公开(公告)号：US20130133872A1

公开(公告)日：2013-05-30

申请号：US13305937

申请日：2011-11-29

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： G05D23/00 ,  G05D16/00

CPC分类号： H05K7/20281 ,  F24F3/14 ,  F24F11/30 ,  F24F2110/20 ,  F25B2600/13 ,  F25D17/02 ,  F25D31/002 ,  F25D2317/04131 ,  H05K7/20781 ,  H05K7/20836

摘要： A cooling apparatus and method are provided. The cooling apparatus includes a coolant-cooled heat exchanger for facilitating dissipation of heat generated within an electronics rack, and a coolant control apparatus. The coolant control apparatus includes at least one coolant recirculation conduit coupled in fluid communication between a facility coolant supply and return, wherein the facility coolant supply and return facilitate providing facility coolant to the heat exchanger. The control apparatus further includes a coolant pump(s) associated with the recirculation conduit(s) and a controller which monitors a temperature of facility coolant supplied to the heat exchanger, and redirects facility coolant, via the coolant recirculation conduit(s) and coolant pump(s), from the facility coolant return to the facility coolant supply to, at least in part, ensure that facility coolant supplied to the heat exchanger remains above a dew point temperature.

摘要翻译： 提供了一种冷却装置和方法。 冷却装置包括冷却剂冷却的热交换器，用于便于散发在电子机架内产生的热量和冷却剂控制装置。 冷却剂控制装置包括在设备冷却剂供应和返回之间流体连通地联接的至少一个冷却剂再循环管道，其中设备冷却剂供应和返回便于向热交换器提供设备冷却剂。 控制装置还包括与再循环管道相关联的冷却剂泵和控制器，其控制供应给热交换器的设备冷却剂的温度，并且经由冷却剂再循环管道和冷却剂重新定向设备冷却剂 泵从设备冷却剂返回到设备冷却剂供应，至少部分地确保供应到热交换器的设备冷却剂保持高于露点温度。

公开(公告)号：US20130098579A1

公开(公告)日：2013-04-25

申请号：US13280664

申请日：2011-10-25

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F28F9/00

CPC分类号： F28F9/00 ,  F25B1/00 ,  H05K7/20772 ,  H05K7/2079 ,  Y10T29/4935

摘要： A cooling unit is provided to facilitate cooling of coolant passing through a coolant loop. The cooling unit includes one or more heat rejection units and an elevated coolant tank. The heat rejection unit(s) rejects heat from coolant passing through the coolant loop to air passing across the heat rejection unit. The heat rejection unit(s) includes one or more heat exchange assemblies coupled to the coolant loop for at least a portion of coolant to pass through the one or more heat exchange assemblies. The elevated coolant tank, which is elevated above at least a portion of the coolant loop, is coupled in fluid communication with the one or more heat exchange assemblies of the heat rejection unit(s), and facilitates return of coolant to the coolant loop at a substantially constant pressure.

摘要翻译： 提供冷却单元以便于冷却通过冷却剂回路的冷却。 冷却单元包括一个或多个散热单元和升高的冷却剂箱。 散热单元将通过冷却剂回路的冷却剂的热量排除通过散热单元的空气。 散热单元包括联接到冷却剂回路的一个或多个热交换组件，用于至少一部分冷却剂通过一个或多个热交换组件。 在冷却剂回路的至少一部分上方升高的升高的冷却剂箱与散热单元的一个或多个热交换组件流体连通地联接，并且便于冷却剂返回到冷却剂回路 基本恒定的压力。

公开(公告)号：US20130094139A1

公开(公告)日：2013-04-18

申请号：US13271262

申请日：2011-10-12

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： G06F1/20 ,  H05K7/20

CPC分类号： H05K7/20627 ,  H05K7/20772 ,  H05K7/20836

摘要： A combined power and cooling apparatus is provided facilitating powering and cooling one or more electronics racks, which are distinct from the power and cooling apparatus. The power and cooling apparatus includes a frame, one or more bulk power assemblies associated with the frame, and one or more heat exchange assemblies associated with the frame. The one or more bulk power assemblies are configured to provide power to the one or more electronics racks, and the one or more heat exchange assemblies are configured to cool system coolant provided to the one or more electronics racks. Heat is transferred by the one or more heat exchange assemblies from the system coolant to a facility coolant. In operation, the power and cooling apparatus is coupled to provide both power and cooling to the one or more electronics racks.

