公开(公告)号：US20110030998A1

公开(公告)日：2011-02-10

申请号：US12849896

申请日：2010-08-04

申请人： Masaki Mizutani ,  Toshikazu Baba ,  Yoshihiro Kawamura

发明人： Masaki Mizutani ,  Toshikazu Baba ,  Yoshihiro Kawamura

IPC分类号： H05K1/00 ,  G03F7/004 ,  G03F7/20

CPC分类号： G03F7/032 ,  G03F7/033 ,  H05K1/0393 ,  H05K3/287

摘要： A halogen-free and flame-resistant photosensitive resin composition is provided, which has properties necessary for a solder resist (insulative property, solder heat resistance, alkali developability and the like) and is capable of forming a film that is excellent in folding endurance even after an IR reflow process. A flexible circuit board employing the photosensitive resin composition and a circuit board production method are also provided. The photosensitive resin composition comprises: (A) a linear polymer of an ethylenically unsaturated compound comprising a carboxyl-containing ethylenically unsaturated compound; (B) an epoxy resin; (C) a polymerizable compound containing an ethylenically unsaturated group; (D) a photopolymerization initiator; and a cyclic phosphazene (E) represented by the following general formula (1):

摘要翻译： 提供了一种无卤阻燃感光性树脂组合物，其具有阻焊剂所需的性质（绝缘性，焊料耐热性，碱显影性等），并且能够形成耐折性优异的膜 经过IR回流处理。 还提供了采用光敏树脂组合物的柔性电路板和电路板的制造方法。 感光性树脂组合物包含：（A）包含含羧基的烯属不饱和化合物的烯属不饱和化合物的线性聚合物; （B）环氧树脂; （C）含有烯属不饱和基团的聚合性化合物; （D）光聚合引发剂; 和由以下通式（1）表示的环状磷腈（E）：

公开(公告)号：US20060219554A1

公开(公告)日：2006-10-05

申请号：US11392574

申请日：2006-03-30

申请人： Shigeki Mori ,  Masaki Mizutani ,  Akinori Kojima ,  Shigeo Kondo

发明人： Shigeki Mori ,  Masaki Mizutani ,  Akinori Kojima ,  Shigeo Kondo

IPC分类号： G01N27/28

CPC分类号： G01N27/4071 ,  Y10T156/107

摘要： A method for manufacturing a gas sensor element (300), which includes a plate-like second solid electrolyte member (109), a fourth electrode (110) formed on the second solid electrolyte member (109), and a protection layer (111) including a reinforcement member (112) having an insertion hole (112a), and a porous electrode protection member (113a) provided in the insertion hole (112) and adapted to protect the fourth electrode (110) from becoming poisoned. The method includes a pressing step of, after disposing a green electrode protection member (113a) in the insertion hole (112a) of a green reinforcement member (112), pressing at least one of the green reinforcement member (112) and the green electrode protection member (113a) so as to form a green protection layer (111); a laminate-forming step of arranging the green protection layer (111) and a green solid electrolyte member (113a) in layers so as to form a laminate which will become the gas sensor element (300) after being fired; and a firing step of firing the laminate.

摘要翻译： 一种制造气体传感器元件（300）的方法，其包括板状第二固体电解质部件（109），形成在第二固体电解质部件（109）上的第四电极（110）和保护层（111） 包括具有插入孔（112a）的加强构件（112）和设置在所述插入孔（112）中并适于保护所述第四电极（110）不被中毒的多孔电极保护构件（113a）。 该方法包括按压步骤，在绿色加强部件（112）的插入孔（112a）中设置绿色电极保护部件（113a）之后，按压至少一个绿色加强部件（112）和 绿色电极保护构件（113a），以形成绿色保护层（111）; 层叠形成工序，将绿色保护层（111）和绿色固体电解质构件（113a）分层配置，形成在烧成后成为气体传感元件（300）的层压体; 以及焙烧步骤。

公开(公告)号：US20050046042A1

公开(公告)日：2005-03-03

申请号：US10678855

申请日：2003-10-03

申请人： Takeshi Matsumura ,  Masaki Mizutani

发明人： Takeshi Matsumura ,  Masaki Mizutani

IPC分类号： H01L21/78 ,  C09J5/00 ,  H01L21/301 ,  H01L21/58 ,  H01L21/68 ,  H01L21/46 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L24/29 ,  C09J7/20 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/3025 ,  Y10T428/218 ,  Y10T428/28 ,  Y10T428/2848 ,  H01L2924/00 ,  H01L2924/3512

摘要： A dicing/die-bonding film including a pressure-sensitive adhesive layer (2) on a supporting base material (1) and a die-bonding adhesive layer (3) on the pressure-sensitive adhesive layer (2), wherein a releasability in an interface between the pressure-sensitive adhesive layer (2) and the die-bonding adhesive layer (3) is different between an interface (A) corresponding to a work-attaching region (3a) in the die-bonding adhesive layer (3) and an interface (B) corresponding to a part or a whole of the other region (3b), and the releasability of the interface (A) is higher than the releasability of the interface (B). The dicing/die-bonding film is excellent in balance between retention in dicing a work and releasability in releasing its diced chipped work together with the die-bonding adhesive layer.

