Abstract:
Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, portions of the rivet structures extend through the movable layer and contact underlying layers. In other embodiments, the material used to form the rigid support structures may also be used to passivate otherwise exposed electrical leads in electrical connection with the MEMS devices, protecting the electrical leads from damage or other interference.
Abstract:
A package structure and method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator.
Abstract:
A package structure and method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator.
Abstract:
The width and location of a hysteresis window of an interferometric modulator may be altered by adjusting various physical characteristics of the interferometric modulator. Thus, depending on the particular application for which the interferometric modulators are manufactured, the width and location of the hysteresis window may be altered. For example, in some applications, reducing the power required to operate an array of interferometric modulators may be an important consideration. In other applications, the speed of the interferometric modulators may be of more importance, where the speed of an interferometric modulator, as used herein, refers to the speed of actuating and relaxing the moveable mirror. In other applications, the cost and ease of manufacturing may be of most importance. Systems and methods are introduced that allow selection of a width and location of a hysteresis window by adjusting various physical characteristics.
Abstract:
An interferometric modulator is provided having a faster deformation time constant on actuation than relaxation time constant upon release from actuation. In some embodiments, apertures are formed in a mechanical membrane to decrease pressure, including liquid and/or gas pressures, on the membrane when actuated. In other embodiments, a dampening layer is disposed in close proximity above the membrane to apply greater downward pressure on the membrane and therefore slow the motion of the membrane when released from an actuated state. Other embodiments comprise structures, such as a heating element or vacuum device, to manipulate pressures above and/or below the mechanical membrane to affect the mechanical persistence of the display device.
Abstract:
Embodiments of exemplary MEMS interferometric modulators are arranged at intersections of rows and columns of electrodes. In certain embodiments, the column electrode has a lower electrical resistance than the row electrode. A driving circuit applies a potential difference of a first polarity across electrodes during a first phase and then quickly transition to applying a bias voltage having a polarity opposite to the first polarity during a second phase. In certain embodiments, an absolute value of the difference between the voltages applied to the row electrode is less than an absolute value of the difference between the voltages applied to the column electrode during the first and second phases.
Abstract:
A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate includes a curved portion relative to the substrate. The curved portion is substantially throughout the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.
Abstract:
MEMS switches are formed with membranes or layers that are deformable upon the application of a voltage. In some embodiments, the application of a voltage opens switch contacts.
Abstract:
Charge balanced display data writing systems, apparatuses, and methods use write and hold cycles of opposite polarity during selected frame update periods. A release cycle may be provided to reduce the chance that a given display element will become stuck in an actuated state.
Abstract:
Disclosed are apparatus and methods for fabricating a static interferometric display device. A plurality of sputtering modules is used to form static interferometric elements on a substrate. These elements each have a plurality of interferometric sub-elements that each has an interferometric stack. A first sub-element of each element is formed so that an interferometric modulation of light due to the first element's stack transmits at a first color, and a second sub-element of each element is formed so that a second color is transmitted. The sub-elements of each element are arranged with respect to each other so that all of the elements appear as a third color to a user if all the sub-elements of each element are left unmasked. A printing system is then used to mask one or more sub-elements of one or more elements so as to form, with the elements, a static image having multiple colors.