Abstract:
A transmission line includes an insulator as a base member, a transmission conductor, and a ground layer. A connector is provided at a wiring substrate to fix the transmission line. The transmission line includes a signal columnar conductor having a solid columnar shape integrated with the transmission conductor, and ground columnar conductors having solid columnar shapes integrated with the ground layer. The connector has a through hole corresponding to the signal columnar conductor, and through holes corresponding to the ground columnar conductors. Conductive films are respectively provided on the inner peripheral surfaces of the through holes. The signal columnar conductor is inserted into the through hole, and the ground columnar conductors are respectively inserted into the through holes.
Abstract:
A communication terminal includes a close-proximity communication coil, a power transmission coil, and a metal plate. The close-proximity communication coil is configured to be used in a close-proximity communication system. The power transmission coil is configured to be used in a contactless power transmission system. At least a portion of the metal plate is disposed between the close-proximity communication coil and the power transmission coil. The close-proximity communication coil and the power transmission coil are disposed in non-overlapping locations when viewed from a direction perpendicular or substantially perpendicular to a main surface of the metal plate. At least one of the close-proximity communication coil and the power transmission coil electromagnetically couples with the metal plate.
Abstract:
A laminate body includes a plurality of dielectric sheets laminated together. A first ground conductor is provided in or on the laminate body. A second ground conductor is provided in or on the laminate body and located on a different layer from the first ground conductor. A signal line is provided between the ground conductors and with respect to a direction of lamination. A signal line is provided between the ground conductors and with respect to the direction of lamination and located closer to the second ground conductor than the signal line is, and the signal line has a portion extending along the signal line in a parallel-lines area when viewed from the direction of lamination. The first ground conductor has openings in the parallel-lines area, and the openings are arranged over the signal line when viewed from the direction of lamination.
Abstract:
A dielectric element assembly includes a plurality of stacked dielectric sheets. A signal line is provided in or on the dielectric element assembly. A ground conductor is provided in or on the dielectric element assembly on the negative direction side of a z-axis direction relative to the signal line and is arranged so as to oppose the signal line via the dielectric sheets. The ground conductor includes a main body portion and protruding portions. The main body portion extends along the signal line on one side of a direction perpendicular or substantially perpendicular to the signal line relative to the signal line when viewed in plan from the z-axis direction. The protruding portions protrude from the main body portion toward the signal line and overlap the signal line when viewed in plan from the z-axis direction.
Abstract:
A circuit substrate capable of reducing and preventing deviations of circuit characteristics includes a relatively hard region and a relatively soft region. A main body of the circuit substrate includes a stack of a plurality of flexible sheets made of a flexible material and includes rigid regions and a flexible region, the flexible region being more easily deformable than the rigid regions. Wiring conductors are disposed in the main body and define circuitry. Reinforcing insulative films are disposed so as to cover the portions where the wiring conductors are not disposed in the rigid regions on the flexible sheets when seen in plan view from the z-axis direction.
Abstract:
An antenna device includes a casing including a metal casing portion and a feed coil. The metal casing portion includes a main surface, a side surface connected to the main surfaces, and a notch portion located in the side surface. The feed coil is disposed inside the casing to be coupled with the metal casing portion by a magnetic field, and includes a winding central portion forming a coil opening portion. The feed coil is disposed near the notch portion, with the coil opening portion directed to a region including the notch portion.
Abstract:
A transmission line includes an insulator as a base member, a transmission conductor, and a ground layer. A connector is provided at a wiring substrate to fix the transmission line. The transmission line includes a signal columnar conductor having a solid columnar shape integrated with the transmission conductor, and ground columnar conductors having solid columnar shapes integrated with the ground layer. The connector has a through hole corresponding to the signal columnar conductor, and through holes corresponding to the ground columnar conductors. Conductive films are respectively provided on the inner peripheral surfaces of the through holes. The signal columnar conductor is inserted into the through hole, and the ground columnar conductors are respectively inserted into the through holes.
Abstract:
A high-frequency signal transmission line includes a dielectric body including a stack of a plurality of dielectric layers, a linear signal line located in the dielectric body, a first ground conductor located at a first side of the signal line in a stacking direction and including a plurality of first openings arranged along the signal line, and a plurality of floating conductors located at the first side of the signal line in the stacking direction to overlap with the first openings, when viewed from the stacking direction, each of the floating conductors being not connected to any other conductors.
Abstract:
A wireless IC device that improves radiation gain without increasing substrate size and easily adjusts impedance, includes a multilayer substrate including laminated base layers. On a side of an upper or first main surface of the multilayer substrate, a wireless IC element is arranged to process a high-frequency signal. On a side of a lower or second main surface of the multilayer substrate, a first radiator is provided and is coupled to the wireless IC element via a feeding circuit including first interlayer conductors. On the side of the first main surface, a second radiator is provided and is coupled to the first radiator via second interlayer conductors.
Abstract:
An electronic apparatus includes a spiral coil conductor shared by a first non-contact transfer system and a second non-contact transfer system. In the electronic apparatus, a coil antenna includes an inner coil and an outer coil connected in series with each other. The coil antenna includes opposite ends connected to a first system circuit. The inner coil includes opposite ends connected to the outer coil. The outer coil defines and functions as a booster coupled to the inner coil via an electromagnetic field.