摘要翻译： 一种在支撑基材（1）上具有压敏粘合剂层（2）和压敏粘合剂层（2）上的芯片粘合层（3）的切割/芯片接合膜，其中， 粘合剂层（2）与芯片粘合层（3）之间的界面在与芯片粘合层（3）中的工件附着区域（3a）相对应的界面（A）之间是不同的， 以及对应于另一区域（3b）的一部分或全部的界面（B），并且界面（A）的释放性高于界面（B）的剥离性。 切割/芯片接合膜在切割工件的保持性和脱模性之间的平衡优异，并且与芯片粘合层一起释放切割的切片工作。

公开(公告)号：US08656756B2

公开(公告)日：2014-02-25

申请号：US12253265

申请日：2008-10-17

申请人： Masaki Mizutani ,  Shigeki Mori

发明人： Masaki Mizutani ,  Shigeki Mori

IPC分类号： G01N7/00

CPC分类号： G01N27/4077

摘要： A gas sensor including a metal shell; a detection element main body held by the metal shell; a porous protection layer coated on a leading end portion of the detection element main body; and a protector including a side wall surrounding an element protruding portion of the detection element main body protruding from a leading end of the metal shell. The side wall has introduction holes formed therein which allow gas to be introduced. The porous protection layer includes a first portion; and a second portion provided on a base end side with respect to the first portion and having a progressively reduced thickness in a direction toward a leading end of the detection element. The second portion is disposed closer to the base end of the detection element than the introduction holes in the axial direction.

摘要翻译： 一种包括金属壳的气体传感器; 由所述金属壳保持的检测元件主体; 涂覆在检测元件主体的前端部的多孔保护层; 以及保护器，包括围绕从金属壳的前端突出的检测元件主体的元件突出部分的侧壁。 侧壁上形成有引入气体的引入孔。 多孔保护层包括第一部分; 以及第二部分，其相对于所述第一部分设置在基端侧，并且在朝向所述检测元件的前端的方向上具有逐渐减小的厚度。 第二部分比轴向上的导入孔更靠近检测元件的基端。

公开(公告)号：US08586415B2

公开(公告)日：2013-11-19

申请号：US13326106

申请日：2011-12-14

申请人： Takeshi Matsumura ,  Masaki Mizutani

发明人： Takeshi Matsumura ,  Masaki Mizutani

IPC分类号： H01L21/00

CPC分类号： H01L24/29 ,  C09J7/20 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/3025 ,  Y10T428/218 ,  Y10T428/28 ,  Y10T428/2848 ,  H01L2924/00 ,  H01L2924/3512

摘要： A dicing/die-bonding film including a pressure-sensitive adhesive layer (2) on a supporting base material (1) and a die-bonding adhesive layer (3) on the pressure-sensitive adhesive layer (2), wherein a releasability in an interface between the pressure-sensitive adhesive layer (2) and the die-bonding adhesive layer (3) is different between an interface (A) corresponding to a work-attaching region (3a) in the die-bonding adhesive layer (3) and an interface (B) corresponding to a part or a whole of the other region (3b), and the releasability of the interface (A) is higher than the releasability of the interface (B). The dicing/die-bonding film is excellent in balance between retention in dicing a work and releasability in releasing its diced chipped work together with the die-bonding adhesive layer.

摘要翻译： 一种在支撑基材（1）上具有压敏粘合剂层（2）和压敏粘合剂层（2）上的芯片粘合层（3）的切割/芯片接合膜，其中， 粘合剂层（2）与芯片粘合层（3）之间的界面在与芯片粘合层（3）中的工件附着区域（3a）相对应的界面（A）之间是不同的， 以及对应于另一区域（3b）的一部分或全部的界面（B），并且界面（A）的释放性高于界面（B）的剥离性。 切割/芯片接合膜在切割工件的保持性和脱模性之间的平衡优异，并且与芯片粘合层一起释放切割的切片工作。

公开(公告)号：US08304341B2

公开(公告)日：2012-11-06

申请号：US12983821

申请日：2011-01-03

申请人： Takeshi Matsumura ,  Masaki Mizutani ,  Sadahito Misumi

发明人： Takeshi Matsumura ,  Masaki Mizutani ,  Sadahito Misumi

IPC分类号： H01L21/4763

CPC分类号： H01L21/6836 ,  C09J7/20 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  H01L24/27 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/3512