摘要翻译： 提供了组合的动力和冷却装置，其有助于对与动力和冷却装置不同的一个或多个电子机架供电和冷却。 动力和冷却装置包括框架，与框架相关联的一个或多个主体动力组件以及与框架相关联的一个或多个热交换组件。 所述一个或多个主体动力组件被配置成向所述一个或多个电子机架提供动力，并且所述一个或多个热交换组件被配置为冷却提供给所述一个或多个电子机架的系统冷却剂。 热量由一个或多个热交换组件从系统冷却剂传送到设备冷却剂。 在操作中，电源和冷却装置被耦合以向一个或多个电子机架提供电力和冷却。

公开(公告)号：US20130091871A1

公开(公告)日：2013-04-18

申请号：US13271296

申请日：2011-10-12

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Evan G. COLGAN ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Evan G. COLGAN ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： B01D8/00

CPC分类号： B01D8/00 ,  B01D5/0039 ,  H05K7/20809

摘要： Apparatuses and methods are provided for facilitating cooling of an electronic component. The apparatus includes a vapor-compression refrigeration system. The vapor-compression refrigeration system includes an expansion component, an evaporator and a compressor coupled in fluid communication via a refrigerant flow path. The evaporator is coupled to and cools the electronic component. The apparatus further includes a contaminant cold trap coupled in fluid communication with the refrigerant flow path. The cold trap includes a refrigerant cold filter and a coolant-cooled structure. At least a portion of refrigerant passing through the refrigerant flow path passes through the refrigerant cold filter, and the coolant-cooled structure provides cooling to the refrigerant cold filter to cool refrigerant passing through the filter. By cooling refrigerant passing through the filter, contaminants solidify from the refrigerant, and are deposited in the refrigerant cold filter.

摘要翻译： 提供了便于冷却电子部件的装置和方法。 该装置包括蒸气压缩制冷系统。 蒸气压缩式制冷系统包括经由制冷剂流动路径流体连通的膨胀部件，蒸发器和压缩机。 蒸发器与电子部件联接并冷却。 该装置还包括耦合成与制冷剂流动路径流体连通的污染物冷阱。 冷阱包括制冷剂冷却过滤器和冷却剂冷却结构。 通过制冷剂流路的制冷剂的至少一部分通过制冷剂冷滤器，冷却剂冷却结构向制冷剂冷滤器提供冷却，以冷却通过过滤器的制冷剂。 通过冷却通过过滤器的制冷剂，污染物从制冷剂中固化，并沉积在制冷剂冷滤器中。

公开(公告)号：US20130027884A1

公开(公告)日：2013-01-31

申请号：US13189598

申请日：2011-07-25

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： H05K7/20 ,  F28D15/02

CPC分类号： H05K7/20818 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/2029 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20809

摘要： A cooling apparatus and method are provided for cooling one or more electronic components of an electronic subsystem of an electronics rack. The cooling apparatus includes a heat sink, which is configured to couple to an electronic component, and which includes a coolant-carrying channel for coolant to flow therethrough. The coolant provides two-phase cooling to the electronic component, and is discharged from the heat sink as coolant exhaust which comprises coolant vapor to be condensed. The cooling apparatus further includes a node-level condensation module, associated with the electronic subsystem, and coupled in fluid communication with the heat sink to receive the coolant exhaust from the heat sink. The condensation module is liquid-cooled, and facilitates condensing of the coolant vapor in the coolant exhaust. A controller automatically controls the liquid-cooling of the heat sink and/or the liquid-cooling of the node-level condensation module.

摘要翻译： 提供冷却装置和方法来冷却电子机架的电子子系统的一个或多个电子部件。 冷却装置包括散热器，其被配置为耦合到电子部件，并且其包括用于冷却剂流过其中的冷却剂输送通道。 冷却剂为电子部件提供两相冷却，并且作为包括要冷凝的冷却剂蒸汽的冷却剂排出物从散热器排出。 冷却装置还包括与电子子系统相关联的节点级冷凝模块，并且与散热器流体连通地耦合以接收来自散热器的冷却剂排出物。 冷凝模块是液体冷却的，并且便于冷却剂排气中的冷却剂蒸气的冷凝。 控制器自动控制散热器的液体冷却和/或节点级冷凝模块的液冷。

