公开(公告)号：US20140247188A1

公开(公告)日：2014-09-04

申请号：US14278080

申请日：2014-05-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shinichi NAKANO ,  Masahiro OZAWA ,  Nobuhito TSUBAKI

IPC: H01Q1/24

CPC classification number: H01Q1/243 ,  H01Q1/241 ,  H01Q1/36 ,  H01Q1/50 ,  H01Q13/10 ,  H04B5/0031 ,  H04M1/0202

Abstract: An antenna device includes a casing including a metal casing portion and a feed coil. The metal casing portion includes a main surface, a side surface connected to the main surfaces, and a notch portion located in the side surface. The feed coil is disposed inside the casing to be coupled with the metal casing portion by a magnetic field, and includes a winding central portion forming a coil opening portion. The feed coil is disposed near the notch portion, with the coil opening portion directed to a region including the notch portion.

Abstract translation: 天线装置包括：壳体，包括金属壳体部分和馈送线圈。 金属外壳部分包括主表面，连接到主表面的侧表面和位于侧表面中的切口部分。 馈电线圈设置在壳体内部以通过磁场与金属壳体部分耦合，并且包括形成线圈开口部分的绕组中心部分。 馈送线圈设置在切口部分附近，线圈开口部分指向包括切口部分的区域。

公开(公告)号：US20140035793A1

公开(公告)日：2014-02-06

申请号：US14056011

申请日：2013-10-17

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Noboru KATO ,  Masahiro OZAWA

IPC: H01Q21/24

CPC classification number: H01Q21/24 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q7/06

Abstract: An antenna device includes a body and first and second coil antennas. Each coil conductor of the first and second coil antennas is provided at least one of inside and on a surface of the body. The first coil antenna includes a winding axis intersecting at least one side surface of the body. The second coil antenna includes a winding axis intersecting first and second main surfaces of the body.

Abstract translation: 天线装置包括主体和第一和第二线圈天线。 第一和第二线圈天线的每个线圈导体设置在主体的内部和表面中的至少一个上。 第一线圈天线包括与主体的至少一个侧表面相交的绕线轴线。 第二线圈天线包括与主体的第一主表面和第二主表面相交的卷绕轴线。

公开(公告)号：US20140003011A1

公开(公告)日：2014-01-02

申请号：US14021103

申请日：2013-09-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Noboru KATO ,  Masahiro OZAWA

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/18

CPC classification number: H05K1/0271 ,  H01L23/49822 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/186 ,  H05K1/188 ,  H05K3/4617 ,  H05K3/4632 ,  H05K3/4635 ,  H05K3/4644 ,  H05K2201/0141 ,  H05K2201/09781 ,  H05K2201/10674 ,  Y10T29/4913 ,  Y10T29/49139

Abstract: An electric element-embedded multilayer substrate, which is a multilayer substrate including an electric element embedded therein and a plurality of base material layers having flexibility, the electric element including a main surface and being embedded in the multilayer substrate to be sandwiched between the base material layers, and a slide member provided between the main surface of the electric element and the base material layer.

Abstract translation: 一种电气元件嵌入式多层基板，其是包含嵌入其中的电气元件的多层基板和具有柔性的多个基材层，所述电气元件包括主表面并嵌入在所述多层基板中以被夹在所述基材 以及设置在电气元件的主表面和基材层之间的滑动构件。