparatus and method are provided for cooling an electronic component(s). The apparatus includes a coolant-cooled structure in thermal communication with the component(s) to be cooled, and a coolant-to-refrigerant heat exchanger in fluid communication with the coolant-cooled structure via a coolant loop. A thermal buffer unit is coupled in fluid communication with the coolant loop, and a refrigerant loop is coupled in fluid communication with the heat exchanger. The heat exchanger dissipates heat from coolant in the coolant loop to refrigerant in the refrigerant loop. A compressor is coupled in fluid communication with the refrigerant loop and is maintained ON responsive to heat load of the component(s) exceeding a heat load threshold, and is cycled ON and OFF responsive to heat load of the component(s) being below the threshold. The thermal storage unit dampens swings in coolant temperature within the coolant loop during cycling ON and OFF of the compressor.

摘要翻译： 提供了用于冷却电子部件的装置和方法。 该装置包括与要冷却的部件热连通的冷却剂冷却结构，以及通过冷却剂回路与冷却剂冷却结构流体连通的冷却剂 - 制冷剂热交换器。 热缓冲单元与冷却剂回路流体连通地联接，并且制冷剂回路与热交换器流体连通地联接。 热交换器将冷却剂回路中的冷却剂的热量散发到制冷剂回路中的制冷剂。 压缩机与制冷剂回路流体连通地联接，并且响应于超过热负荷阈值的部件的热负荷而保持接通，并响应于部件的热负荷而循环接通和断开 阈。 在循环打开和关闭压缩机期间，热存储单元会抑制冷却液回路内冷却液温度的波动。

公开(公告)号：US20120111034A1

公开(公告)日：2012-05-10

申请号：US12939541

申请日：2010-11-04

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F25B41/00 ,  F24H1/10 ,  F25D31/00

CPC分类号： F25B25/005 ,  F24D2200/123 ,  F24D2200/29 ,  F25B49/02 ,  F25B2400/01 ,  F25B2500/28 ,  F25B2700/21171 ,  H05K7/20809 ,  H05K7/20836 ,  Y02B10/70

摘要： A heat exchange assembly and apparatus and method employing the heat exchange assembly are provided. The heat exchange assembly includes a coolant-to-refrigerant heat exchanger and a heater. The heat exchanger includes a coolant inlet and a coolant outlet for passing a coolant through the heat exchanger, and a refrigerant inlet and a refrigerant outlet for separately passing a refrigerant through the heat exchanger. The heat exchanger cools coolant passing through the heat exchanger by dissipating heat from coolant passing through the heat exchanger to refrigerant passing through the heat exchanger. The heater is integrated with the heat exchanger and applies an auxiliary heat load to refrigerant passing through the heat exchanger to facilitate ensuring that refrigerant passing through the heat exchanger absorbs at least a specified minimum heat load, for example, to ensure that refrigerant egressing from the refrigerant outlet of the heat exchanger is superheated vapor refrigerant.

摘要翻译： 提供了一种使用热交换组件的热交换组件和设备和方法。 热交换组件包括冷却剂 - 制冷剂热交换器和加热器。 热交换器包括用于使冷却剂通过热交换器的冷却剂入口和冷却剂出口，以及用于使制冷剂分开地通过热交换器的制冷剂入口和制冷剂出口。 热交换器通过将通过热交换器的冷却剂的热量散发通过热交换器的制冷剂来冷却通过热交换器的冷却剂。 加热器与热交换器集成，并对通过热交换器的制冷剂施加辅助热负荷，以便确保通过热交换器的制冷剂至少吸收特定的最小热负荷，以确保制冷剂从 热交换器的制冷剂出口是过热蒸气制冷剂。

