Single crystal horizontal access device for vertical three-dimensional (3D) memory and method of forming 3D memory

    公开(公告)号:US11450693B2

    公开(公告)日:2022-09-20

    申请号:US17035856

    申请日:2020-09-29

    Abstract: Systems, methods and apparatus are provided for an array of vertically stacked memory cells having horizontally oriented access devices having a first source/drain region and a second source drain region separated by a channel region, and gates opposing the channel region, vertically oriented access lines coupled to the gates and separated from a channel region by a gate dielectric. The memory cells have epitaxially grow single crystal silicon to fill the first horizontal opening and house a first source/drain in electrical contact with a conductive material and to form part of an integral, horizontally oriented, conductive digit line. The memory cells also have horizontally oriented storage nodes coupled to the second source/drain region and horizontally oriented digit lines coupled to the first source/drain region. A vertical body contact is formed in direct electrical contact with a body region of one or more of the horizontally oriented access devices and separate from the first source/drain region and the horizontally oriented digit lines by a dielectric.

    VERTICAL DIGIT LINES FOR SEMICONDUCTOR DEVICES

    公开(公告)号:US20220130834A1

    公开(公告)日:2022-04-28

    申请号:US17079612

    申请日:2020-10-26

    Abstract: Systems, methods and apparatus are provided for an array of vertically stacked memory cells having horizontally oriented access devices and access lines and vertically oriented digit lines having a first source/drain region and a second source drain region separated by a channel region, and gates opposing the channel region formed fully around every surface of the channel region as gate all around (GAA) structures, horizontal oriented access lines coupled to the gates and separated from a channel region by a gate dielectric. The memory cells have horizontally oriented storage nodes coupled to the second source/drain region and vertically oriented digit lines coupled to the first source/drain regions. A vertical body contact is formed in direct electrical contact with a body region of one or more of the horizontally oriented access devices and separate from the first source/drain region and the vertically oriented digit lines by a dielectric.

    Digit line and body contact for semiconductor devices

    公开(公告)号:US11257821B1

    公开(公告)日:2022-02-22

    申请号:US16943494

    申请日:2020-07-30

    Inventor: Si-Woo Lee

    Abstract: Systems, methods and apparatus are provided for an array of vertically stacked memory cells having horizontally oriented access devices having a first source/drain region and a second source drain region separated by a channel region, and gates opposing the channel region, vertically oriented access lines coupled to the gates and separated from a channel region by a gate dielectric. The memory cells have horizontally oriented storage nodes coupled to the second source/drain region and horizontally oriented digit lines coupled to the first source/drain regions. A vertical body contact is formed in direct electrical contact with a body region of one or more of the horizontally oriented access devices and separate from the first source/drain region and the horizontally oriented digit lines by a dielectric.

    Underbody contact to horizontal access devices for vertical three-dimensional (3D) memory

    公开(公告)号:US11164872B1

    公开(公告)日:2021-11-02

    申请号:US16943163

    申请日:2020-07-30

    Abstract: Systems, methods and apparatus are provided for an array of vertically stacked memory cells having horizontally oriented access devices having a first source/drain region and a second source drain region separated by a channel region, and gates opposing the channel region, vertically oriented access lines coupled to the gates and separated from a channel region by a gate dielectric. The memory cells have horizontally oriented storage nodes coupled to the second source/drain region and horizontally oriented digit lines coupled to the first source/drain regions. An underbody conductive contact of a vertical body contact is formed in direct electrical contact with a body region of one or more of the horizontally oriented access devices and separate from the first source/drain region and the horizontally oriented digit lines by a dielectric.

    METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS

    公开(公告)号:US20210057418A1

    公开(公告)日:2021-02-25

    申请号:US16543799

    申请日:2019-08-19

    Abstract: A method of forming a microelectronic device comprises forming a spacer structure having a rectangular ring horizontal cross-sectional shape over a transistor, a portion of the spacer structure horizontally overlapping a drain region of the transistor. A masking structure is formed over the spacer structure and the transistor, the masking structure exhibiting an opening therein horizontally overlapping the drain region of the transistor and the portion of the spacer structure. A portion of an isolation structure overlying the drain region of the transistor is removed using the masking structure and the portion of the spacer structure as etching masks to form a trench vertically extending through the isolation structure to the drain region of the transistor. A drain contact structure is formed within the trench in the isolation structure. Microelectronic devices, memory devices, and electronic systems are also described.

    Integrated Assemblies Having Threshold-Voltage-Inducing-Structures Proximate Gated-Channel-Regions, and Methods of Forming Integrated Assemblies

    公开(公告)号:US20200258887A1

    公开(公告)日:2020-08-13

    申请号:US16862122

    申请日:2020-04-29

    Abstract: Some embodiments include an integrated assembly having an active-region-pillar extending upwardly from a base. The active-region-pillar includes a digit-line-contact-region between a first storage-element-contact-region and a second storage-element-contact-region. A threshold-voltage-inducing-structure is adjacent a lower portion of the active-region-pillar. A first channel region includes a first portion of the active-region-pillar between the digit-line-contact-region and the first storage-element-contact-region. A second channel region includes a second portion of the active-region-pillar between the digit-line-contact-region and the second storage-element-contact-region. A first wordline is adjacent the first portion of the active-region-pillar. A second wordline is adjacent the second portion of the active-region-pillar. A digit-line is coupled with the digit-line-contact-region. First and second storage-elements are coupled with the first and second storage-element-contact-regions. A voltage source is coupled with the threshold-voltage-inducing-structure to electrostatically induce a desired threshold voltage along the first and second channel regions.

    Integrated Assemblies Having Threshold-Voltage-Inducing-Structures Proximate Gated-Channel-Regions, and Methods of Forming Integrated Assemblies

    公开(公告)号:US20200227417A1

    公开(公告)日:2020-07-16

    申请号:US16248534

    申请日:2019-01-15

    Abstract: Some embodiments include an integrated assembly having an active-region-pillar extending upwardly from a base. The active-region-pillar includes a digit-line-contact-region between a first storage-element-contact-region and a second storage-element-contact-region. A threshold-voltage-inducing-structure is adjacent a lower portion of the active-region-pillar. A first channel region includes a first portion of the active-region-pillar between the digit-line-contact-region and the first storage-element-contact-region. A second channel region includes a second portion of the active-region-pillar between the digit-line-contact-region and the second storage-element-contact-region. A first wordline is adjacent the first portion of the active-region-pillar. A second wordline is adjacent the second portion of the active-region-pillar. A digit-line is coupled with the digit-line-contact-region. First and second storage-elements are coupled with the first and second storage-element-contact-regions. A voltage source is coupled with the threshold-voltage-inducing-structure to electrostatically induce a desired threshold voltage along the first and second channel regions.

    Apparatuses having memory strings compared to one another through a sense amplifier

    公开(公告)号:US10714167B2

    公开(公告)日:2020-07-14

    申请号:US16431500

    申请日:2019-06-04

    Abstract: Some embodiments include an apparatus having first and second comparative bitlines extending horizontally and coupled with a sense amplifier. First memory cell structures are coupled with the first comparative bitline. Each of the first memory cell structures has a first transistor associated with a first capacitor. Second memory cell structures are coupled with the second comparative bitline. Each of the second memory cell structures has a second transistor associated with a second capacitor. Each of the first capacitors has a container-shaped first node and is vertically offset from an associated first sister capacitor which is a mirror image of its associated first capacitor along a horizontal plane. Each of the second capacitors has a container-shaped first node and is vertically offset from an associated second sister capacitor which is a mirror image of its associated second capacitor along the horizontal plane.

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