公开(公告)号：US20220311465A1

公开(公告)日：2022-09-29

申请号：US17838454

申请日：2022-06-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takashi WATANABE

IPC: H04B1/16 ,  H03H7/38 ,  H03H9/64 ,  H03H9/72 ,  H03H11/36

Abstract: A radio-frequency module includes a first terminal, a second terminal, a first switch including a first switch terminal connected to the first terminal and a second switch terminal connectable to the first switch terminal, a second switch including a third switch terminal connectable to the second terminal, a first filter connected between the second switch terminal and the third switch terminal, and a substrate. The first switch and the second switch are included in a single semiconductor chip. The first filter and the semiconductor chip are on the substrate. In a plan view of the substrate, a first distance between the third switch terminal and the first switch terminal or a second distance between the third switch terminal and the second switch terminal is greater than a third distance between the first switch terminal and the second switch terminal.

公开(公告)号：US20220200641A1

公开(公告)日：2022-06-23

申请号：US17457699

申请日：2021-12-06

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takashi WATANABE

IPC: H04B1/00 ,  H04B1/16 ,  H04B1/04

Abstract: A radio-frequency module includes a module substrate having a major surface on which a ground electrode pattern is formed and an integrated circuit disposed on the major surface of the module substrate. The integrated circuit includes a control/power supply circuit having at least one of a control circuit and a power supply circuit and a second electrical circuit having at least one of an amplifier, a switch, and a filter. In plan view, the ground electrode pattern overlaps at least a part of the control/power supply circuit and does not overlap at least a part of the second electrical circuit.

公开(公告)号：US20220060201A1

公开(公告)日：2022-02-24

申请号：US17453749

申请日：2021-11-05

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takashi WATANABE

IPC: H04B1/04 ,  H03F3/195 ,  H03F3/24 ,  H04B1/00

Abstract: A radio frequency module has a substrate, a first chip inductor, an integrated circuit, and a first amplifier connected to the first chip inductor. The first chip inductor is on a first main surface of the substrate and the integrated circuit is on a second main surface of the substrate, the second main surface being opposite the first main surface. The integrated circuit includes the first amplifier. When the substrate is viewed from a direction perpendicular to the first main surface of the substrate, the first chip inductor at least partially overlaps the integrated circuit.

公开(公告)号：US20150026972A1

公开(公告)日：2015-01-29

申请号：US14332652

申请日：2014-07-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuto OGAWA ,  Takashi WATANABE ,  Junya SHIMAKAWA ,  Mitsuhide KATO

IPC: H05K3/30

CPC classification number: H05K3/0052 ,  H01G2/065 ,  H05K1/141 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/0909 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/10636 ,  H05K2203/0191 ,  H05K2203/1563 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal including a substrate body with first and second principal surfaces opposite to each other and an electrode configured to be connected to the device on the first principal surface, wherein the device is disposed on the first principal surface, includes forming grooves in a substrate from one of the first and second principal surfaces of the substrate such that the substrate is divided into the substrate-type terminals, the grooves each having a depth less than a thickness of the substrate, cutting the substrate from another principal surface opposite to the principal surface of the substrate body such that the grooves penetrate through the substrate in a thickness direction thereof, and mounting the device on each of the first principal surfaces.

Abstract translation: 一种电子部件的制造方法，其特征在于，具有基板型端子和与所述基板型端子连接的装置，所述基板型端子包括基板主体，所述基板主体具有彼此相对的第一和第二主要表面;以及电极，被配置为在所述第一 主要表面，其中所述装置设置在所述第一主表面上，包括在所述基板的所述第一和第二主表面中的一个的基板中形成凹槽，使得所述基板被划分为所述基板型端子，所述凹槽各自具有 深度小于基板的厚度，从与基板主体的主表面相反的另一主表面切割基板，使得凹槽在其厚度方向上穿过基板，并将该装置安装在每个第一主表面上 。