公开(公告)号：US20110315353A1

公开(公告)日：2011-12-29

申请号：US12825745

申请日：2010-06-29

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F28D15/00 ,  F25B41/00

CPC分类号： H05K7/20809

摘要： Liquid-cooled electronics racks are provided which include: immersion-cooled electronic subsystems; a vertically-oriented, vapor-condensing unit facilitating condensing dielectric fluid vapor egressing from the immersion-cooled subsystems, the vertically-oriented, vapor-condensing unit being sized and configured to reside adjacent to at least one side of the electronics rack; a reservoir for holding dielectric fluid, the reservoir receiving dielectric fluid condensate from the vertically-oriented, vapor-condensing unit; a dielectric fluid supply manifold coupling in fluid communication the reservoir and the dielectric fluid inlets of the immersion-cooled electronic subsystems; and a pump associated with a reservoir for pumping under pressure dielectric fluid from the reservoir to the dielectric fluid supply manifold for maintaining dielectric fluid in a liquid state within the immersion-cooled electronic subsystems.

摘要翻译： 提供液冷电子机架，包括：浸入式冷却电子子系统; 垂直取向的蒸气冷凝单元，其有助于冷凝来自浸没冷却子系统的介电流体蒸汽，所述垂直取向的蒸汽冷凝单元的尺寸和构造为邻近电子机架的至少一侧驻留; 用于保持介电流体的储存器，所述储存器从垂直取向的蒸汽冷凝单元接收介质流体冷凝物; 介质流体供应歧管联接以使浸没冷却的电子子系统的储存器和电介质流体入口流体连通; 以及与储存器相关联的泵，用于在压力介质流体下从介质流体供应歧管压力介质流体，用于将浸没冷却的电子子系统内的介质流体保持在液态。

公开(公告)号：US20110315344A1

公开(公告)日：2011-12-29

申请号：US12825761

申请日：2010-06-29

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F28F7/00

CPC分类号： F28F3/04 ,  F28D2021/0031 ,  F28F3/12 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20236 ,  H05K7/20827

摘要： Cooling apparatus and method are provided for immersion-cooling of an electronic subsystem of an electronics rack. The cooling apparatus includes a housing at least partially surrounding and forming a sealed compartment about the electronic subsystem and a dielectric fluid disposed within the sealed compartment so that the electronic subsystem is immersed within the dielectric fluid. A liquid-cooled vapor condenser is provided which includes a plurality of thermally conductive condenser fins extending within the sealed compartment. The condenser fins facilitate cooling and condensing of dielectric fluid vapor generated within the sealed compartment. Within the sealed compartment, multiple thermally conductive condenser fins are interleaved with multiple electronic components immersed within the dielectric fluid to facilitate localized cooling and condensing of dielectric fluid vapor between the multiple electronic components.

摘要翻译： 提供冷却装置和方法用于电子机架的电子子系统的浸没冷却。 冷却装置包括至少部分围绕电子子系统和形成密封隔室的壳体，以及设置在密封隔间内的电介质流体，使得电子子系统浸没在电介质流体内。 提供了液体冷却的蒸汽冷凝器，其包括在密封隔室内延伸的多个导热冷凝器翅片。 冷凝器翅片促进在密封隔室内产生的介电流体蒸气的冷却和冷凝。 在密封隔室内，多个导热冷凝器翅片与浸没在电介质流体内的多个电子部件交错，以便于多个电子部件之间的介电流体蒸气的局部冷却和冷凝。

公开(公告)号：US20110069454A1

公开(公告)日：2011-03-24

申请号：US12566081

申请日：2009-09-24

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Michael RIZZOLO ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Michael RIZZOLO ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H05K7/2079

摘要： Liquid-cooled electronics apparatuses and methods are provided. The cooled electronics apparatuses include a liquid-cooled cold rail and an electronics subassembly. The liquid-cooled cold rail has a thermally conductive structure and a coolant-carrying channel extending within and cooling the thermally conductive structure. The electronics subassembly includes an electronics card(s) and one or more thermal transfer plates. The electronics card(s) includes electronic devices to be cooled, and the one or more thermal transfer plates are each rigidly affixed to one or more electronic devices of the electronics card(s). Each thermal transfer plate is thermally conductive and couples the electronics subassembly to the liquid-cooled cold rail to thermally interface the one or more electronic devices to the liquid-cooled cold rail to facilitate cooling of the electronic devices. In one embodiment, the electronics subassembly includes multiple interleaved electronics cards and thermal transfer plates.

