Abstract:
A display assembly is provided which includes a housing for an electronic display and a thermal management substructure. The thermal management substructure is located rearward of the electronic display and includes multiple components, which are secured to one another by a plurality of deposits of structural adhesive. Methods of manufacturing the thermal management substructure are also provided where structural adhesive is deposited between components of the thermal management substructure.
Abstract:
An electronic image assembly cooling system includes an enclosure having an electronic image assembly mounting space located therein. A closed loop gas circulation path and an open loop air flow path are provided to effectuate cooling. A common heat exchanger is located in gaseous communication with both the closed loop gas circulation path and the open loop air flow path. The closed loop gas circulation path encircles the electronic image assembly mounting space within the enclosure, while the open loop ambient air flow path facilitates removal of heat from gas circulating within the closed loop gas circulation path. A second open loop air flow path may pass through the enclosure and through a gap located rearward of the electronic image assembly mounting space to assist with heat removal when an electronic image assembly is mounted in the enclosure.
Abstract:
An electronic image assembly cooling system includes an enclosure having an electronic image assembly mounting space located therein. A closed loop gas circulation path and an open loop air flow path are provided to effectuate cooling. A common heat exchanger is located in gaseous communication with both the closed loop gas circulation path and the open loop air flow path. The closed loop gas circulation path encircles the electronic image assembly mounting space within the enclosure, while the open loop ambient air flow path facilitates removal of heat from gas circulating within the closed loop gas circulation path. A second open loop air flow path may pass through the enclosure and through a gap located rearward of the electronic image assembly mounting space to assist with heat removal when an electronic image assembly is mounted in the enclosure.
Abstract:
An electronic display assembly having forced-air cooling. A thermally conductive plate or a thermally conductive backlight surface is located behind an electronic display of the electronic display assembly and within a housing thereof such that a gap is formed between the plate or backlight surface and an adjacent wall of the housing. External cooling air may be caused to flow in a top-to-bottom direction through the gap in order to remove heat from the electronic display that has been conductively transferred to the gap. A plurality of ribs may be placed within the gap and in thermal communication with the electronic display to enhance the conductive transfer of heat from the electronic display.
Abstract:
An electronic display assembly having forced-air cooling. A thermally conductive plate or a thermally conductive backlight surface is located behind an electronic display of the electronic display assembly and within a housing thereof such that a gap is formed between the plate or backlight surface and an adjacent wall of the housing. External cooling air may be caused to flow in a top-to-bottom direction through the gap in order to remove heat from the electronic display that has been conductively transferred to the gap. A plurality of ribs may be placed within the gap and in thermal communication with the electronic display to enhance the conductive transfer of heat from the electronic display.
Abstract:
An electronic display which can be mounted above a paved surface in an outdoor environment. A surface or plate is placed behind the electronic display to define a gap where cooling air can be drawn through said gap in order to cool the electronic display. A plurality of ribs may be placed within the gap and in thermal communication with the electronic display. The density of the ribs may be varied according to the inlet and exhaust openings for the cooling air. The ribs may be placed at a higher density near the exhaust to account for the increase in temperature of the cooling air as it travels through the gap.
Abstract:
An apparatus for cooling an electronic image assembly with ambient gas and circulating gas is disclosed. A first fan may be positioned to force the circulating gas around the electronic image assembly in a closed loop while a second fan may be positioned to cause a flow of ambient gas. A structure is preferably positioned to allow the circulating gas to cross the flow of the ambient gas while substantially prohibiting the circulating gas from mixing with the ambient gas. A pair of manifolds may be placed along the sides of the electronic image assembly and may be in gaseous communication with a plurality of channels placed behind the electronic image assembly. A heat exchanger may be used in some exemplary embodiments.
Abstract:
Exemplary embodiments provide an electronic display assembly. One or more heat-generating components are preferably placed in thermal communication with a plate. One or more fans are placed to draw cooling air along the plate to remove the heat removed from the component. Some embodiments may place the plate behind the electronic image assembly, so that cooling air can remove heat from the plate as well as the electronic image assembly. Exemplary embodiments have power modules in thermal communication with optional conductive ribs. Conductive thermal communication is established between the optional ribs and the components in the exemplary embodiments.
Abstract:
A system for cooling various components of an electronic display. One or more heat-generating components are preferably placed in thermal communication with a plate and ribs. One or more fans are placed to draw cooling air along the ribs to remove the heat removed from the component. Some embodiments may place the electronic image assembly in thermal communication with the ribs to remove heat from the electronic image assembly. Exemplary embodiments have power modules and the electronic image assembly in thermal communication with the ribs. Conductive thermal communication is established between the ribs and the components in the exemplary embodiments.
Abstract:
A system for cooling an electronic image assembly using a heat exchanger with an internal fan assembly. Circulating gas may also be used to cool a front portion of the electronic image assembly or any other internal cavity of the electronic display housing. The circulating gas may be drawn through a heat exchanger so that heat may be transferred to an ambient gas. The heat exchanger may have an internal fan assembly for drawing ambient air through the heat exchanger and exhausting it out of the display housing. The heat exchanger may be divided into two portions so that the fan assembly is placed between the two portions.