公开(公告)号：US20130021746A1

公开(公告)日：2013-01-24

申请号：US13187563

申请日：2011-07-21

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： H05K7/20 ,  F28D15/00

CPC分类号： H05K7/20145 ,  F28D1/0477 ,  H05K7/203 ,  H05K7/20318 ,  H05K7/20772 ,  H05K7/20781 ,  H05K7/2079 ,  H05K7/20827 ,  H05K7/20836

摘要： A cooling apparatus and method are provided for cooling an electronics rack. The cooling apparatus includes an air-cooled cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronics rack, and includes a liquid-cooled condenser facilitating immersion-cooling of electronic components of the electronics rack, a liquid-cooled structure providing conductive cooling to electronic components of the electronics rack, or an air-to-liquid heat exchanger associated with the rack and cooling airflow passing through the electronics rack. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger. In operation, heat is transferred via circulating coolant from the electronics rack, and rejected in the liquid-to-air heat exchanger of the cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.

公开(公告)号：US20120111037A1

公开(公告)日：2012-05-10

申请号：US12939552

申请日：2010-11-04

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F25B1/00 ,  F25B29/00 ,  F25D31/00 ,  F25D15/00

CPC分类号： F25B49/02 ,  F25B2400/01 ,  F25B2500/28 ,  H05K7/20809 ,  H05K7/20836

摘要： Apparatus and method are provided for cooling an electronic component. The apparatus includes a refrigerant evaporator in thermal communication with the component(s) to be cooled, and a refrigerant loop coupled in fluid communication with the evaporator for facilitating flow of refrigerant through the evaporator. The apparatus further includes a compressor in fluid communication with the refrigerant loop, a refrigerant bypass pipe coupled to the refrigerant loop in parallel fluid communication with the evaporator, and a control valve for controlling refrigerant flow through the evaporator. The control valve is controlled to maintain temperature of the component(s) within a specified temperature range. The apparatus further includes a controllable refrigerant heater associated with the refrigerant bypass pipe for providing an adjustable heat load on refrigerant in the bypass pipe to ensure that refrigerant entering the compressor is in a superheated thermodynamic state.

摘要翻译： 提供了用于冷却电子部件的装置和方法。 该装置包括与要冷却的部件热连通的制冷剂蒸发器和与蒸发器流体连通的制冷剂回路，以便于制冷剂流过蒸发器。 该装置还包括与该制冷剂回路流体连通的压缩机，与该蒸发器并联流体连通的联接到制冷剂回路的制冷剂旁路管，以及用于控制通过蒸发器的制冷剂流动的控制阀。 控制阀被控制以将部件的温度保持在规定的温度范围内。 该装置还包括与制冷剂旁通管相关联的可控制冷剂加热器，用于在旁通管中的制冷剂上提供可调节的热负荷，以确保进入压缩机的制冷剂处于过热的热力学状态。

公开(公告)号：US20120111036A1

公开(公告)日：2012-05-10

申请号：US12939535

申请日：2010-11-04

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F25B1/00 ,  F25D17/02 ,  F25D31/00 ,  F25B43/00

CPC分类号： F25B49/02 ,  F25B25/005 ,  F25B2400/01 ,  F25B2400/24 ,  F25B2600/0251 ,  F28D20/021 ,  F28D2020/0008 ,  H05K7/20809 ,  Y02E60/145

摘要： Apparatus and method are provided for cooling an electronic component(s). The apparatus includes a coolant-cooled structure in thermal communication with the component(s) to be cooled, and a coolant-to-refrigerant heat exchanger in fluid communication with the coolant-cooled structure via a coolant loop. A thermal buffer unit is coupled in fluid communication with the coolant loop, and a refrigerant loop is coupled in fluid communication with the heat exchanger. The heat exchanger dissipates heat from coolant in the coolant loop to refrigerant in the refrigerant loop. A compressor is coupled in fluid communication with the refrigerant loop and is maintained ON responsive to heat load of the component(s) exceeding a heat load threshold, and is cycled ON and OFF responsive to heat load of the component(s) being below the threshold. The thermal storage unit dampens swings in coolant temperature within the coolant loop during cycling ON and OFF of the compressor.

