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    Probes with Multiple Springs, Methods for Making, and Methods for Using
    24.
    发明公开
    Probes with Multiple Springs, Methods for Making, and Methods for Using 审中-公开

    公开(公告)号：US20240085457A1

    公开(公告)日：2024-03-14

    申请号：US18518116

    申请日：2023-11-22

    Applicant: Microfabrica Inc.

    Inventor： Ming Ting Wu ,  Garret R. Smalley ,  Dennis R. Smalley

    IPC: G01R1/067

    CPC classification number: G01R1/06722

    Abstract: Embodiments are directed to probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays. In the various embodiments, probes include at least two springs separated by a movable stop while in other embodiments, three or more springs may be included with two or more movable stops. Movable stops interact with fixed stops that are either part of the probes themselves or part of separate elements that engage with the probes (such as array frame structures) that provide for the retention, longitudinal and/or lateral positioning of probes and possibly for orientation of the probes about a longitudinal axis. Fixed stops provide for controlled limits for movement of the movable stops which in turn allow for enhanced compliant or elastic performance of the probes upon increased probe compression in either one direction, in the order of tip compressions, or in both directions or tip compression orders (e.g. to provide one or more decreases in spring constant upon reaching one or more compression levels (or biasing force levels) with a given tip compression direction and/or order).

    Probes with multiple springs, methods for making, and methods for using
    25.
    发明授权
    Probes with multiple springs, methods for making, and methods for using 有权

    公开(公告)号：US11867721B1

    公开(公告)日：2024-01-09

    申请号：US17139936

    申请日：2020-12-31

    Applicant: Microfabrica Inc.

    Inventor： Ming Ting Wu ,  Garret R. Smalley ,  Dennis R. Smalley

    IPC: G01R1/067

    CPC classification number: G01R1/06722

    Abstract: Embodiments are directed to probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays. In the various embodiments, probes include at least two springs separated by a movable stop while in other embodiments, three or more springs may be included with two or more movable stops. Movable stops interact with fixed stops that are either part of the probes themselves or part of separate elements that engage with the probes (such as array frame structures) that provide for the retention, longitudinal and/or lateral positioning of probes and possibly for orientation of the probes about a longitudinal axis. Fixed stops provide for controlled limits for movement of the movable stops which in turn allow for enhanced compliant or elastic performance of the probes upon increased probe compression in either one direction, in the order of tip compressions, or in both directions or tip compression orders (e.g. to provide one or more decreases in spring constant upon reaching one or more compression levels (or biasing force levels) with a given tip compression direction and/or order).

    PROBES WITH PLANAR UNBIASED SPRING ELEMENTS FOR ELECTRONIC COMPONENT CONTACT, METHODS FOR MAKING SUCH PROBES, AND METHODS FOR USING SUCH PROBES
    26.
    发明公开
    PROBES WITH PLANAR UNBIASED SPRING ELEMENTS FOR ELECTRONIC COMPONENT CONTACT, METHODS FOR MAKING SUCH PROBES, AND METHODS FOR USING SUCH PROBES 审中-公开

    公开(公告)号：US20230358785A1

    公开(公告)日：2023-11-09

    申请号：US18295716

    申请日：2023-04-04

    Applicant: Microfabrica Inc.

    Inventor： Arun S. Veeramani ,  Ming Ting Wu ,  Dennis R. Smalley

    IPC: G01R1/067 ,  G01R1/073

    CPC classification number: G01R1/06722 ,  G01R1/06727 ,  G01R1/07314

    Abstract: Probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and an array plate mounting and retention configuration. The probes may comprise lower retention features that protrudes from a probe body with a size and configuration that limits the longitudinal extent to which the probes can be inserted into plate probe holes of an array plate and an upper retention feature having a lateral configuration that is sized to pass through the extension provided by the side wall feature of the plate probe hole when aligned and after longitudinally locating the upper retention feature above the extension, the retention feature undergoes displacement relative to the upper plate probe hole such that the upper retention feature can no longer longitudinally pass through the extension of the upper plate probe hole.

    PROBES WITH PLANAR UNBIASED SPRING ELEMENTS FOR ELECTRONIC COMPONENT CONTACT, METHODS FOR MAKING SUCH PROBES, AND METHODS FOR USING SUCH PROBES
    27.
    发明公开
    PROBES WITH PLANAR UNBIASED SPRING ELEMENTS FOR ELECTRONIC COMPONENT CONTACT, METHODS FOR MAKING SUCH PROBES, AND METHODS FOR USING SUCH PROBES 审中-公开

    公开(公告)号：US20230349947A1

    公开(公告)日：2023-11-02

    申请号：US18295728

    申请日：2023-04-04

    Applicant: Microfabrica Inc.