摘要： The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer (2) on a substrate material (1) and a die-bonding adhesive layer (3) on the pressure-sensitive adhesive layer (2), wherein the adhesion of the pressure-sensitive adhesive layer (2) to the die-bonding adhesive layer (3), as determined under the conditions of a peel angle of 15° and a peel point moving rate of 2.5 mm/sec. at 23° C., is different between a region (2a) corresponding to a work attachment region (3a) and a region (2b) corresponding to a part or the whole of the other region (3b), in the die-bonding adhesive layer (3), and satisfies the following relationship: adhesion of the pressure-sensitive adhesive layer (2a)

摘要翻译： 本发明涉及一种在基材（1）上具有压敏粘合剂层（2）和压敏粘合剂层（2）上的芯片粘合层（3）的切割芯片接合膜，其中 在剥离角度为15°，剥离移动速度为2.5mm / sec的条件下测定粘合剂层（2）与芯片粘接层（3）的粘合性。 在相对于工件附着区域（3a）的区域（2a）和与其他区域（3b）的一部分或全部对应的区域（2b）在23℃下不同，在芯片接合粘合剂 层（3），并且满足以下关系：粘合剂层（2a）的粘合性<粘合剂层（2b）的粘合性和粘合剂层（2a）对粘合剂层 芯片粘合层（3）不高于2.3N / 25mm。

公开(公告)号：US20120067626A1

公开(公告)日：2012-03-22

申请号：US13207045

申请日：2011-08-10

申请人： Masaki Mizutani

发明人： Masaki Mizutani

IPC分类号： H05K1/02 ,  G03F7/038

CPC分类号： G11B5/486 ,  G03F7/0045 ,  G03F7/038 ,  G11B5/4833 ,  G11B5/484 ,  H05K1/056 ,  H05K3/287

摘要： A photosensitive resin composition contains a component (A) and at least one of a component (B) and a component (C). In addition, in the circuit board with metal support including: a metal support; a base insulating layer; a conductive layer formed of a wiring circuit pattern; and a cover insulating layer, at least one of the above-mentioned base insulating layer and cover insulating layer is made of the above-mentioned photosensitive resin composition. (A) a 1,4-dihydropyridine derivative represented by the following general formula (1) where R1 represents an alkyl group having 1 to 3 carbon atoms; and R2 and R3 each represent a hydrogen atom or an alkyl group having 1 or 2 carbon atoms and may be identical to or different from each other; (B) the following (x) and (y): (x) a carboxyl group-containing linear polymer; and (y) an epoxy resin (c) a linear polymer having a carboxyl group and an epoxy group

摘要翻译： 感光性树脂组合物含有成分（A）和成分（B）和成分（C）中的至少一种。 此外，在具有金属支撑的电路板中，包括：金属支架; 基底绝缘层; 由布线电路图形成的导电层; 以及覆盖绝缘层，上述基底绝缘层和覆盖绝缘层中的至少一个由上述感光性树脂组合物构成。 （A）由以下通式（1）表示的1,4-二氢吡啶衍生物，其中R 1表示具有1至3个碳原子的烷基; 并且R 2和R 3各自表示氢原子或具有1或2个碳原子的烷基，并且可以彼此相同或不同; （B）以下（x）和（y）：（x）含羧基的线性聚合物; 和（y）环氧树脂（c）具有羧基和环氧基的线性聚合物

公开(公告)号：US08080143B2

公开(公告)日：2011-12-20

申请号：US11392574

申请日：2006-03-30

申请人： Shigeki Mori ,  Masaki Mizutani ,  Akinori Kojima ,  Shigeo Kondo

发明人： Shigeki Mori ,  Masaki Mizutani ,  Akinori Kojima ,  Shigeo Kondo

IPC分类号： G01N27/407 ,  G01N27/409

CPC分类号： G01N27/4071 ,  Y10T156/107

摘要： A method for manufacturing a gas sensor element (300), which includes a plate-like second solid electrolyte member (109), a fourth electrode (110) formed on the second solid electrolyte member (109), and a protection layer (111) including a reinforcement member (112) having an insertion hole (112a), and a porous electrode protection member (113a) provided in the insertion hole (112) and adapted to protect the fourth electrode (110) from becoming poisoned. The method includes a pressing step of, after disposing a green electrode protection member (113a) in the insertion hole (112a) of a green reinforcement member (112), pressing at least one of the green reinforcement member (112) and the green electrode protection member (113a) so as to form a green protection layer (111); a laminate-forming step of arranging the green protection layer (111) and a green solid electrolyte member (113a) in layers so as to form a laminate which will become the gas sensor element (300) after being fired; and a firing step of firing the laminate.