摘要翻译： 提供了用于冷却电子部件的装置和方法。 该装置包括与要冷却的部件热连通的冷却剂冷却结构，以及通过冷却剂回路与冷却剂冷却结构流体连通的冷却剂 - 制冷剂热交换器。 热缓冲单元与冷却剂回路流体连通地联接，并且制冷剂回路与热交换器流体连通地联接。 热交换器将冷却剂回路中的冷却剂的热量散发到制冷剂回路中的制冷剂。 压缩机与制冷剂回路流体连通地联接，并且响应于超过热负荷阈值的部件的热负荷而保持接通，并响应于部件的热负荷而循环接通和断开 阈。 在循环打开和关闭压缩机期间，热存储单元会抑制冷却液回路内冷却液温度的波动。

公开(公告)号：US20120111034A1

公开(公告)日：2012-05-10

申请号：US12939541

申请日：2010-11-04

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F25B41/00 ,  F24H1/10 ,  F25D31/00

CPC分类号： F25B25/005 ,  F24D2200/123 ,  F24D2200/29 ,  F25B49/02 ,  F25B2400/01 ,  F25B2500/28 ,  F25B2700/21171 ,  H05K7/20809 ,  H05K7/20836 ,  Y02B10/70

摘要： A heat exchange assembly and apparatus and method employing the heat exchange assembly are provided. The heat exchange assembly includes a coolant-to-refrigerant heat exchanger and a heater. The heat exchanger includes a coolant inlet and a coolant outlet for passing a coolant through the heat exchanger, and a refrigerant inlet and a refrigerant outlet for separately passing a refrigerant through the heat exchanger. The heat exchanger cools coolant passing through the heat exchanger by dissipating heat from coolant passing through the heat exchanger to refrigerant passing through the heat exchanger. The heater is integrated with the heat exchanger and applies an auxiliary heat load to refrigerant passing through the heat exchanger to facilitate ensuring that refrigerant passing through the heat exchanger absorbs at least a specified minimum heat load, for example, to ensure that refrigerant egressing from the refrigerant outlet of the heat exchanger is superheated vapor refrigerant.

摘要翻译： 提供了一种使用热交换组件的热交换组件和设备和方法。 热交换组件包括冷却剂 - 制冷剂热交换器和加热器。 热交换器包括用于使冷却剂通过热交换器的冷却剂入口和冷却剂出口，以及用于使制冷剂分开地通过热交换器的制冷剂入口和制冷剂出口。 热交换器通过将通过热交换器的冷却剂的热量散发通过热交换器的制冷剂来冷却通过热交换器的冷却剂。 加热器与热交换器集成，并对通过热交换器的制冷剂施加辅助热负荷，以便确保通过热交换器的制冷剂至少吸收特定的最小热负荷，以确保制冷剂从 热交换器的制冷剂出口是过热蒸气制冷剂。

公开(公告)号：US20110315353A1

公开(公告)日：2011-12-29

申请号：US12825745

申请日：2010-06-29

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F28D15/00 ,  F25B41/00

CPC分类号： H05K7/20809

摘要： Liquid-cooled electronics racks are provided which include: immersion-cooled electronic subsystems; a vertically-oriented, vapor-condensing unit facilitating condensing dielectric fluid vapor egressing from the immersion-cooled subsystems, the vertically-oriented, vapor-condensing unit being sized and configured to reside adjacent to at least one side of the electronics rack; a reservoir for holding dielectric fluid, the reservoir receiving dielectric fluid condensate from the vertically-oriented, vapor-condensing unit; a dielectric fluid supply manifold coupling in fluid communication the reservoir and the dielectric fluid inlets of the immersion-cooled electronic subsystems; and a pump associated with a reservoir for pumping under pressure dielectric fluid from the reservoir to the dielectric fluid supply manifold for maintaining dielectric fluid in a liquid state within the immersion-cooled electronic subsystems.

摘要翻译： 提供液冷电子机架，包括：浸入式冷却电子子系统; 垂直取向的蒸气冷凝单元，其有助于冷凝来自浸没冷却子系统的介电流体蒸汽，所述垂直取向的蒸汽冷凝单元的尺寸和构造为邻近电子机架的至少一侧驻留; 用于保持介电流体的储存器，所述储存器从垂直取向的蒸汽冷凝单元接收介质流体冷凝物; 介质流体供应歧管联接以使浸没冷却的电子子系统的储存器和电介质流体入口流体连通; 以及与储存器相关联的泵，用于在压力介质流体下从介质流体供应歧管压力介质流体，用于将浸没冷却的电子子系统内的介质流体保持在液态。