    Inventor： Arun S. Veeramani ,  Ming Ting Wu ,  Dennis R. Smalley

    IPC: G01R1/073 ,  G01R1/067

    CPC classification number: G01R1/06722 ,  G01R1/07314

    Abstract: Probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and an array plate mounting and retention configuration. The probes may comprise lower retention features that protrudes from a probe body with a size and configuration that limits the longitudinal extent to which the probes can be inserted into plate probe holes of a array plate and an upper retention feature comprising at least one tab-like feature extending laterally from the body of the probe at a level above and longitudinally spaced from the lower retention feature; and wherein after longitudinally locating the upper retention feature above the plate probe hole in the array plate, the upper retention feature undergoes lateral displacement such that the upper retention feature can no longer longitudinally pass through the plate probe hole in the array plate.

    PROBES WITH PLANAR UNBIASED SPRING ELEMENTS FOR ELECTRONIC COMPONENT CONTACT, METHODS FOR MAKING SUCH PROBES, AND METHODS FOR USING SUCH PROBES
    28.
    发明公开
    PROBES WITH PLANAR UNBIASED SPRING ELEMENTS FOR ELECTRONIC COMPONENT CONTACT, METHODS FOR MAKING SUCH PROBES, AND METHODS FOR USING SUCH PROBES 审中-公开

    公开(公告)号：US20230243871A1

    公开(公告)日：2023-08-03

    申请号：US18295721

    申请日：2023-04-04

    Applicant: Microfabrica Inc.

    Inventor： Arun S. Veeramani ,  Ming Ting Wu ,  Dennis R. Smalley

    IPC: G01R1/067 ,  G01R1/073

    CPC classification number: G01R1/06722 ,  G01R1/07307

    Abstract: Probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and an array plate mounting and retention configuration. The probes may comprise lower retention features that protrudes from a probe body with a size and configuration that limits the longitudinal extent to which the probes can be inserted into plate probe holes of an array plate and an upper retention feature comprising at least one laterally compressible spring element at a level above the lower retention feature that, in combination with the probe body, can be made to achieve a lateral configuration that is sized to pass through the hole and thereafter elastically return to a configuration that is incapable of passing through the hole so as to retain the probe and the array plate together.

    Multi-Layer, Multi-Material Micro-Scale and Millimeter-Scale Devices with Enhanced Electrical and/or Mechanical Properties
    30.
    发明申请
    Multi-Layer, Multi-Material Micro-Scale and Millimeter-Scale Devices with Enhanced Electrical and/or Mechanical Properties 有权
    具有增强的电气和/或机械性能的多层，多材料微尺度和毫米级装置

    公开(公告)号：US20140134453A1

    公开(公告)日：2014-05-15

    申请号：US14017535

    申请日：2013-09-04

    Applicant: Microfabrica Inc.

    Inventor： Ming Ting Wu ,  Rulon J. Larsen, III ,  Young Kim ,  Kieun Kim ,  Adam L. Cohen ,  Ananda H. Kumar ,  Michael S. Lockard ,  Dennis R. Smalley

    IPC: B32B15/01

    CPC classification number: G01R1/06761 ,  B32B15/01 ,  Y10T428/12486

    Abstract: Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that (1) partially coats the surface of the structure, (2) completely coats the surface of the structure, and/or (3) completely coats the surface of structural material of each layer from which the structure is formed including interlayer regions. These embodiments incorporate both the core material and the shell material into the structure as each layer is formed along with a sacrificial material that is removed after formation of all layers of the structure. In some embodiments the core material may be a material that would be removed with sacrificial material if it were accessible by an etchant during removal of the sacrificial material.

    Abstract translation: 本发明的一些实施方案涉及用于从核心材料和壳或涂层材料形成结构或器件（例如用于半导体器件的晶片级测试的微探针）的电化学制造方法，（1）部分地涂覆结构的表面 ，（2）完全涂覆结构的表面，和/或（3）完全涂覆包含中间层区域的结构形成的各层结构材料的表面。 这些实施例将芯材料和壳体材料结合到结构中，因为每个层与形成所述结构的所有层之后被去除的牺牲材料一起形成。 在一些实施例中，芯材料可以是如果在去除牺牲材料期间可通过蚀刻剂使用牺牲材料将其去除的材料。

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