摘要翻译： 提供液冷电子设备和方法。 冷却的电子设备包括液冷冷轨和电子组件。 液冷冷轨具有导热结构和在导热结构内延伸并冷却导热结构的冷却剂承载通道。 电子组件包括电子卡和一个或多个热传递板。 电子卡片包括要冷却的电子设备，并且一个或多个热转印板每个刚性地固定到电子卡的一个或多个电子设备。 每个热传递板是导热的并且将电子组件耦合到液冷冷轨，以将一个或多个电子设备热连接到液冷冷轨，以便电子设备的冷却。 在一个实施例中，电子组件包括多个交错电子卡和热转印板。

公开(公告)号：US20100328890A1

公开(公告)日：2010-12-30

申请号：US12491287

申请日：2009-06-25

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： H05K7/20 ,  F25B23/00 ,  B23P17/00

CPC分类号： F28D15/0266 ,  F28F3/02 ,  F28F3/022 ,  H05K7/203 ,  H05K7/20318 ,  H05K7/20809 ,  Y10S165/908 ,  Y10T29/49002

摘要： Vapor condensers and cooling apparatuses are provided which facilitate vapor condensation cooling of a coolant employed in cooling an electronic device. The vapor condenser includes a thermally conductive base structure with a plurality of condenser fins extending from the base structure. The condenser fins have a proximal end coupled to the base structure and a remote end remote from the base structure. At least one exposed cavity is provided within each condenser fin extending from the remote end towards the proximal end. The exposed cavities are sized to provide greater condenser fin surface area for facilitating vapor condensate formation, and thereby facilitate cooling of an electronic device using a two-phase coolant.

摘要翻译： 提供蒸汽冷凝器和冷却装置，其有助于冷却电子装置中所用的冷却剂的蒸气冷凝冷却。 蒸汽冷凝器包括具有从基部结构延伸的多个冷凝器翅片的导热基底结构。 冷凝器翅片具有连接到基部结构的近端和远离基部结构的远端。 在从远端朝向近端延伸的每个冷凝器翅片内设置至少一个暴露的空腔。 暴露的空腔的尺寸设置成提供更大的冷凝器翅片表面积，以便于蒸气冷凝物的形成，从而便于使用两相冷却剂冷却电子装置。

公开(公告)号：US20100328888A1

公开(公告)日：2010-12-30

申请号：US12491325

申请日：2009-06-25

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： H05K7/20 ,  F28D15/00 ,  B21D53/02

CPC分类号： H01L23/4735 ,  F28D15/0266 ,  F28F13/187 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： A cooling apparatus and method of fabrication are provided for facilitating cooling of an electronic device. The cooling apparatus includes a thermally conductive porous material and a liquid coolant supply. The thermally conductive porous material (such as metal foam material) is coupled to a surface of the electronic device to be cooled, or a structure coupled to the electronic device. The liquid coolant supply includes a jet impingement structure, which includes one or more jet nozzles for directing liquid coolant onto the surface to be cooled. The jet nozzle(s) extends into the thermally conductive porous material, and facilitates delivery of liquid coolant onto the surface to be cooled. The thermally conductive porous material is in thermal contact with the surface to be cooled and facilitates cooling of the electronic device by boiling of the liquid coolant passing through the porous material.

摘要翻译： 提供冷却装置和制造方法以便于电子装置的冷却。 冷却装置包括导热多孔材料和液体冷却剂供应。 导热多孔材料（例如金属泡沫材料）被耦合到要冷却的电子设备的表面，或耦合到电子设备的结构。 液体冷却剂供应包括喷射冲击结构，其包括用于将液体冷却剂引导到要冷却的表面上的一个或多个喷嘴。 喷射喷嘴延伸到导热多孔材料中，并且有助于将液体冷却剂输送到待冷却的表面上。 导热多孔材料与要冷却的表面热接触，并且通过沸腾通过多孔材料的液体冷却剂来促进电子器件的冷却。