摘要翻译： 一种制造气体传感器元件（300）的方法，其包括板状第二固体电解质部件（109），形成在第二固体电解质部件（109）上的第四电极（110）和保护层（111） 包括具有插入孔（112a）的加强构件（112）和设置在插入孔（112）中并适于保护第四电极（110）不被中毒的多孔电极保护构件（113a）。 该方法包括按压步骤，在绿色加强部件（112）的插入孔（112a）中设置绿色电极保护部件（113a）之后，按压至少一个绿色加强部件（112）和绿色电极 保护构件（113a），以形成绿色保护层（111）; 层叠形成步骤，将绿色保护层（111）和绿色固体电解质构件（113a）分层布置，以形成在烧成之后成为气体传感器元件（300）的层压体; 以及焙烧步骤。

公开(公告)号：US20100270060A1

公开(公告)日：2010-10-28

申请号：US12766352

申请日：2010-04-23

申请人： Masaki Mizutani ,  Toshikazu Baba

发明人： Masaki Mizutani ,  Toshikazu Baba

IPC分类号： H05K1/00 ,  G03F7/004 ,  G03F7/20

CPC分类号： G03F7/033 ,  G03F7/032 ,  H05K1/0393 ,  H05K3/287

摘要： A photosensitive resin composition is provided, which has properties necessary for a solder resist (insulative property, solder heat resistance, alkali developability and the like) and is capable of forming a film that is excellent in folding endurance even after the IR reflow process. A flexible circuit board employing the photosensitive resin composition and a circuit board production method are also provided. The photosensitive resin composition comprises: (A) a linear polymer of an ethylenically unsaturated compound comprising a carboxyl-containing ethylenically unsaturated compound; (B) an epoxy resin; (C) a polymerizable compound containing an ethylenically unsaturated group; and (D) a photopolymerization initiator. The photosensitive resin composition has a tensile breaking elongation percentage of not less than 10% and a 2% weight loss temperature of not lower than 260° C. after being cured.

摘要翻译： 提供了具有阻焊剂所必需的性质（绝缘性，焊料耐热性，碱显影性等）的感光性树脂组合物，并且即使在IR回流工艺之后也能够形成耐折叠性优异的膜。 还提供了采用光敏树脂组合物的柔性电路板和电路板的制造方法。 感光性树脂组合物包含：（A）包含含羧基的烯属不饱和化合物的烯属不饱和化合物的线性聚合物; （B）环氧树脂; （C）含有烯属不饱和基团的聚合性化合物; 和（D）光聚合引发剂。 感光性树脂组合物在固化后的拉伸断裂伸长率为10％以上，2％重量减少温度为260℃以上。

公开(公告)号：US07780811B2

公开(公告)日：2010-08-24

申请号：US11671982

申请日：2007-02-06

申请人： Takeshi Matsumura ,  Masaki Mizutani ,  Sadahito Misumi

发明人： Takeshi Matsumura ,  Masaki Mizutani ,  Sadahito Misumi

IPC分类号： B29C65/50 ,  B29C65/52 ,  B29C65/56 ,  B32B37/04 ,  B32B37/10 ,  B32B37/12 ,  B32B37/14 ,  B32B37/26 ,  B32B38/10 ,  B29C65/02 ,  B32B37/06 ,  B32B37/18 ,  B32B37/28

CPC分类号： H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/3025 ,  Y10T156/1052 ,  Y10T156/1062 ,  Y10T156/107 ,  Y10T156/1077 ,  Y10T428/218 ,  Y10T428/31703 ,  H01L2924/00

摘要： The dicing die-bonding film of this invention comprises a pressure-sensitive adhesive layer (2) on a supporting base material (1) and a die-bonding adhesive layer (3) on the pressure-sensitive adhesive layer (2), wherein a releasability in an interface between the pressure-sensitive adhesive layer (2) and the die-bonding adhesive layer (3) is different between an interface (A) corresponding to a work-attaching region (3a) in the die-bonding adhesive layer (3) and an interface (B) corresponding to a part or the whole of the other region (3b), and the releasability of the interface (A) is higher than the releasability of the interface (B). According to this invention, there can be provided a dicing die-bonding film excellent in balance between retention in dicing a work and releasability in releasing its diced chipped work together with the die-bonding adhesive layer.

摘要翻译： 本发明的切割/芯片接合膜包括在支撑基材（1）上的压敏粘合剂层（2）和压敏粘合剂层（2）上的芯片粘合层（3），其中 在压敏粘合剂层（2）和芯片粘接层（3）之间的界面上的剥离性在与芯片粘合层中的工件附着区域（3a）相对应的界面（A） 3）和对应于另一区域（3b）的一部分或全部的界面（B），并且界面（A）的释放性高于界面（B）的释放性。 根据本发明，可以提供一种在切割工件时的保持性和与切断粘合剂层一起释放其切割的切屑作业的脱模性之间的平衡优异的切割芯片接合薄膜。